Untuk Kegunaan UKM sahaja
For UKM use only
Kim S Siow ialah Profesor Madya/ Felo Penyelidik di IMEN (2013-sekarang). Bidang penyelidikan beliau adalah berkaitan dengan modifikasi permukaan plasma, pensinteran logam nanopartikel (perak dan tembaga), dan inovasi paten TRIZ. Beliau juga pernah bekerja sebagai jurutera bahan di Infineon Technologies , ON Semiconductor dan Universiti Kebangsaan Singapura (NUS), di samping mengurus teknologi di pusat pemindahan teknologi A*STAR Singapura.
A/Prof Dr Kim S Siow (LLM) is an Associate Professor/ Senior Research Fellow at IMEN . His multi-disciplinary research interests are related to plasma surface modification, sintered metal (silver and copper) bonding, and TRIZ-patent innovation. In addition, he has worked as materials engineer in Infineon Technologies , ON Semiconductor and National University of Singapore, besides working in technology transfer officer at A*STAR Singapore.
| Materials Engineer , Doktor Falsafah , Universiti of South Australia , 2007 |
| Material Engineering , Sarjana , Nanyang Technology University , 1999 |
| Sarjana , university of turin , 2018 |
| Material Enginnering , Sarjana Muda , Nanyang Technology University , 1997 |
| PURE AND APPLIED SCIENCES - MATERIALS SCIENCE (Nanotechnology Biomaterials Plasma Treatment/Polymerization) |
| ARTS AND APPLIED ARTS - POLICIES AND LAW (patent law) |
| PURE AND APPLIED SCIENCES - MATERIALS SCIENCE (soldering and sintering (\"low\" temperature metallic bonding for high temperature application in power module and EV)) |
| PURE AND APPLIED SCIENCES - MATERIALS SCIENCE (plasma modification) |
| Kim S. Siow; Wen Shi; Behnam Akhavan. (2024). Editorial: Industrialization And Commercialization In Tissue Engineering And Regenerative Medicine: 2022/2023. - Frontiers In Bioengineering And Biotechnology. 1-2. |
| Naeem Ahmed, Asad Masood, Rubab Mumtaz, M. F. Mohd Razip Wee, Kok Meng Chan, Anuttam Patra; Kim S. Siow. (2024). Quad-atmospheric Pressure Plasma Jet (q-appj) Treatment Of Chilli Seeds To Stimulate Germination. - Plasma Chemistry And Plasma Processing. 509-522. |
| Xu Long, Ying Guo, Yutai Su, Kim S. Siow, Chuantong Chen. (2023). A New Unified Creep-plasticity Constitutive Model Coupled With Damage For Viscoplastic Materials Subjected To Fatigue Loading. - Fatigue & Fracture Of Engineering Materials & Structures. 1413-1425. |
| Doyeop Namgoong; Kim S. Siow; Jong Hyun Lee. (2023). Improvement Of Bondability By Addition Of Carboxylic Acid To The Sinter Bonding Paste Containing Bimodal Sized Cu Particles And Rapid Bonding In Air. - Metals And Materials International. 457-466. |
| Xu Long, Ying Guo, Yutai Su, Kim S. Siow, Chuantong Chen. (2023). Unveiling The Damage Evolution Of Sac305 During Fatigue By Entropy Generation. - International Journal Of Mechanical Sciencess. 1-12. |
| Naeem Ahmed; Kim S. Siow; M. F. Mohd Razipwee; Anuttam Patra. (2023). A Study To Examine The Ageing Behaviour Of Cold Plasma-treated Agricultural Seeds. - Scientific Report. 1-12. |
| Asad Masood, Naeem Ahmed, Fatima Shahid, M. F. Mohd Razip Wee, Anuttam Patra, Kim S. Siow. (2023). Atmospheric Pressure Plasma Polymerization Of Carvone: A Promising Approach For Antimicrobial Coatings. - Coatings. 1-22. |
| Ibrahim N. Amirrah, Izzat Zulkiflee, M. F. Mohd Razip Wee, Asad Masood, Kim S. Siow, Antonella Motta And Mh Busra Fauzi. (2023). Plasma-polymerised Antibacterial Coating Of Ovine Tendon Collagen Type I (otc) Crosslinked With Genipin (gnp) And Dehydrothermal-crosslinked (dht) As A Cutaneous Substitute For Wound Healing. - Materials. 1-26. |
| Doyeop Namgoong, Yeongjung Kim, Kim S. Siow, Jong-hyun Lee. (2023). Superior Sinterability Of Copper Oxalate-coated Cu Particles In A Double Reductant System And Rapid Compression Sinter-bonding Characteristics Between Cu Finishes. - Journal Of Materials Research And Technology-jmr&t. 2332-2345. |
| Asad Masood, Naeem Ahmed, M. F. Mohd Razip Wee, Anuttam Patra, Ebrahim Mahmoudi, Kim S. Siow. (2023). Atmospheric Pressure Plasma Polymerisation Of D-limonene And Its Antimicrobial Activity. - Polymers (mdpi). 1-15. |
| Naeem Ahmed, Muhammad Shahid, Kim S Siow, M F Mohd Razip Wee, Farah Farhanah Haron, Anuttam Patra, Shazrul Fazry. (2022). Germination And Growth Improvement Of Papaya Utilizing Oxygen (o2) Plasma Treatment. - J Physic D Appl Phys. 1-11. |
| Xu Long, Tianxiong Su, Zubin Chen, Yutai Su, Kim S. Siow. (2022). Tunable Coefficient Of Thermal Expansion Of Composite Materials For Thin-film Coatings. - Coatings. 1-17. |
| Naeem Ahmed, Asad Masood, Kim S. Siow, M. F. Mohd Razip Wee, Farah Farhanah Haron, Anuttam Patra, Nafarizal Nayan & Chin Fhong Soon. (2022). Effects Of Oxygen (o2) Plasma Treatment In Promoting The Germination And Growth Of Chili. - Plasma Chem Plasma Processing. 91-108. |
| Chen Tiam Foo, Siow Kim Shyong. (2021). Comparing The Mechanical And Thermal-electrical Properties Of Sintered Copper (cu) And Sintered Silver (ag) Joints. - Journal Of Alloys And Compounds. 1-19. |
| Akmal Suhaimi, Ebrahim Mahmoudi, Rhonira Latif, Kim S. Siow, M. Hazani M. Zaid, Abdul Wahab Mohammad, M.f. Mohd Razip Wee. (2021). Superhydrophilic Organosilicon Plasma Modification On Pes Membrane For Organic Dyes Filtration. - Journal Of Water Process Engineering. 102-352. |
| Naeem Ahmed , Asad Masood , Kim S. Siow , M. F. Mohd Razipwee , R.z. Auliya, W. K. Ho. (2021). Effect Of H2o-based Low-pressure Plasma (lpp) Treatment On The Germination Of Bambara Groundnut Seeds. - Agronomy. 1-16. |
| A. Suhaimi , E. Mahmoudi, K. S. Siow, A. W. Mohammad, M. F. Mohd Razip Wee. (2021). Nitrogen Incorporation By Plasma Polymerization Of Heptylamine On Pes Membrane For Removal Of Anionic Dye (congo Red). - International Journal Of Environmental Science And Technology. 1443-1452. |
| Kim S. Siow, Arifah Syahirah Abdul Rahman, Pei Yuen Ng, Burhanuddin Y. Majlis. (2020). Sulfur And Nitrogen Containing Plasma Polymers Reduces Bacterial Attachment And Growth. - Materials Science And Engineering C. 11022-11026. |
| Nur Aizat Kamarulzaman, Khai Ern Lee, Kim Shyong Siow, Mazlin Mokhtar. (2020). Public Benefit And Risk Perceptions Of Nanotechnology Development: Psychological And Sociological Aspects. - Technology In Society. 1-9. |
| Siow K.s., Chua S.t.. (2020). Thermal Ageing Studies Of Sintered Micron-silver (ag) Joint As A Lead-free Bonding Material. - Metals And Materials International. 1404-1414. |
| Mohd Syafiq Faiz, Mahmoud Addouche, Ahmad Rifqi Md Zain,kim S. Siow, Amar Chaalane, Abdelkrim Khelif. (2020). Experimental Demonstration Of A Multichannel Elastic Wave Filter In A Phononic Crystal Slab. - Applied Sciences. 1-11. |
| Siow, K.s., Chua, S.t., Beake, B.d., Zuruzi, A.s.. (2019). Influence Of Sintering Environment On Silver Sintered On Copper Substrate. - Journal Of Materials Science: Electronic Materials. . |
| Siow Ks, Chua St. (2019). Thermal Cycling Of Sintered Silver (ag) Joint As Die-attach Material. - Jom. 3066-3075. |
| Kim S.siow, Leanne Britcher, Sunil Kumar, Hans J.griesser. (2019). Qcm-d And Xps Study Of Protein Adsorption On Plasma Polymers With Sulfonate And Phosphonate Surface Groups. - Colloids And Surfaces B: Biointerfaces. . |
| Nur Aizat Kamarulzaman, Khai Ern Lee, Kim Shyong Siow, Mazlin Mokhtar. (2019). Psychological And Sociological Perspectives For Good Governance Of Sustainable Nanotechnology Development In Malaysia. - Journal Of Nanoparticle Research. 1-21. |
| Yijing Xie, Yanjie Wang, Yunhui Mei, Haining Xie, Kun Zhang, Shuangtao Feng, Kim S Siow, Xin Li, Guo-quan Lu,. (2018). Rapid Sintering Of Nano-ag Paste At Low Current To Bond Large Area (> 100 Mm2) Power Chips For Electronics Packaging. - Journal Of Materials Processing Technology. 644-649. |
| Kim S. Siow. (2018). Low Pressure Plasma Modifications For The Generation Of Hydrophobic Coatings For Biomaterials Applications. - Plasma Processes And Polymers. . |
| Tiam Foo Chen, Kim Shyong Siow, Pei Yuen Ng, Burhanuddin Yeop Majlis. (2017). Enhancing The Biocompatibility Of The Polyurethane Methacrylate And Off-stoichiometry Thiol-ene Polymers By Argon And Nitrogenplasma Treatment. - Materials Science And Engineering C. 613-621. |
| D Wang, Yh Mei, H Xie, K Zhang, Ks Siow, X Li, Gq Lu,. (2017). Roles Of Palladium Particles In Enhancing The Electrochemical Migration Resistance Of Sintered Nano-silver Paste As A Bonding Material. - Materials Letters. 1-4. |
| Kim S Siow, Leanne Britcher, Sunil Kumar, Hans Griesser. (2017). Plasma Polymers Containing Sulfur And Their Co-polymers With 1,7-octadiene: Chemical And Structural Analysis. - Plasma Processes And Polymers. 16000-16004. |
| St Chua, Ks Siow. (2016). Microstructural Studies And Bonding Strength Of Pressureless Sintered Nano-silver Joints On Silver, Direct Bond Copper (dbc) And Copper Substrates Aged At 300 c. - Journal Of Alloys And Compounds. 486-498. |
| Tf Chen, K S Siow, Py Ng, Mh Nai, Ct Lim And By Majlis. (2016). Ageing Properties Of Polyurethane Methacrylate And Off-stoichiometry Thiol-ene Polymers After Nitrogen And Argon Plasma Treatment. - Journal Of Applied Polymer Science. 1-12. |
| Abu Samah Zuruzi, Kim S Siow. (2015). Electrical Conductivity Of Porous Silver Made From Silver Nanoparticles. - Electronic Materials Letter. 315-321. |
| Kim S Siow, Sunil Kumar And Hans Griesser. (2015). Low Pressure Plasma Methods For Generating Non Reactive Hydrophilic And Hydrogel Like Bio Interface Coatings A Review. - Plasma Processes And Polymers. 8. |
| Kim S Siow,. (2014). Deposition And Xps And Ftir Analysis Of Plasma Polymer Coatings Containing Phosphorus. - Plasma Processes And Polymers. 11(2):133-141. |
| Kim S Siow. (2014). Are Sintered Silver Joints Ready For Use As Interconnect Material In Microelectronic Packaging?. - Journal Of Electronic Materials. 43(4):947-961. |
| Asad Masood, Naeem Ahmed, Mohd Farhanulhakim Mohd Razip Wee, Muhammad Aniq Shazni Mohammad Haniff, Ebrahim Mahmoudi, Anuttam Patra, Kim S Siow. (2023). Pulsed Plasma Polymerisation Of Carvone: Characterisations And Antibacterial Properties. - Surface Innovations. 339-351. |
| Xu Long, Ying Guo, Yutai Su, Kim S. Siow, Chuantong Chen. (2022). Constitutive Creep And Fatigue Behavior Of Sintered Ag For Finite Element Simulation Of Mechanical Reliability A Critical Review. - Journal Of Materials Science-materials In Electronics. 2293-2309. |
| Yanliang Shan, Yunhui Mei,, Meiyu Wang, Xin Li, Yanhong Tian, Gang Chen, Siow Kim Shyong. (2021). Ratcheting Behavior Of Sintered Copper Joints For Electronic Packaging. - Ieee Transactions On Components, Packaging And Manufacturing Technology. 983-989. |
| Siow Kim Shyong, Arifah Rahman, Amnani Aminuddin, Pei Yuen Ng. (2021). Effect Of Sulfur On Nitrogen Containing Plasma Polymers In Promoting Osteogenic Differentiation Of Wharton Jelly Mesenchymal Stem Cells. - Sains Malaysiana. 3499-3510. |
| A. Suhaimi, E. Mahmoudi, K.s. Siow, M.f. Mohd Razip Wee. (2020). Surface Modification Of Polyamide Ultrafiltration Membrane By Plasma Polymerisation Of Acrylic Acid. - Sains Malaysiana. 3097-3104. |
| Rabiah Al Adawiyah Ab Rahim, Muhammad Nubli Zulkifli, Azman Jalar, Atiqah Mohd Afdzaluddin, Kim Siow Shyong. (2020). Effect Of Isothermal Aging And Copper Substrate Roughness On The Sac305 Solder Joint Intermetallic Layer Growth Of High Temperature Storage (hts). - Sains Malaysiana. 3045-3054. |
| Muhammad Izzuddin Abd Samad, Muhamad Ramdzan Buyong, Shyong Siow Kim, Burhanuddin Yeop Majlis. (2019). Dielectrophoresis Velocities Response On Tapered Electrode Profile: Simulation And Experimental. - Microelectronics International. 45-53. |
| B. Meyghani, M. Awang, P. Bokam, B. Plank, C. Heinzl, K. S. Siow. (2019). Finite Element Modeling Of Nano Porous Sintered Silver Material Using Computed Tomography Images. - Material Science And Engineering Technology. 533-538. |
| Meyghani B, Awang M, Emamian S, Plank B, Christoph H, Siow Ks,. (2019). Stress Analysis Of Nano Porous Material Using Computed Tomography Images. - Materialwissenschaft Und Werkstofftechnik. . |
| Kim S. Siow, Leanne Britcher, Sunil Kumar, Hans J Griesser. (2018). Xps Study Of Sulfur And Phosphorus Compounds With Different Oxidation States. - Sains Malaysiana. . |
| Mohd Amir Zulkefli, Mohd Ambri Mohamed, Kim S. Siow, Burhanuddin Yeop Majlis, Jothiramalingam Kulothungan, Manoharan Muruganathan, Hiroshi Mizuta. (2018). Stress Analysis Of Perforated Graphene Nano-electro-mechanical (nem) Contact Switches By 3d Finite Element Simulation. - Microsystem Technologies. 1179-1187. |
| Mohd Amir Zulkefli, Mohd Ambri Mohamed, Kim S. Siow, Burhanuddin Yeop Majlis. (2018). Peranti Suis Sistem Nanoelektromekanik (nems) Berunsurkan Grafin Dan Tiub Nano Karbon (cnt). - Sains Malaysiana. 619-633. |
| Mohd Amir Zulkefli, Mohd Ambri Mohamed, K. S. Siow, Burhanuddin Yeop Majlis, Jothiramalingam Kulothungan, Manoharan Murugunathan, Hiroshi Mizuta. (2017). Three-dimensional Finite Element Method Simulation Of Perforated Graphene Nano-electro-mechanical (nem) Switches. - Micromachines. 1-16. |
| Kim Siow. (2017). Pengelupasan Grafit Untuk Mengkomersilkan Teknologi Grafin. - Sains Malaysiana. 1047-1059. |
| Siow Ks. (2017). Pengelupasan Grafit Untuk Mengkomersilkan Teknologi Grafin. - Sains Malaysiana. 1047-1059. |
| Chan Yw, Siow Ks, Ng Py, U Gires, Burhanuddin Ym. (2016). Plasma Polymerized Carvone As An Antibacterial And Biocompatible Coating. - Materials Science And Engineering C. 861-871. |
| Kim S Siow, Y T Lin. (2016). Identifying The Development State Of Sintered Silver (ag) As A Bonding Material In The Microelectronic Packaging Via A Patent Landscape Study. - Journal Of Electronic Packaging. 1-13. |
| Razip Wee, M.f.m, Addouche M., Siow, K.s., Md Zain, A.r., Elayouch, A., Chollet, F., Khelif, A.. (2016). Guiding And Confinement Of Interface Acoustic Waves In Solid-fluid Pillar-based Phononic Crystals. - Aip Advances. 121-703. |
| Kim S. Siow; Wen Shi; Behnam Akhavan. (2024). Editorial: Industrialization And Commercialization In Tissue Engineering And Regenerative Medicine: 2022/2023. - Frontiers In Bioengineering And Biotechnology. 1-2. |
| Naeem Ahmed, Asad Masood, Rubab Mumtaz, M. F. Mohd Razip Wee, Kok Meng Chan, Anuttam Patra; Kim S. Siow. (2024). Quad-atmospheric Pressure Plasma Jet (q-appj) Treatment Of Chilli Seeds To Stimulate Germination. - Plasma Chemistry And Plasma Processing. 509-522. |
| Asad Masood, Naeem Ahmed, M. F. Mohd Razip Wee, Anuttam Patra, Ebrahim Mahmoudi, Kim S. Siow. (2023). Atmospheric Pressure Plasma Polymerisation Of D-limonene And Its Antimicrobial Activity. - Polymers (mdpi). 1-15. |
| Xu Long, Ying Guo, Yutai Su, Kim S. Siow, Chuantong Chen. (2023). A New Unified Creep-plasticity Constitutive Model Coupled With Damage For Viscoplastic Materials Subjected To Fatigue Loading. - Fatigue & Fracture Of Engineering Materials & Structures. 1413-1425. |
| Doyeop Namgoong; Kim S. Siow; Jong Hyun Lee. (2023). Improvement Of Bondability By Addition Of Carboxylic Acid To The Sinter Bonding Paste Containing Bimodal Sized Cu Particles And Rapid Bonding In Air. - Metals And Materials International. 457-466. |
| Xu Long, Ying Guo, Yutai Su, Kim S. Siow, Chuantong Chen. (2023). Unveiling The Damage Evolution Of Sac305 During Fatigue By Entropy Generation. - International Journal Of Mechanical Sciencess. 1-12. |
| Naeem Ahmed; Kim S. Siow; M. F. Mohd Razipwee; Anuttam Patra. (2023). A Study To Examine The Ageing Behaviour Of Cold Plasma-treated Agricultural Seeds. - Scientific Report. 1-12. |
| Naeem Ahmed, Akmal Suhaimi , Asad Masood , Ebrahim Mahmoudi , Kim S. Siow, M.f. Mohd Razip Wee. (2023). Antimicrobial Property Of Polyethersulfone (pes) Membrane By Plasma Copolymerization Of Teos And Oxazoline For Organic Dyes Filtration. - Results In Engineering. 1-11. |
| Asad Masood, Naeem Ahmed, Mohd Farhanulhakim Mohd Razip Wee, Muhammad Aniq Shazni Mohammad Haniff, Ebrahim Mahmoudi, Anuttam Patra, Kim S Siow. (2023). Pulsed Plasma Polymerisation Of Carvone: Characterisations And Antibacterial Properties. - Surface Innovations. 339-351. |
| Asad Masood, Naeem Ahmed, Fatima Shahid, M. F. Mohd Razip Wee, Anuttam Patra, Kim S. Siow. (2023). Atmospheric Pressure Plasma Polymerization Of Carvone: A Promising Approach For Antimicrobial Coatings. - Coatings. 1-22. |
| Ibrahim N. Amirrah, Izzat Zulkiflee, M. F. Mohd Razip Wee, Asad Masood, Kim S. Siow, Antonella Motta And Mh Busra Fauzi. (2023). Plasma-polymerised Antibacterial Coating Of Ovine Tendon Collagen Type I (otc) Crosslinked With Genipin (gnp) And Dehydrothermal-crosslinked (dht) As A Cutaneous Substitute For Wound Healing. - Materials. 1-26. |
| Doyeop Namgoong, Yeongjung Kim, Kim S. Siow, Jong-hyun Lee. (2023). Superior Sinterability Of Copper Oxalate-coated Cu Particles In A Double Reductant System And Rapid Compression Sinter-bonding Characteristics Between Cu Finishes. - Journal Of Materials Research And Technology-jmr&t. 2332-2345. |
| Naeem Ahmed, Muhammad Shahid, Kim S Siow, M F Mohd Razip Wee, Farah Farhanah Haron, Anuttam Patra, Shazrul Fazry. (2022). Germination And Growth Improvement Of Papaya Utilizing Oxygen (o2) Plasma Treatment. - J Physic D Appl Phys. 1-11. |
| Xu Long, Tianxiong Su, Zubin Chen, Yutai Su, Kim S. Siow. (2022). Tunable Coefficient Of Thermal Expansion Of Composite Materials For Thin-film Coatings. - Coatings. 1-17. |
| Naeem Ahmed, Asad Masood, Kim S. Siow, M. F. Mohd Razip Wee, Farah Farhanah Haron, Anuttam Patra, Nafarizal Nayan & Chin Fhong Soon. (2022). Effects Of Oxygen (o2) Plasma Treatment In Promoting The Germination And Growth Of Chili. - Plasma Chem Plasma Processing. 91-108. |
| Xu Long, Ying Guo, Yutai Su, Kim S. Siow, Chuantong Chen. (2022). Constitutive Creep And Fatigue Behavior Of Sintered Ag For Finite Element Simulation Of Mechanical Reliability A Critical Review. - Journal Of Materials Science-materials In Electronics. 2293-2309. |
| Yanliang Shan, Yunhui Mei,, Meiyu Wang, Xin Li, Yanhong Tian, Gang Chen, Siow Kim Shyong. (2021). Ratcheting Behavior Of Sintered Copper Joints For Electronic Packaging. - Ieee Transactions On Components, Packaging And Manufacturing Technology. 983-989. |
| Chen Tiam Foo, Siow Kim Shyong. (2021). Comparing The Mechanical And Thermal-electrical Properties Of Sintered Copper (cu) And Sintered Silver (ag) Joints. - Journal Of Alloys And Compounds. 1-19. |
| A. Suhaimi , E. Mahmoudi, K. S. Siow, A. W. Mohammad, M. F. Mohd Razip Wee. (2021). Nitrogen Incorporation By Plasma Polymerization Of Heptylamine On Pes Membrane For Removal Of Anionic Dye (congo Red). - International Journal Of Environmental Science And Technology. 1443-1452. |
| Naeem Ahmed , Asad Masood , Kim S. Siow , M. F. Mohd Razipwee , R.z. Auliya, W. K. Ho. (2021). Effect Of H2o-based Low-pressure Plasma (lpp) Treatment On The Germination Of Bambara Groundnut Seeds. - Agronomy. 1-16. |
| Siow Kim Shyong, Arifah Rahman, Amnani Aminuddin, Pei Yuen Ng. (2021). Effect Of Sulfur On Nitrogen Containing Plasma Polymers In Promoting Osteogenic Differentiation Of Wharton Jelly Mesenchymal Stem Cells. - Sains Malaysiana. 3499-3510. |
| Akmal Suhaimi, Ebrahim Mahmoudi, Rhonira Latif, Kim S. Siow, M. Hazani M. Zaid, Abdul Wahab Mohammad, M.f. Mohd Razip Wee. (2021). Superhydrophilic Organosilicon Plasma Modification On Pes Membrane For Organic Dyes Filtration. - Journal Of Water Process Engineering. 102-352. |
| Esa Sr, Omar G, Sheikh Md Fadzullah Sh, Siow Ks, Abdul Rahim B. (2021). The Evolutions Of Microstructure In Pressureless Sintered Silver Die Attach Material. - International Journal Of Nanoelectronics And Materials. 179-194. |
| Mohd Syafiq Faiz, Kim S. Siow, Mf Mohd Razip Wee, Muhammad Musoddiq Jaafar, Burhanuddin Yeop Majlis, Ahmad Rifqi Md. Zain. (2020). Theoretical Demonstration Of Elastic Wave Guiding In A Pillar-based Phononic Crystal Slab. - International Journal Of Nanoelectronics And Materials. 83-90. |
| A. Suhaimi, E. Mahmoudi, K.s. Siow, M.f. Mohd Razip Wee. (2020). Surface Modification Of Polyamide Ultrafiltration Membrane By Plasma Polymerisation Of Acrylic Acid. - Sains Malaysiana. 3097-3104. |
| Rabiah Al Adawiyah Ab Rahim, Muhammad Nubli Zulkifli, Azman Jalar, Atiqah Mohd Afdzaluddin, Kim Siow Shyong. (2020). Effect Of Isothermal Aging And Copper Substrate Roughness On The Sac305 Solder Joint Intermetallic Layer Growth Of High Temperature Storage (hts). - Sains Malaysiana. 3045-3054. |
| S. R. Esa, G. Omar, S. H. Sheikh Md Fadzullah, K. S Siow, B. Abdul Rahim, B. Cosut. (2020). Diffusion Mechanism Of Silver Particles In Polymer Binder For Die Attach Interconnect Technology. - International Journal Of Nanoelectronics And Materials. 461-472. |
| Mohd Syafiq Faiz, Mahmoud Addouche, Ahmad Rifqi Md Zain,kim S. Siow, Amar Chaalane, Abdelkrim Khelif. (2020). Experimental Demonstration Of A Multichannel Elastic Wave Filter In A Phononic Crystal Slab. - Applied Sciences. 1-11. |
| Kim S. Siow, Arifah Syahirah Abdul Rahman, Pei Yuen Ng, Burhanuddin Y. Majlis. (2020). Sulfur And Nitrogen Containing Plasma Polymers Reduces Bacterial Attachment And Growth. - Materials Science And Engineering C. 11022-11026. |
| Siow K.s., Chua S.t.. (2020). Thermal Ageing Studies Of Sintered Micron-silver (ag) Joint As A Lead-free Bonding Material. - Metals And Materials International. 1404-1414. |
| Nur Aizat Kamarulzaman, Khai Ern Lee, Kim Shyong Siow, Mazlin Mokhtar. (2020). Public Benefit And Risk Perceptions Of Nanotechnology Development: Psychological And Sociological Aspects. - Technology In Society. 1-9. |
| Meyghani B, Awang M, Emamian S, Plank B, Christoph H, Siow Ks,. (2019). Stress Analysis Of Nano Porous Material Using Computed Tomography Images. - Materialwissenschaft Und Werkstofftechnik. . |
| Siow, K.s., Chua, S.t., Beake, B.d., Zuruzi, A.s.. (2019). Influence Of Sintering Environment On Silver Sintered On Copper Substrate. - Journal Of Materials Science: Electronic Materials. . |
| Siow Ks, Chua St. (2019). Thermal Cycling Of Sintered Silver (ag) Joint As Die-attach Material. - Jom. 3066-3075. |
| B. Meyghani, M. Awang, P. Bokam, B. Plank, C. Heinzl, K. S. Siow. (2019). Finite Element Modeling Of Nano Porous Sintered Silver Material Using Computed Tomography Images. - Material Science And Engineering Technology. 533-538. |
| Nur Aizat Kamarulzaman, Khai Ern Lee, Kim Shyong Siow, Mazlin Mokhtar. (2019). Psychological And Sociological Perspectives For Good Governance Of Sustainable Nanotechnology Development In Malaysia. - Journal Of Nanoparticle Research. 1-21. |
| Muhammad Izzuddin Abd Samad, Muhamad Ramdzan Buyong, Shyong Siow Kim, Burhanuddin Yeop Majlis. (2019). Dielectrophoresis Velocities Response On Tapered Electrode Profile: Simulation And Experimental. - Microelectronics International. 45-53. |
| Kim S.siow, Leanne Britcher, Sunil Kumar, Hans J.griesser. (2019). Qcm-d And Xps Study Of Protein Adsorption On Plasma Polymers With Sulfonate And Phosphonate Surface Groups. - Colloids And Surfaces B: Biointerfaces. . |
| Nur Aizat Kamarulzaman, Khai Ern Lee, Kim Shyong Siow. (2018). Public Perception Of Nanotechnology For Good Governance: A Conceptual Framework For Psychological And Sociological Approaches. - Journal Of Food, Agriculture And Environment. . |
| Kim S. Siow. (2018). Low Pressure Plasma Modifications For The Generation Of Hydrophobic Coatings For Biomaterials Applications. - Plasma Processes And Polymers. . |
| Yijing Xie, Yanjie Wang, Yunhui Mei, Haining Xie, Kun Zhang, Shuangtao Feng, Kim S Siow, Xin Li, Guo-quan Lu,. (2018). Rapid Sintering Of Nano-ag Paste At Low Current To Bond Large Area (> 100 Mm2) Power Chips For Electronics Packaging. - Journal Of Materials Processing Technology. 644-649. |
| Mohd Amir Zulkefli, Mohd Ambri Mohamed, Kim S. Siow, Burhanuddin Yeop Majlis. (2018). Peranti Suis Sistem Nanoelektromekanik (nems) Berunsurkan Grafin Dan Tiub Nano Karbon (cnt). - Sains Malaysiana. 619-633. |
| Kim S. Siow, Leanne Britcher, Sunil Kumar, Hans J Griesser. (2018). Xps Study Of Sulfur And Phosphorus Compounds With Different Oxidation States. - Sains Malaysiana. . |
| Mohd Amir Zulkefli, Mohd Ambri Mohamed, Kim S. Siow, Burhanuddin Yeop Majlis, Jothiramalingam Kulothungan, Manoharan Muruganathan, Hiroshi Mizuta. (2018). Stress Analysis Of Perforated Graphene Nano-electro-mechanical (nem) Contact Switches By 3d Finite Element Simulation. - Microsystem Technologies. 1179-1187. |
| Siow Kim Shyong, Chen Tiam Foo, Yong Zhen Xin. (2018). Triz Trends Of Engineering System Evolution Of Silver Sinter-ing Tools Used To Produce Power Module In Hybrids And Electric Vehicles. - International Journal Of Engineering & Technology. . |
| Kim S Siow, Leanne Britcher, Sunil Kumar, Hans Griesser. (2017). Plasma Polymers Containing Sulfur And Their Co-polymers With 1,7-octadiene: Chemical And Structural Analysis. - Plasma Processes And Polymers. 16000-16004. |
| Tiam Foo Chen, Kim Shyong Siow, Pei Yuen Ng, Burhanuddin Yeop Majlis. (2017). Enhancing The Biocompatibility Of The Polyurethane Methacrylate And Off-stoichiometry Thiol-ene Polymers By Argon And Nitrogenplasma Treatment. - Materials Science And Engineering C. 613-621. |
| Kim Siow. (2017). Pengelupasan Grafit Untuk Mengkomersilkan Teknologi Grafin. - Sains Malaysiana. 1047-1059. |
| Mohd Amir Zulkefli, Mohd Ambri Mohamed, K. S. Siow, Burhanuddin Yeop Majlis, Jothiramalingam Kulothungan, Manoharan Murugunathan, Hiroshi Mizuta. (2017). Three-dimensional Finite Element Method Simulation Of Perforated Graphene Nano-electro-mechanical (nem) Switches. - Micromachines. 1-16. |
| D Wang, Yh Mei, H Xie, K Zhang, Ks Siow, X Li, Gq Lu,. (2017). Roles Of Palladium Particles In Enhancing The Electrochemical Migration Resistance Of Sintered Nano-silver Paste As A Bonding Material. - Materials Letters. 1-4. |
| Siow Ks. (2017). Pengelupasan Grafit Untuk Mengkomersilkan Teknologi Grafin. - Sains Malaysiana. 1047-1059. |
| Kim S Siow, Y T Lin. (2016). Identifying The Development State Of Sintered Silver (ag) As A Bonding Material In The Microelectronic Packaging Via A Patent Landscape Study. - Journal Of Electronic Packaging. 1-13. |
| St Chua, Ks Siow. (2016). Microstructural Studies And Bonding Strength Of Pressureless Sintered Nano-silver Joints On Silver, Direct Bond Copper (dbc) And Copper Substrates Aged At 300 c. - Journal Of Alloys And Compounds. 486-498. |
| Razip Wee, M.f.m, Addouche M., Siow, K.s., Md Zain, A.r., Elayouch, A., Chollet, F., Khelif, A.. (2016). Guiding And Confinement Of Interface Acoustic Waves In Solid-fluid Pillar-based Phononic Crystals. - Aip Advances. 121-703. |
| Chan Yw, Siow Ks, Ng Py, U Gires, Burhanuddin Ym. (2016). Plasma Polymerized Carvone As An Antibacterial And Biocompatible Coating. - Materials Science And Engineering C. 861-871. |
| Tf Chen, K S Siow, Py Ng, Mh Nai, Ct Lim And By Majlis. (2016). Ageing Properties Of Polyurethane Methacrylate And Off-stoichiometry Thiol-ene Polymers After Nitrogen And Argon Plasma Treatment. - Journal Of Applied Polymer Science. 1-12. |
| Kim S Siow, Sunil Kumar And Hans Griesser. (2015). Low Pressure Plasma Methods For Generating Non Reactive Hydrophilic And Hydrogel Like Bio Interface Coatings A Review. - Plasma Processes And Polymers. 8. |
| Abu Samah Zuruzi, Kim S Siow. (2015). Electrical Conductivity Of Porous Silver Made From Silver Nanoparticles. - Electronic Materials Letter. 315-321. |
| Kim S Siow,. (2014). Deposition And Xps And Ftir Analysis Of Plasma Polymer Coatings Containing Phosphorus. - Plasma Processes And Polymers. 11(2):133-141. |
| Kim S Siow. (2014). Are Sintered Silver Joints Ready For Use As Interconnect Material In Microelectronic Packaging?. - Journal Of Electronic Materials. 43(4):947-961. |
| Naeem A, Siow Ks, Wee Mfmr, Ho Wk, Patra A.. (2022). The Hydrophilization And Subsequent Hydrophobic Recovery Mechanism Of Cold Plasma (cp) Treated Bambarra Groundnuts.. - Materials Science Forum. 161-169. |
| Xu Long, Jiaqi Zhu, Yutai Su, Kim S. Siow, Chuantong Chen. (2022). Phase-field Modelling For Crack Evolution Of Pbx Under Thermo- Mechanical Loadings. - Proceedings Of The Asme 2022 International Mechanical Engineering Congress And Exposition (imece2022). 1-7. |
| A. Atiqah, R.a.a.a. Rahim, A. Jalar, K. S. Siow. (2022). Influence Of Copper Substrate Roughness On The Growth Of Intermetallic Compounds Layer In Sac305 Solder Joints. - International Conference On Electronic And Advanced Materials (iceam 2021). 1-6. |
| Jiaqi Zhu, Yutai Su, Chen Chuantong, Kim S. Siow, Ruitao Tang, Xu Long. (2021). Porosity Effect On Fracture Behavior Of Sintered Silver Nanoparticles By Phase-field Modeling. - 2021 Ieee 23rd Electronics Packaging Technology Conference (eptc). 317-321. |
| Km Kumar, Ks Siiow, B. Beake. (2021). 3-d Finite Element Modeling Of Nanoindentation On Sn-3.5ag Lead-free Solder. - 2021 Ieee Regional Symposium On Micro And Nanoelectronics (rsm). 84-87. |
| Siow Ks, Chua St & Zuruzi As. (2018). Interfacial Tem Analysis Of Sintered Silver In Air And N2-5%h2 Gases Environment. - 38th International Electronics Manufacturing Technology Conference. . |
| Muhammad Izzuddin Abd Samad, Farahdiana Wan Yunus, Muhamad Ramdzan Buyong, Kim Shyong Siow, Azrul Azlan Hamzah & Burhanuddin Yeop Majlis. (2018). Voltage Characterization On Dielectrophoretic Force Respond To Hematologic Cell Manipulation. - 2018 Ieee International Conference On Semiconductor Electronics (icse2018). . |
| Muhammad Khairulanwar Abdul Rahim, Muhamad Ramdzan Buyong, Nur Mas Ayu Jamaludin, Azrul Azlan Hamzah, Kim Shyong Siow, Burhanuddin Yeop Majlis. (2018). Characterization Of Permittivity And Conductivity For Eskape Pathogens Detection. - 2018 Ieee International Conference On Semiconductor Electronics (icse2018). . |
| Sp Lim, B Pan, H Zhang, W Ng, B. Wu, Ks Siow, S Sabne, M. Tsuriya. (2017). High-temperature Pb-free Die Attach Material Project Phase 1: Survey Result. - International Conference On Electronic Packaging, Yamagata Japan. 51-56. |
| Siow Ks, Mérigeault E.,. (2016). Patent Landscape And Market Segments Of Sintered Silver As Die Attach Materials In Microelectronic Packaging. - 2016 Ieee 37th International Electronics Manufacturing Technology (iemt) & 18th Electronics Materials And Packaging (emap) Conference,. 77619-77625. |
| Mohd Amir Zulkefli, Mohd Ambri Mohamed, Kim S Siow, Burhanuddin Yeop Majlis. (2016). Optimization Of Beam Length And Air Gap Of Suspended Graphene Nems Switch For Low Pull-in Voltage Application. - Ieee-icse2016 Proc. 2016, Kuala Lumpur, Malaysia. 29-32. |
| Wee M.f.m.r., Siow K.s., Zain A.r.m., Addouche M., Khelif A.. (2016). Solid-fluid Interaction In A Pillar-based Phononic Crystal. - Ieee International Conference On Semiconductor Electronics, Proceedings, Icse. 47-49. |
| St Chua, Ks Siow, A. Jalar. (2015). Effect Of Sintering Atmosphere On The Shear Properties Of Pressureless Sintered Silver Joint. - 36th Ieee International Electronics Manufacturing Technology Conference. 1-6. |
| Ks Siow. (2014). Setting Up An Intellectual Properties Intermediary Services: Dmaic Way. - International Conference On Industrial Engineering And Engineering Management, Sunway Resort, Kuala Lumpur, 9-12th Dec 2014. . |
| Chua St, Siow Ks, Jalar A. (2014). Effect Of Sintering Atmosphere On The Shear Properties Of Pressureless Sintered Silver Joint. - 36th International Electronics Manufacturing Technology Conference,. . |
| Foo S.p., Siow K.s., A. Jalar. (2014). Synthesizing Snagcu Nanoparticles By Electrodeposition Of Reverse Microemulsion Electrolyte. - 2014 Ieee International Conference On Semiconductor Electronics (icse 2014). 513-516. |
| Chua Siang Tat, Siow Kim Shyong. (2022). Perak Tersinter Sebagai Bahan Pelekat Dalam Pempakejan Mikroelektronik. - . 167. |
| Nur Aizat Kamarulzaman, Khai Ern Lee, Kim Shyong Siow. (2020). Concepts And Approaches For Sustainability Management. - . 21. |
| Siow Kim Shyong. (2019). Die-attach Materials For High Temperature Applications In Microelectronics Packaging: Materials, Processes, Equipment And Reliability. - . 279. |
| Siow Kim Shyong, Vemal Raja Manikam, Chua Siang Tat. (2019). Die-attach Materials For High Temperature Applications In Microelectronics Packaging: Materials, Processes, Equipment And Reliability. - . 40. |
| Siow Kim Shyong. (2019). Die-attach Materials For High Temperature Applications In Microelectronics Packaging: Materials, Processes, Equipment And Reliability. - . 15. |
| Yunhui Mei, Wang Z, Siow Kim Shyong. (2019). Die-attach Materials For High Temperature Applications In Microelectronics Packaging: Materials, Processes, Equipment And Reliability. - . 26. |
| Arifah Rahman, M. Farhanulhakim Mohd Razip Wee, Siow Kim Shyong. (2018). Teknologi Semikonduktor Dan Nanoelektronik: Perkembangan Dan Kegunaan. - . 15. |
| Chen Tiam Foo, Chan Yuen Wah, Siow Kim Shyong. (2018). Keserasian Biologi Daripada Modifikasi Plasma. - . 102. |
| Nur Aizat Kamarulzaman, Khai Ern Lee, Kim Shyong Siow. (2020). Concepts And Approaches For Sustainability Management. - . 21. |
| Siow Kim Shyong. (2019). Die-attach Materials For High Temperature Applications In Microelectronics Packaging: Materials, Processes, Equipment And Reliability. - . 15. |
| Yunhui Mei, Wang Z, Siow Kim Shyong. (2019). Die-attach Materials For High Temperature Applications In Microelectronics Packaging: Materials, Processes, Equipment And Reliability. - . 26. |
| Siow Kim Shyong, Vemal Raja Manikam, Chua Siang Tat. (2019). Die-attach Materials For High Temperature Applications In Microelectronics Packaging: Materials, Processes, Equipment And Reliability. - . 40. |
| Arifah Rahman, M. Farhanulhakim Mohd Razip Wee, Siow Kim Shyong. (2018). Teknologi Semikonduktor Dan Nanoelektronik: Perkembangan Dan Kegunaan. - . 15. |
| Chua Siang Tat, Siow Kim Shyong. (2022). Perak Tersinter Sebagai Bahan Pelekat Dalam Pempakejan Mikroelektronik. - . 167. |
| Siow Kim Shyong. (2019). Die-attach Materials For High Temperature Applications In Microelectronics Packaging: Materials, Processes, Equipment And Reliability. - . 279. |
| Chen Tiam Foo, Chan Yuen Wah, Siow Kim Shyong. (2018). Keserasian Biologi Daripada Modifikasi Plasma. - . 102. |
| A Mackie, E Costello, Sk Bhogaraju, S Carney, S Chada, Kim Siow, G Duttt, Md Hasnine, A Kane, Jk Kennedy, J Lauffer, J Mageraa, J B Marke, R Parthasarathy, L Schneider, I Swensen, U Wetzel. (2024). Ipc Requirements For Sintering Materials For Electrical And Thermal Interconnects. - . 1-14. |
| Maria Binti Abu Bakar;azman Bin Jalar @ Jalil;siow Kim Shyong;ahmad Ghadafi Bin Ismail. (2023). Development Of High Ductility Metallurgical Interconnection In Sn-based Lead-free Solder Joint Via Superplastic-like Approach. - . . |
| Siow Kim Shyong;mohd Farhanulhakim Bin Mohd Razip Wee. (2023). Reconciling The Mechanisms Of Seed Germination And Sterilisation By Atmospheric Plasma Treatment From Bio-plasma Physics Perspective. - . . |
| Siow Kim Shyong. (2022). Patent Landscape Of Sintered Cu And Ag As Die-attach Materials In Microelectronics Packaging. - 2022 Ieee 39th International Electronics Manufacturing Technology Conference (iemt). 1-6. |
| Naeem Ahmed, Kim S. Siow, M. F. Mohd Razip Wee. (2021). Germination And Growth Enhancement Of Bambara Groundnut Utilizing Low-pressure Plasma Treatment. - Imen Student Colloquim. 1-5. |
| Mohd Farhanulhakim Bin Mohd Razip Wee;muhamad Ramdzan Bin Buyong;siow Kim Shyong;lee Khai Ern;mohd Ambri Bin Mohamed. (2021). Anti Fouling Plasma-modified Membrane Producing Potable Clean Water. - . . |
| Mohd Farhanulhakim Bin Mohd Razip Wee;burhanuddin Bin Yeop Majlis;siow Kim Shyong;ooi Poh Choon. (2021). Metallic-polymer Nanocomposite By Plasma-based Deposition Process For Two-terminal Diode Based Application. - . . |
| Siow Kim Shyong. (2021). Mampukah Rawatan Plasma Menyelesaikan Masalah Krisis Keselamatan Makanan?. - Majalah Sains. 1-5. |
| Siow Kim Shyong. (2020). Consider A Spherical Patent: Ip And Patenting In Technology Business. - Materials World. 52. |
| Lee Khai Ern;mazlin Mokhtar;mohd. Raihan Bin Taha;mohd Talib Bin Latif;marlia Binti Mohd Hanafiah;goh Choo Ta;siow Kim Shyong;lubna Alam. (2020). Public Risk Perception And Ethical Governance Of Nanotechnology For Sustainability In Malaysia. - . . |
| Muhamad Ramdzan Bin Buyong;burhanuddin Bin Yeop Majlis;norazreen Binti Abd Aziz;azrul Azlan Bin Hamzah;siow Kim Shyong. (2020). Tapered Dielectrophoresis Electrode For Anticlogging In Biological Fluids Filtration. - . . |
| Chia Chin Hua;nurul Izzaty Binti Hassan;siow Kim Shyong;mohd Ambri Bin Mohamed;chin Siew Xian. (2020). Production Of Metallic Conducting Nanowires For Industrial Applications. - . . |
| Siow Kim Shyong. (2019). Bahan Pelekat Cip Bersuhu Tinggi Dalam Pempakejan Mikroelektronik. - Majalah Sains. . |
| Rabiah Al Adawiyah Ab Rahim, Azman Jalar, Maria Abu Bakar, Siow Kim Shyong. (2019). Effect Of Substrate Surface Roughness On The Growth Of Intermetallic Compound Layer Lead Free Solder Joint. - . 1-5. |
| Arifah Syahirah Abdul Rahman , Kim S Siow, Pei Yuen Ng & Burhanuddin Yeop Majlis. (2018). Sulfur And Nitrogen-containing Plasma Polymerised Surfaces Promotes Osteogenic Differentiation In Wharton-jelly Mesenchymal Stem Cell. - . . |
| Mohd Amir Zulkefli, Mohd Ambri Mohamed, Kim S. Siow, Burhanuddin Yeop Majlis, Jothiramalingam Kulothungan, Manoharan Muruganathan, Hiroshi Mizuta. (2017). Stress Analysis Of Perforated Graphene Nanoelectromechanical (nem) Contact Switches Using 3d Finite Element Simulation For Mechanical Reliability Improvement. - International Conference On Nanoscience And Nanotechnology 2017 (nano-scitech 2017). . |
| Siow Kim Shyong. (2016). Health And Environmental Safety Of Nano-materials: Polymer Nano-composites And Other Materials Containing Nanoparticles. - Materials World (iom3 Publication). 24. |
| Azman Bin Jalar @ Jalil, Norinsan Kamil Bin Othman, Siow Kim Shyong, Syarif Junaidi Bin Sjarifuddin Djalil. (2015). Pencirian Wayar Aloi Pateri Bebas Plumbum (pb). - . . |
| Roles and mechanisms of plasma ions and related species in breaking down pesticides on food crops , Ketua Projek , 01-10-2022 sehingga 31-03-2025 , Kebangsaan |
| Copper-Graphene Interposer as Ballistic Thermal Cooling Mechanism for Die Heat Spreader and Highly Conductive Electrical Interconnect for Wide Band Gap (WBnG) and Ultra-wide Band Gap (UWBnG) Application , Penyelidik Bersama , 01-12-2024 sehingga 30-11-2026 , Kebangsaan |
| Elastic and self-healing behavior of polyeurethane/polymethyl methacrylate embedded graphene oxide as thermal interface materials for efficient thermal conduction. , Penyelidik Bersama , 01-08-2024 sehingga 31-07-2026 , Kebangsaan |
| Development of optical biosensor for screening of chronic kidney diseases (CKD) and non-communicable disease (NCD) using surface plasmon resonance (SPR) technology , Penyelidik Bersama , 01-10-2023 sehingga 31-12-2024 , Universiti |
| Reconciling the Mechanisms of Seed Germination and Sterilisation by Atmospheric Plasma Treatment from BIo-Plasma Physics Perspective , Ketua Projek , 01-09-2019 sehingga 31-05-2022 , Kebangsaan |
| Surface Plasma Modified Substrate for Controlled Stem Cell Differentiation for Implanted Tissues , Ketua Projek , 01-06-2015 sehingga 30-11-2017 , Universiti |
| Sintered Nano Silver (Nano-Ag) Joints as Interconnect Material For Microelectronic Packaging , Ketua Projek , 01-01-2014 sehingga 31-12-2015 , Universiti |
| Plasma modifications of biochip materials for enhanced biocompatibility and interaction between such surfaces and cells , Ketua Projek , 16-12-2013 sehingga 15-12-2015 , Kebangsaan |
| In Search of Biocompatible and Bioactive Materials- International Collaboration , Penyelidik Bersama , 01-10-2022 sehingga 31-12-2023 , Antarabangsa |
| FABRICATION OF OVINE COLLAGEN TYPE 1 BIOSCAFFOLD INTEGRATED WITH PAPPERMINT VIA PLASMA TREATMENT FOR FUTURE USE IN DIABETIC WOUND CARE MANAGEMENT , Penyelidik Bersama , 01-11-2019 sehingga 31-07-2022 , Kebangsaan |
| Development of high ductility metallurgical interconnection in Sn-based lead-free solder joint via superplastic-like approach , Penyelidik Bersama , 01-09-2019 sehingga 30-11-2022 , Kebangsaan |
| Anti fouling Plasma-Modified Membrane Producing Potable Clean Water , Penyelidik Bersama , 15-11-2018 sehingga 14-05-2021 , Antarabangsa |
| IMENGiTi PD : A Portable Tidal Pertoneal Dialysis System , Penyelidik Bersama , 01-10-2018 sehingga 30-06-2022 , Kebangsaan |
| Metallic-polymer nanocomposite by plasma-based deposition process for two-terminal diode based application , Penyelidik Bersama , 15-08-2018 sehingga 14-05-2021 , Antarabangsa |
| Dielectrophoresis-based `Lab-on-a-chip` Device for Rapid and Portable Bacterial and Drug-Resistance Strains with a Focus on ESKAPE Pathogens Detection. , Penyelidik Bersama , 01-02-2018 sehingga 31-01-2021 , Universiti |
| Production of Metallic Conducting Nanowires for Industrial Applications , Penyelidik Bersama , 16-10-2017 sehingga 15-07-2020 , Kebangsaan |
| Tapered Dielectrophoresis Electrode for Anticlogging in Biological Fluids Filtration , Penyelidik Bersama , 15-08-2017 sehingga 14-11-2020 , Kebangsaan |
| Public risk perception and ethical governance of nanotechnology for sustainability in Malaysia , Penyelidik Bersama , 01-01-2016 sehingga 31-12-2018 , Kebangsaan |
| Development of Hybride Nano-Micro Electromechanical Systems (Nano-MEMS) Devices , Penyelidik Bersama , 15-06-2015 sehingga 30-09-2016 , Universiti |
| Pencirian Sifat Mekanik Aloi Pateri Sn/Ag/Cu Menggunakan Perlekukan Nano , Penyelidik Bersama , 15-06-2015 sehingga 30-09-2016 , Universiti |
| Vertical-aligned Graphene Interdigitated for ultra-sensitive NEMS , Penyelidik Bersama , 01-02-2015 sehingga 31-10-2020 , Kebangsaan |
| Pencirian Sifat Fizik Aloi Pateri Berasaskan Timah Menggunakan Perlekukan Nano , Penyelidik Bersama , 01-04-2014 sehingga 31-03-2015 , Universiti |
| Development of Hybrid Nano-Micro lectromechanical Systems (Nano=MEMS) Devices , Penyelidik Bersama , 01-04-2014 sehingga 31-03-2015 , Universiti |
| Study of dielectrophoretic and magnetophoretic nanoparticle manipulation in continuous flow microfluidic systems for biochemical analysis platforms , Penyelidik Bersama , 16-12-2013 sehingga 15-06-2016 , Kebangsaan |
| Pengecilan Partikel Pateri Berasaskan Sn Bagi Pes Pateri Berprestasi Tinggi , Penyelidik Bersama , 01-12-2013 sehingga 31-12-2015 , Universiti |
| Pencirian Wayar Aloi Pateri Bebas Plumbum (Pb) , Penyelidik Bersama , 01-11-2013 sehingga 30-04-2015 , Universiti |
| KEJURUTERAAN MIKRO DAN NANOELEKTRONIK , Penyelidik Bersama , 01-01-2013 sehingga 31-03-2014 , Universiti |
| Anugerah Perkhidmatan Cemerlang / Anugerah Perkhidmatan Cemerlang , 2017 |
| Anugerah Gangsa , 2024 |
| Anugerah Penerbitan Jurnal Terindeks , 2023 |
| Anugerah Penyelidikan (Individu) , 2023 |
| Anugerah Inovasi e-Pembelajaran , 2023 |
| Anugerah Paten Terbaik IMEN , 2022 |
| High Cited Paper - Electronic Packaging Research Society of Malaysia , 2022 |
| Journal of Electronic Packaging IBM Top Pick for Paper of Industrial Relevance , 2017 |
| Journal of Alloys and Compounds Outstanding Contribution in Reviewing , 2017 |
| Progress in Organic Coatings Outstanding Contribution in Reviewing , 2017 |
| Top 10 Citation Engineering Category 2016 UKM , 2016 |
| Anugerah 100 Sitasi Tertinggi , 2016 |
| Materials Science Engineering C Outstanding Contribution in Reviewing , 2016 |
| Microelectronics Reliability Outstanding Contribution in Reviewing , 2016 |
| Penghargaan , 2016 |
| Journal of Alloys and Compounds Outstanding Contribution in Reviewing , 2015 |
| Certificate of Outstanding Contribution on Reviewing , 2015 |
| Peranan dan Mekanisme Ion Plasma dan Spesis berkaitan dalam Memusnahkan Racun Perosak pada Tanaman, NUR ARIENA HANIS BINTI MOHD NOR, Sarjana |
| Ubahsuai permukaan bebola pateri menggunakan kaedah nanoteknologi, FOO SIEW PENG, Sarjana |
| Keboleharapan Perak Tersinter Bersaiz Mikron dan Nano Sebagai Bahan Pelekat Dai, CHUA SIANG TAT, Sarjana |
| Pempolimeran Plasma Carvone sebagai salutan anti-bakteria untuk aplikasi peranti perubatan, CHAN YUEN WAH, Sarjana |
| Pengubahsuaian Permukaan Pes Membran Menggunakan Teknik Polimerasi Plasma, MUHAMMAD AKMAL BIN SUHAIMI, Sarjana |
| Plasma modifikasi permukaan poliuretana metakrilat (PUMA) dan off-stoikiometri thiol-ene (OSTE) polimer, CHEN TIAM FOO, Sarjana |
| Pencirian Voltan Terhadap Penghasilan Daya Dielektroforesis Untuk Manipulasi Sel Darah Merah, MUHAMMAD IZZUDDIN BIN ABD SAMAD, Sarjana |
| Kesan Morfologi Permukaan Substrat Terhadap Pertumbuhan Sebatian Antara Logam, RABIAH AL ADAWIYAH BINTI AB RAHIM, Sarjana |
| REKA BENTUK DAN SIMULASI SUIS NANOELEKTROMEKANIKAL (NEM) BERASASKAN GRAFIN, MOHD AMIR BIN ZULKEFLI, Sarjana |
| Penilaian Persepsi Masyarakat Terhadap Nanoteknologi Untuk Tadbir Urus Baik, NUR AIZAT BT KAMARULZAMAN, Sarjana |
| Kesan sulfur dan nitrogen terpolimer plasma terhadap pembezaan osteogenik dan agen perencatan bakteria, ARIFAH SYAHIRAH ABDUL RAHMAN, Sarjana |
| PEMPOLIMERAN BERASASKAN PLASMA BUKAN TERMAL UNTUK APLIKASI, ASAD MASOOD, Doktor Falsafah |
| WANGWEIJIE, Doktor Falsafah |
| Percambahan dan Peningkatan Pertumbuhan Tanaman Pertanian Menggunakan, CH NAEEM AHMED, Doktor Falsafah |
| Interaksi antara Pepejal/Cecair pada Kristal Fononik Berasaskan Tiang, MOHD FARHANULHAKIM BIN MOHD RAZIP WEE, Doktor Falsafah |
| MIKROELEKTROD DIELEKTROFORESIS BAGI PENGESANAN MASA NYATA PATOGEN ESKAPE, MUHAMMAD KHAIRULANWAR BIN ABDUL RAHIM, Doktor Falsafah |
| Penderia Bio Resonan Plasmon Permukaan Berasaskan Konfigurasi Kretschmann dan, NUR AKMAR BINTI JAMIL, Doktor Falsafah |
| Kajian Eksperimen Pemultipleks Gelombang Anjal pada Pemandu Gelombang Slab Fononik, MOHD SYAFIQ FAIZ BIN NOR ASHIKIN, Doktor Falsafah |
| Sectorial Training Committee (STC) for Electrical Electronic & Machinery Support Sub-Sector , 28-11-2014 sehingga 01-01-1970 , Kebangsaan |
| MEMS 2015 International Symposium on MEMS, Lab on Chip and Microfluidic Devices , 25-09-2014 sehingga 06-02-2015 , Antarabangsa |
| 36th International Electronic Manufacturing Technologies , 03-03-2014 sehingga 13-11-2014 , Kebangsaan |
| Technical Committee of 16th Electronics Packaging Technology Conference , 05-05-2014 sehingga 05-12-2014 , Antarabangsa |
| The effect of Si addition on microstructure and micro hardness of SN100C Solder Alloy , 18-09-2014 sehingga 18-09-2014 , Antarabangsa |
| IEEE Components Packaging Manufacturing Technology Malaysia Chapter , 25-01-2014 sehingga 17-01-2015 , Kebangsaan |
| Approved Assessor , 06-01-2014 sehingga 23-12-2016 , Antarabangsa |
| Degradation of reactive Black 5 Dye by CWPO using Fe/Mining Sand under photo-fenton process AND The microstructure of aluminium A5083 Butt Joint by friction stir welding. , 07-05-2014 sehingga 30-05-2014 , Antarabangsa |
| 11th International Conference on Semiconductor Electronics 2014 , 03-02-2014 sehingga 29-08-2014 , Antarabangsa |
| IEM Journal " Effect of Hard Face Grinding and Activation on Electroless Nickel Plating on Cast Aluminium Alloy Substrates" , 25-02-2014 sehingga 25-04-2014 , Kebangsaan |
| Journal of Applied Polymer Science "Ultraviolet-ozone surface cleaning of injection-molded, thermoplastic micro cantilevers" , 12-10-2014 sehingga 23-12-2014 , Antarabangsa |
| Journal of Alloys and Compounds "Synchrotron radiation real-time in situ study on dissolution and precipitation of Ag3Sn plates in sub-50 μm Sn-Ag-Cu solder bumps" , 13-02-2014 sehingga 18-02-2014 , Antarabangsa |
| Journal of Alloys and Compounds "Zn and Ni diffusion study during reflow ageing of Sn-Zn solder on Ni/Cu substrate" , 28-04-2014 sehingga 01-05-2014 , Antarabangsa |
| Journal of Alloys and Compounds "Microstructure, thermal analysis and damping properties of Ag and Ni nano-particles doped Sn-8Zn-3Bi solder on OSP-Cu substrate" , 06-06-2014 sehingga 09-06-2014 , Antarabangsa |
| Journal of Electronic Materials "Effects of Processing Parameters on the Characteristics of Spherical Silver Powders Synthesized using Metallo-Organic Decomposition" , 11-01-2014 sehingga 25-01-2014 , Antarabangsa |
| Journal of Electronic Materials "Pressureless Bonding using Cu and Sn Mixed Nanoparticles" , 29-04-2014 sehingga 13-05-2014 , Antarabangsa |
| Journal of Electronic Materials "Parametric study on pressureless sintering of nanosilver paste to bond large-area (≥100 mm²) power chips at low temperatures for electronic packaging" , 19-11-2014 sehingga 03-12-2014 , Antarabangsa |
| Synthetic Metals "Silver nano-particles capable of sintering at room temperature prepared without external dispersing agent" , 19-06-2014 sehingga 22-06-2014 , Antarabangsa |
| Materials Chemistry & Physics "Electric-current-assisted sintering of nanosilver paste for power electronic packaging" , 03-09-2014 sehingga 17-09-2014 , Antarabangsa |
| Materials Science and Engineering "A Low-temperature Cu-to-Cu bonding using silver nanoparticles stabilised by saturated dodecanoic acid" , 28-06-2014 sehingga 27-07-2014 , Antarabangsa |
| Journal of Alloys and Compounds "Interfacial reactions between Cu substrate and Sn-1Ag-0.5Cu solder containing 0.1 wt.% Al by dipping method" , 05-01-2015 sehingga 06-02-2015 , Antarabangsa |
| Microstructure, elastic modulus and shear strength of Sn-Ag-Cu-x(nano-Al2O3) solders on Cu and Au/Ni metallized Cu substrates , 15-03-2015 sehingga 29-03-2015 , Antarabangsa |
| Cell proliferation on modified DLC thin films prepared by plasma enhanced chemical vapor deposition" , 01-04-2015 sehingga 17-04-2015 , Antarabangsa |
| Journal Surface Innovations "two surface gradients of polyethylene glycol for reduction in protein adoption" , 07-04-2015 sehingga 28-04-2015 , Antarabangsa |
| Fusion peptide P15-CSP shows anti-biofilm activity and pro-osteogenic activity when deposited as a coating on hydrophilic but not hydrophobic surfaces , 26-03-2015 sehingga 16-04-2015 , Antarabangsa |
| Microstructural Discovery of Al Addition on the Sn-0.5Cu Based Pb-Free Solder Design , 26-05-2015 sehingga 16-06-2015 , Antarabangsa |
| Verification of the thin film metal layer thickness by Energy dispersive X-ray , 11-02-2015 sehingga 30-07-2015 , Antarabangsa |
| Health and Environmental Safety of Nanomaterials: Polymer Nanocomposites and other Materials Containing Nanoparticles" , 22-06-2015 sehingga 24-07-2015 , Antarabangsa |
| Infrared Sensors Based on High-Tc Mn:PIMNT Pyroelectric Crystals, Drift Invariant Gas Recognition Technique for Gas Sensor Array, DAN kertas-kertas tertulis dalam surat lantikan , 01-06-2015 sehingga 30-06-2015 , Antarabangsa |
| Degradation of High Power Single Emitter Laser Modules Using Nanosilver Paste in Continuous Pulse Conditions , 08-06-2015 sehingga 07-07-2015 , Antarabangsa |
| 17th Electronic Packaging Technology Conference , 13-07-2015 sehingga 30-09-2015 , Antarabangsa |
| Soldering & Surface Mount Technology , 10-08-2015 sehingga 31-08-2015 , Antarabangsa |
| Journal of Alloys and Compounds , 11-08-2015 sehingga 09-10-2015 , Antarabangsa |
| Substitution Local TiO2 on the Synthesis of Li4Ti5O12 (LTO) for Anodes Lithium Ion Batteries , 14-08-2015 sehingga 28-08-2015 , Antarabangsa |
| Journal of Electronic Materials , 21-08-2015 sehingga 21-10-2015 , Antarabangsa |
| Jawatankuasa Penganjur untuk 37th International Electronics Manufacturing Technology & 18th Electronics Materials and Packaging , 03-08-2015 sehingga 23-09-2016 , Antarabangsa |
| IEEE Components Packaging Manufacturing Technology Malaysia Chapter , 17-01-2015 sehingga 30-01-2016 , Kebangsaan |
| Penganjur 2nd International Conference on Functional Materials and Metallurgy , 15-12-2015 sehingga 28-05-2016 , Antarabangsa |
| Effects of Ag content on interfacial reaction of Sn-Ag-Cu solders and Cu substrates during liquid-state soldering , 22-01-2016 sehingga 05-02-2016 , Antarabangsa |
| Silver adhesive layer for enhanced pressure-free bonding using copper nanoparticles , 01-02-2016 sehingga 14-02-2016 , Antarabangsa |
| Surface characterization of insulin coated Ti6Al4V medical implant material conditioned in cell culture medium: XPS study , 04-02-2016 sehingga 16-02-2016 , Antarabangsa |
| Effect of Silver Flakes in a Novel Silver Paste on the Joining Process and Properties of Sandwich Power Modules (IGBTs chip/silver paste/bare Cu) , 10-02-2016 sehingga 24-02-2016 , Antarabangsa |
| 2016 IEEE International Conference on Semiconductor Electronics , 20-01-2016 sehingga 19-08-2016 , Kebangsaan |
| Degradation of a sintered Cu nanoparticle layer studied by synchrotron radiation computed laminography". , 21-04-2016 sehingga 31-05-2016 , Antarabangsa |
| Electrochemical migration of fine-pitch nanopaste Ag interconnects , 08-05-2016 sehingga 22-05-2016 , Antarabangsa |
| Cytotoxicity Assessment of Adipose-derived Mesenchymal Stem Cells on synthesized Biodegradable Mg-Zn-Ca Alloys , 06-05-2016 sehingga 20-05-2016 , Antarabangsa |
| Ahli jawatankuasa (sponsorship) , 20-01-2016 sehingga 19-08-2016 , Antarabangsa |
| On the swelling of silver powder during sintering , 23-06-2016 sehingga 07-07-2016 , Antarabangsa |
| 1) Realization of Hermetic Cavities Using Gold Wafer Level Thermocompression Bonding for MEMS, 2) Multi-Sensor Module for a Mobile Robot Operating in Harsh Environments; , 24-06-2016 sehingga 20-07-2016 , Antarabangsa |
| seperti tertulis dalam bukti lantikan , 24-06-2016 sehingga 20-07-2016 , Antarabangsa |
| Integration of IDE with ZnO nanoparticles for Sensitivity Detection of Synthetic Formaldehyde Liquid" , 27-05-2016 sehingga 24-06-2016 , Antarabangsa |
| Interdigitated Electrode biosensor on Graphene Oxide-Multiwalled Carbon Nanotubes for DNA detection , 27-05-2016 sehingga 24-06-2016 , Antarabangsa |
| Increment on Grain Size of TiO2 Doped Niobium Chloride (NbCl5) by Sol-Gel Spin Coating Technique') , 17-05-2016 sehingga 18-06-2016 , Antarabangsa |
| Hydrophilic property of glass treated by needle plasma jet for surface modification' , 27-06-2016 sehingga 26-07-2016 , Antarabangsa |
| 18th EPTC 2016 Technical Committee Assignment: Materials and Substrates/Leadframes , 03-07-2016 sehingga 29-11-2016 , Antarabangsa |
| Behavior of thin copper oxide on silver as an analogue for copper nanoparticles , 04-07-2016 sehingga 18-07-2016 , Antarabangsa |
| Complete Bandgap in a Pillar-Based Piezoelectric Phononic Crystal Slab , 04-07-2016 sehingga 18-07-2016 , Antarabangsa |
| Shock and Vibration (ISI Journal Q3: Special Issue) , 16-12-2016 sehingga 05-05-2017 , Antarabangsa |
| Low Pressure DC-Plasma System for the Modification of Polymeric Membrane Surfaces , 11-07-2016 sehingga 08-08-2016 , Antarabangsa |
| 5 kertas tentang 1) improvement of In-Sn solder", 2) wafer level lamination", 3) halogen free epoxy, 4) low stress dielectric for wafer level packaging, 5) anodic bondable LTCC , 09-07-2016 sehingga 15-07-2016 , Antarabangsa |
| Mechanical deformation of sintered porous Ag die-attach at high temperature and its effect size for wide-bandgap power devices design , 20-07-2016 sehingga 03-08-2016 , Antarabangsa |
| Mediating cell - surface interactions by plasma polymerization of Furfuryl Methacrylate for biomedical applications , 22-07-2016 sehingga 05-08-2016 , Antarabangsa |
| iNEMI Packaging TIG High-Temperature, Pb-free Die-Attach Material Project , 23-03-2016 sehingga 31-01-2017 , Antarabangsa |
| Effect of Manufacturing Process on Micro-Deformation Behavior of Sintered-Silver Die-attach Materia , 25-07-2016 sehingga 08-08-2016 , Antarabangsa |
| Surface modification of silicone elastomer with 2- methacryloyloxyethyl phosphorylcholine by graft polymerization to enhance biocompatibility , 14-08-2016 sehingga 04-09-2016 , Antarabangsa |
| Synthesize of a novel thermo/pH sensitive nanogel based on salep modified graphene oxide for drug release , 28-08-2016 sehingga 18-09-2016 , Antarabangsa |
| In-situ bridging effect of Ag2O on pressureless and low-temperature sintering of micron silver paste , 15-09-2016 sehingga 29-09-2016 , Antarabangsa |
| Felo Bersekutu di PIK , 19-09-2016 sehingga 18-09-2018 , Daerah / Jajahan |
| The Influence of Processing Conditions on the 3D Interconnected Structure of Nanosilver Paste , 12-10-2016 sehingga 02-11-2016 , Antarabangsa |
| IEEE CPMT Pemilihan Projek Terbaik Untuk Pelajar Universiti , 01-06-2016 sehingga 30-11-2016 , Kebangsaan |
| Review of silver nanoparticle based die attach materials for high power/temperature applications , 19-10-2016 sehingga 17-11-2016 , Antarabangsa |
| Evaluation of different surface treatments on fiber post cemented with a self-adhesive system , 28-10-2016 sehingga 18-11-2016 , Antarabangsa |
| Poly(ethylene glycol)Grafted Silica Nanoparticles for Highly Hydrophilic Acrylicbased Polyurethane Coatings , 12-11-2016 sehingga 10-12-2016 , Antarabangsa |
| 6th Brunei International Conference on Engineering and Technology , 01-06-2016 sehingga 16-11-2016 , Antarabangsa |
| The Contribution of Chemical and Physical Factors on the Nucleation and Growth of Large Area Graphene : A review , 30-12-2016 sehingga 27-01-2017 , Antarabangsa |
| Penyelia bersama untuk Pelajar PhD Universiti Teknologi Petronas , 03-01-2017 sehingga 31-12-2019 , Kebangsaan |
| Behavior of eutectic Sn-Bi powder in Cu nanoparticle joints during firing , 11-01-2017 sehingga 01-02-2017 , Antarabangsa |
| Persatuan Alumni Nanyang Technological University , 01-01-2017 sehingga 31-12-2019 , Kebangsaan |
| Effect of nickel catalyst thickness and grain size prepared by electroplating method to the growth of Carbon Nanostructures by Chemical Vapour Deposition , 19-02-2017 sehingga 13-03-2017 , Antarabangsa |
| Prof Zuruzi Abu Samah , 17-02-2017 sehingga 17-03-2017 , Antarabangsa |
| Recent Process in Rapid Sintering Nanosilver for High Temperature Applications , 16-04-2017 sehingga 30-04-2017 , Antarabangsa |
| "Autologous vascularization: a method to enhance the antibacterial adhesion properties of expanded polytetrafluoroethylene". , 04-05-2017 sehingga 14-05-2017 , Antarabangsa |
| Comparison of surface modification of CR39 polymer film using RF and DC glow discharges plasma , 05-05-2017 sehingga 02-06-2017 , Antarabangsa |
| UltraStable Sintered Silver Die Attach for Demanding High Power/Temperature Applications , 24-05-2017 sehingga 14-06-2017 , Antarabangsa |
| A corrosion study of AgAl intermetallic compounds in chlorine-containing epoxy molding compounds , 22-05-2017 sehingga 05-06-2017 , Antarabangsa |
| A Study of the Thermal Stability of Silver Paste Sintering on Copper and Aluminum Substrates , 06-06-2017 sehingga 20-06-2017 , Antarabangsa |
| Ahli Jawantankuasa Siswazah IMEN , 01-01-2017 sehingga 31-12-2019 , Kampung / Taman |
| IEEE CPMT Malaysia Section , 14-01-2017 sehingga 31-12-2017 , Kebangsaan |
| Vacuum Packaging and semi-passive Chips for Wireless Temperature monitoring in Industrial Applications , 28-06-2017 sehingga 24-07-2017 , Antarabangsa |
| Diamond/ZnO/LiNbO3 Structure for packageless Acoustic Wave Sensors , 28-06-2017 sehingga 24-07-2017 , Antarabangsa |
| Housing Design for TwoDimensional Air Flow Sensors , 28-06-2017 sehingga 24-07-2017 , Antarabangsa |
| A Dished Diaphragm for the Miniature Encapsulation of a Pressure Sensor for inVivo Applications , 28-06-2017 sehingga 24-07-2017 , Antarabangsa |
| Investigation of Housing on Packaged MEMS Wind Sensors for Industrial Application , 28-06-2017 sehingga 24-07-2017 , Antarabangsa |
| Stretchable Ph Sensing Patch in a Hybrid Package , 28-06-2017 sehingga 24-07-2017 , Antarabangsa |
| High Temperature Endurable Die Attach Material for Power Electronics Package – Process Challenges , 09-07-2017 sehingga 29-08-2017 , Antarabangsa |
| Method for Assessing the Delamination Risk in BEoL Stacks around Copper TSV Applying Nanoindentation and Finite Element Simulation , 09-07-2017 sehingga 29-08-2017 , Antarabangsa |
| Addressing the persistent adhesive residue problem in taped QFNs , 09-07-2017 sehingga 29-08-2017 , Antarabangsa |
| The Effects of Silica Filler Content in NCP on the Reliability of 3D TSV Multi-Stack , 09-07-2017 sehingga 29-08-2017 , Antarabangsa |
| Single-Pass Dicing Process Enablement for CMOS 45 nm Copper Low-k Semiconductor Wafer , 09-07-2017 sehingga 29-08-2017 , Antarabangsa |
| Perfect Molding Challenges and The Limitations , 09-07-2017 sehingga 29-08-2017 , Antarabangsa |
| Qualitative & Quantitative Study of Flux-clean Solution for Smart High-side Device , 09-07-2017 sehingga 29-08-2017 , Antarabangsa |
| Novel Material Synthesis for High Temperature Dielectric Application to Encapsulate High Voltage Power Semiconductor Devices , 09-07-2017 sehingga 29-08-2017 , Antarabangsa |
| Perunding teknikal/ Wakil Aztrong , 11-07-2017 sehingga 10-07-2018 , Antarabangsa |
| Elevated-temperature shear creep evolution and life prediction of sintered nano-silver , 09-08-2017 sehingga 30-08-2017 , Antarabangsa |
| Constitutive modelling on the wholelife uniaxial ratcheting behavior of sintered nanoscale silver paste at room and high temperatures , 15-08-2017 sehingga 12-09-2017 , Antarabangsa |
| SEM, AFM, XPS and Contact Angle Characterization of Alkali Treated Kenaf Fibers , 19-08-2017 sehingga 16-09-2017 , Antarabangsa |
| Real time resistance monitoring during sintering of silver paste , 24-08-2017 sehingga 07-09-2017 , Antarabangsa |
| RF plasma polymerization of orange oil and characterization of the polymer thin films , 27-09-2017 sehingga 11-10-2017 , Antarabangsa |
| Heat resistant die-attach with cold-rolled Ag sheet , 30-10-2017 sehingga 05-11-2017 , Antarabangsa |
| Delphi Expert Panel for Study on Future of Talent in Malaysia 2035 , 20-12-2017 sehingga 16-04-2018 , Kebangsaan |
| TRIZ Practioner Level 1 , 17-04-2018 sehingga 18-04-2018 , Kebangsaan |
| TRIZ Practioner Level 1 , 17-04-2018 sehingga 18-04-2018 , Kebangsaan |
| Top 10 Citation Engineering Category 2016 UKM , 01-12-2016 sehingga 01-01-1970 , Kampung / Taman |
| Journal of Electronic Packaging IBM Top Pick for Paper of Industrial Relevance , 01-08-2017 sehingga 01-01-1970 , Antarabangsa |
| Journal of Alloys and Compounds Outstanding Contribution in Reviewing , 01-08-2017 sehingga 01-01-1970 , Antarabangsa |
| Journal of Alloys and Compounds Outstanding Contribution in Reviewing , 01-07-2015 sehingga 01-01-1970 , Antarabangsa |
| Materials Science Engineering C Outstanding Contribution in Reviewing , 01-11-2016 sehingga 01-01-1970 , Antarabangsa |
| Microelectronics Reliability Outstanding Contribution in Reviewing , 03-10-2016 sehingga 01-01-1970 , Antarabangsa |
| Progress in Organic Coatings Outstanding Contribution in Reviewing , 01-02-2017 sehingga 01-01-1970 , Antarabangsa |
| Apparent Fracture Toughness of Pressureless Sintered Silver Interconnects , 17-04-2018 sehingga 08-05-2018 , Antarabangsa |
| The mechanism of pore segregation in the sintered nano Ag for high temperature power electronics applications , 22-04-2018 sehingga 07-05-2018 , Antarabangsa |
| Effect of Loading Type on Fatigue Lifetime of Sintered-silver Die Attach , 14-02-2018 sehingga 14-03-2018 , Antarabangsa |
| IEEE Best FYP Award , 14-01-2017 sehingga 31-01-2018 , Kebangsaan |
| Hari Inovasi , 09-03-2018 sehingga 09-03-2018 , Daerah / Jajahan |
| Enhancement of Sintered NanoÂSilver Chip Attachment Materials by Introducing Indium , 19-02-2018 sehingga 06-03-2018 , Antarabangsa |
| IEEE CPMT (EPS) Malaysia Chapter , 20-01-2018 sehingga 26-01-2019 , Kebangsaan |
| IEEE CPMT Malaysia Chapter , 30-01-2016 sehingga 31-01-2017 , Kebangsaan |
| Wire interconnection using Ag sinter paste for wide band gap power semiconductors , 14-05-2018 sehingga 29-05-2018 , Antarabangsa |
| Influence of volume variety of waste cooking palm oil as carbon source on graphene growth through thermal chemical vapor deposition , 21-05-2018 sehingga 23-05-2018 , Antarabangsa |
| IMEN UKM Penilai RARA 6014 , 31-05-2018 sehingga 31-05-2018 , Kampung / Taman |
| Penceramah untuk Latihan TRIZ (theory of inventive problem solving) , 11-07-2018 sehingga 12-07-2018 , Kebangsaan |
| Plasma Deposited Hydrophobic Silicone Multilayer Polymeric Coating , 26-07-2018 sehingga 10-08-2018 , Antarabangsa |
| Microwave plasma assisted micro-drilling of polymeric material at 2.45 GHz , 24-07-2018 sehingga 10-08-2018 , Antarabangsa |
| PCB Prototyping Machine , 24-07-2018 sehingga 10-07-2018 , Antarabangsa |
| The Complete Guide to Delamination in Semiconductor Packag , 24-07-2018 sehingga 10-08-2018 , Antarabangsa |
| Lead frame anti-flash design toward mold flash improvement , 24-07-2018 sehingga 10-08-2018 , Antarabangsa |
| Challenges to Improve Packages Robustness and Elimination of Mold Compound Sticking on Power Leaded Package , 24-07-2018 sehingga 10-08-2018 , Antarabangsa |
| Laser Separation of Dissimilar Substrates Using Water Washable Materials , 24-07-2018 sehingga 10-08-2018 , Antarabangsa |
| Low Transmission Loss Polyimides Substrates: A Novel Alternative to Liquid crystal polymers , 24-07-2018 sehingga 10-08-2018 , Antarabangsa |
| Dynamic Mechanical Analysis and Viscoelastic Behavior of Epoxy Molding Compounds for FOWLP , 24-07-2018 sehingga 10-08-2018 , Antarabangsa |
| Low-temperature and pressureless sinter joining of Cu with micron/submicron Ag particle paste in air , 29-07-2018 sehingga 13-08-2018 , Antarabangsa |
| Solder Resist Crack Resistance Process Characterization in BGA Package for Automotive Grade Reliabilit , 24-07-2018 sehingga 10-07-2018 , Antarabangsa |
| An Experiment design for outgassing simulation on silicon microphone , 23-07-2018 sehingga 17-08-2018 , Antarabangsa |
| The Balun Design by Embedding High Permittivity Material in The Substrate of CSP Package with Large Size" , 23-07-2018 sehingga 17-08-2018 , Antarabangsa |
| Effect of Bond Pad Surface Finish on AuSn Solder Bumping Using Laser Solder Jettin , 23-07-2018 sehingga 17-08-2018 , Antarabangsa |
| the study of void formation in Ag sinter joint , 23-07-2018 sehingga 17-08-2018 , Antarabangsa |
| the study of void formation in Ag sinter joint , 23-07-2018 sehingga 17-08-2018 , Antarabangsa |
| Optimization of critical dimension and micro-tolerance of lead frame and mold cavity towards elimination of loose pinch copper and side lead mold flash , 23-07-2018 sehingga 17-08-2018 , Antarabangsa |
| Characterization of PVD Sc doped AlN film , 23-07-2018 sehingga 17-08-2018 , Antarabangsa |
| Molecular Dynamics Simulation of GaN Nano-grinding , 23-07-2018 sehingga 17-08-2018 , Antarabangsa |
| Demonstration of Ultra-fine Pitch Au-Au Diffusion Bonding on Chip-on-Film (COF) with IGEPIG Surface Finishing , 23-07-2018 sehingga 17-08-2018 , Antarabangsa |
| Pressureless Sintering of Nanosilver Paste as Die Attachment on Substrates with ENIG Finish for Semiconductor Applications , 31-08-2018 sehingga 21-09-2018 , Antarabangsa |
| latihan amal di Institut Mikro-juruteraan dan Nano-elektronik , 09-07-2018 sehingga 17-08-2018 , Kebangsaan |
| Direct Ag-Ag bonding by in-situ self-reduction of surface oxides for advanced chip-package interconnection , 06-10-2018 sehingga 20-10-2018 , Antarabangsa |
| Indentation hardness, plasticity and initial creep properties of nanosilver sintered joint , 16-11-2018 sehingga 30-11-2018 , Antarabangsa |
| Science Writing and Publishing (seminar 2 jam di Universiti Nottingham Malaysia ) , 06-12-2018 sehingga 06-12-2018 , Negeri |
| Approved Assesor , 01-03-2017 sehingga 29-02-2020 , Antarabangsa |
| CoW metallization for high strength bonding to both sintered Ag joints and encapsulation resins , 22-01-2019 sehingga 05-02-2019 , Antarabangsa |
| Felo Bersekutu Pusat Inovasi dan Kolaboratif , 01-10-2018 sehingga 01-10-2020 , Daerah / Jajahan |
| Penyelia/mentor untuk pelajar intern sarjana di IMEN UKM , 09-07-2018 sehingga 17-08-2018 , Kebangsaan |
| Penyelia/mentor untuk pelajar intern sarjana di IMEN UKM , 09-07-2018 sehingga 17-08-2018 , Kebangsaan |
| 37th IEEE International Electronic Manufacturing Technology - 18th Electronic Materials and Packaging Conference , 01-01-2016 sehingga 22-09-2016 , Kebangsaan |
| Future of Talent in Malaysia 2035 HRDF , 01-02-2018 sehingga 31-10-2018 , Kebangsaan |
| 38th International Electronics Manufacturing Technology 2018 , 01-01-2018 sehingga 06-09-2018 , Antarabangsa |
| 38th International Electronics Manufacturing Technology 2018 , 01-01-2018 sehingga 06-09-2018 , Antarabangsa |
| IEEE Best Final Year Project , 01-02-2018 sehingga 21-12-2018 , Kebangsaan |
| Large area die attachment by sintering of laser-deposited, organic-free silver nanoparticle at low temperature , 17-03-2019 sehingga 30-03-2019 , Antarabangsa |
| Large area die attachment by sintering of laser-deposited, organic-free silver nanoparticle at low temperature , 17-03-2019 sehingga 30-03-2019 , Antarabangsa |
| Fast and low temperature sintering of Ag paste induced by in situ formed nanoparticles , 20-03-2019 sehingga 03-04-2019 , Antarabangsa |
| Sn Doped ZnO Thin Film for Formaldehyde Detection , 29-03-2019 sehingga 05-04-2019 , Kebangsaan |
| Effect of Tensile Direction on Microstructure Evolution of SAC305 Solder Wire , 29-03-2019 sehingga 05-04-2019 , Kebangsaan |
| seminar keselamatan tempat kerja di IMEN. , 11-04-2019 sehingga 29-04-2019 , Kampung / Taman |
| Penilai Dana Inovasi UKM , 15-04-2019 sehingga 15-04-2019 , Negeri |
| Penilai Permohonan Geran Lab2Market UKM , 19-03-2019 sehingga 19-03-2019 , Kebangsaan |
| Ag particles for sinter bonding: flakes or spheres? , 17-04-2019 sehingga 27-04-2019 , Antarabangsa |
| A new die attach material for high power electronic device , 17-07-2019 sehingga 06-12-2019 , Antarabangsa |
| Study of Raw Materials Effect on the Dielectric Properties of Epoxy Molding Compound for High Power Voltage Devices , 17-07-2019 sehingga 06-12-2019 , Antarabangsa |
| Study of Raw Materials Effect on the Dielectric Properties of Epoxy Molding Compound for High Power Voltage Devices , 17-07-2019 sehingga 06-12-2019 , Antarabangsa |
| Study of Raw Materials Effect on the Dielectric Properties of Epoxy Molding Compound for High Power Voltage Devices , 17-07-2019 sehingga 06-12-2019 , Antarabangsa |
| Water Washable Coatings for Plasma Dicing Processes , 17-07-2019 sehingga 06-12-2019 , Antarabangsa |
| Void Formation in Low-Temperature electroplated Cu-Sn stack for Hermetic Packaging , 17-07-2019 sehingga 06-12-2019 , Antarabangsa |
| Investigation of Effective Tin on Intermetallic towards Solderability Dip and Look Test , 17-07-2019 sehingga 06-12-2019 , Antarabangsa |
| Creep Damage of BGA Solder Interconnects Subjected to Thermal Cycling and Isothermal Ageing , 17-07-2019 sehingga 06-12-2019 , Antarabangsa |
| Fabrication of Biopolymer , 17-07-2019 sehingga 06-12-2019 , Antarabangsa |
| Surface analysis of native spider draglines by FE-SEM and XPS , 29-09-2019 sehingga 14-10-2019 , Antarabangsa |
|
Doping low-cost SiOx (1.2 |
| Persatuan Alumni Nanyang Technological Universiti Malaysia , 30-11-2019 sehingga 29-11-2022 , Kebangsaan |
| Efficacy of a plasma-deposited, Vancomycin/Chitosan antibiotic coating for orthopaedic devices in a bacterially challenged rabbit model , 05-02-2020 sehingga 06-03-2020 , Antarabangsa |
| High-reliability wireless packaging for high-temperature SiC power device sintered by novel organic-free nanomaterial , 16-02-2020 sehingga 15-03-2020 , Antarabangsa |
| Dana Public-Private Research Network (penilaian dalaman) , 13-02-2020 sehingga 12-02-2021 , Negeri |
| Dana Inovasi UKM (PIK) , 14-02-2020 sehingga 12-01-2021 , Negeri |
| Nano-adhesive layer to prevent protein absorption in PDMS microfluidic device , 13-03-2020 sehingga 19-03-2020 , Antarabangsa |
| Novel approach to copper sintering using surface enhanced brass micro flakes for microelectronics packaging , 11-05-2020 sehingga 25-05-2020 , Antarabangsa |
| Atmospheric Pressure Plasma Jet Treatment of Polymers Enables Reagent-Free Covalent Attachment of Biomolecules for 3D Bioprinting , 02-05-2020 sehingga 23-05-2020 , Antarabangsa |
| Surface functionalization of a polyurethane surface via radio-frequency cold plasma treatment using different gases , 19-07-2020 sehingga 02-08-2020 , Antarabangsa |
| Fabrication and multi-scale characterization of a nano-silver paste sintered joint for die attach , 24-06-2020 sehingga 15-07-2020 , Antarabangsa |
| pembentangan cadangan penyelidikan kursus RARA6014 Kaedah Penyelidikan , 15-07-2020 sehingga 15-07-2020 , Kampung / Taman |
| Borneo International Festival , 21-10-2020 sehingga 22-10-2020 , Antarabangsa |
| Physico-chemical and antimicrobial properties of PVDF-HFP/PVP/MoO3 polymer nanocomposite , 01-10-2020 sehingga 22-10-2020 , Antarabangsa |
| 2nd Singapore Open National Invention Convention , 16-11-2020 sehingga 20-11-2020 , Antarabangsa |
| Microstructure and Mechanical Properties of Zinc Matrix Biodegradable Composites Reinforced by Graphene , 07-12-2020 sehingga 17-01-0118 , Antarabangsa |
| A two-steps method to prepare silver nanoparticle ink for improving electrical and mechanical properties of printed silver wire , 18-12-2020 sehingga 28-01-2020 , Antarabangsa |
| PAKAR RUJUK INSTRUMEN STA/ DSC makmal iCRIM , 02-03-2020 sehingga 30-07-2020 , Kampung / Taman |
| "Application of silver paste in thermosonic flip-chip bonding , 02-01-2021 sehingga 21-01-2021 , Antarabangsa |
| "Preparation and sintering characteristics of nano silver-tin core-shell paste , 09-01-2021 sehingga 18-01-0118 , Antarabangsa |
| Surface modification of PMMA polymer and its composites with PC61BM fullerene derivative using an atmospheric pressure microwave argon plasma sheet , 16-02-2021 sehingga 26-02-2021 , Antarabangsa |
| Bio-compatible customized 3D bone scaffolds treated with CRFP, an osteogenic peptide". , 04-03-2021 sehingga 14-03-2021 , Antarabangsa |
| Pressureless sinter joining of bare Cu substrates under forming gas atmosphere by surface oxidized submicron Cu particles , 29-04-2021 sehingga 19-05-2021 , Antarabangsa |
| ""Rapid pressure-assisted sinter bonding in air using 200 nm Cu particles and the enhancement of bonding strength by successive pressureless annealing"" Review for the Transactions of Nonferrous Metals Society of China( , 30-04-2021 sehingga 30-05-2021 , Antarabangsa |
| Thickness and metallization layer effect on interfacial and vertical cracking of sintered silver layer: A numerical investigation. , 03-05-2021 sehingga 24-05-2021 , Antarabangsa |
| Creep of sintered porous micron-silver: nanoindentation experiment and theoretical analysis , 08-06-2021 sehingga 28-06-2021 , Antarabangsa |
| Jawatankuasa 5-21P Sintering Materials for Electronic Assemblies , 01-06-2020 sehingga 31-07-2022 , Antarabangsa |
| Low temperature and low pressure die-attach bonding with etched micro brass flakes , 18-06-2021 sehingga 01-07-2021 , Antarabangsa |
| Reliability Analysis of Large-Area, Low Pressure-Assisted Silver Sintering for Medium Voltage Power Modules , 25-06-2021 sehingga 09-07-2021 , Antarabangsa |
| Global Invention Convention (oleh Henry Ford Museum of American Innovation and Entrepreneurship) , 27-07-2021 sehingga 29-07-2021 , Antarabangsa |
| Effect of oxygen content on bonding performance of sintered silver joint on bare copper substrate , 17-07-2021 sehingga 13-08-2021 , Antarabangsa |
| Phototherapy of Functionalized Biomaterials for the Effective Eradication of Bacterial Biofilm , 23-07-2021 sehingga 02-08-2021 , Antarabangsa |
| Computer Modeling in Engineering And Sciences : Special Issue for Mechanical Reliability of Advanced Materials and Structures for Harsh Applications , 11-06-2021 sehingga 30-12-2021 , Antarabangsa |
| Study on the preparation process and sintering performance of doped nano-silver paste , 05-08-2021 sehingga 25-08-2021 , Antarabangsa |
| Growth Enhancement of Radish Seedlings Induced by Low-Temperature Argon Plasma , 01-08-2021 sehingga 02-09-2021 , Antarabangsa |
| Cold Atmospheric Plasma Jet as a Therapeutic Choice for Superimposed Fungal Infected Diabetic Wound , 28-07-2021 sehingga 07-08-2021 , Antarabangsa |
| Effect of addition of Al and Cu on the properties of Sn-20Bi solder alloy , 10-08-2021 sehingga 31-08-2021 , Antarabangsa |
| Mechanics of Solder/IMC Interface of Lead-Free Solder Interconnects in Ball Grid Array Assembly , 07-09-2021 sehingga 05-10-2021 , Antarabangsa |
| Using Stereolithographic Printing to Manufacture Monolithic Microfluidic Device with Extremely High Aspect Ratio , 01-10-2021 sehingga 08-10-2021 , Antarabangsa |
| Using Stereolithographic Printing to Manufacture Monolithic Microfluidic Device with Extremely High Aspect Ratio , 01-10-2021 sehingga 08-10-2021 , Antarabangsa |
| Sintering mechanism of electronic aluminum paste and its effect on electrical conductivity of aluminum electrode , 28-09-2021 sehingga 28-10-2021 , Antarabangsa |
| NANOTECHNOLOGY MALAYSIA ANNUAL SYMPOSIUM , 11-10-2021 sehingga 13-10-2021 , Antarabangsa |
| Shearing fracture toughness test for sintered silver with nickel coating multiwall carbon nanotubes additives , 10-10-2021 sehingga 31-10-2021 , Antarabangsa |
| Influence of air plasma pretreatments on mechanical properties in metal-reinforced laminated wood , 08-11-2021 sehingga 18-11-2021 , Antarabangsa |
| IMEN Junior Electronics and Nanotechnology Camp 2021 , 10-11-2021 sehingga 21-12-2021 , Kebangsaan |
| IEEE Electronic Packaging Society IEMT 2020 , 06-01-2022 sehingga 21-10-2022 , Antarabangsa |
| "Temporal and spatial differences in thermal transfer behavior of IGBTs caused by the baseplate and die-attach solder cracking , 31-01-2022 sehingga 21-02-2022 , Antarabangsa |
| Effect of grain structure on the failure mechanism of Cu/Cu3Sn investigated via molecular dynamic simulations , 09-02-2022 sehingga 16-02-2022 , Antarabangsa |
| IEEE Electronic Packaging Societ Malaysia Section , 19-02-2022 sehingga 29-01-2023 , Kebangsaan |
| Bonding strength enhancement of low temperature sintered SiC power module by femtosecond laser induced microstructures , 24-02-2022 sehingga 15-03-2022 , Antarabangsa |
| Enhanced mechanical and thermal properties of Ag joints sintered by spark plasma sintering , 01-03-2022 sehingga 15-03-2022 , Antarabangsa |
| IEEE EPS Best Final Year Projects , 15-03-2022 sehingga 31-12-2022 , Kebangsaan |
| Quasi-in-situ observation of the grain growth and grain boundary movement in sintered Cu nanoparticle interconnects , 01-04-2022 sehingga 22-04-2022 , Antarabangsa |
| "ATR-FTIR and UV-vis spectroscopy studies of microwave oven-generated oxygen plasma modification for PVA films as an ideal translucent material for greenhouses" , 16-04-2022 sehingga 03-05-0118 , Antarabangsa |
| "ATR-FTIR and UV-vis spectroscopy studies of microwave oven-generated oxygen plasma modification for PVA films as an ideal translucent material for greenhouses" , 16-04-2022 sehingga 03-05-0118 , Antarabangsa |
| 39th IEEE International Electronics Manufacturing Technology 2022 , 19-04-2022 sehingga 27-04-2022 , Antarabangsa |
| Influence of Ag particle shape on mechanical and thermal properties of TIM Joints , 01-05-2022 sehingga 15-05-2022 , Antarabangsa |
| High Cited Paper - Electronic Packaging Research Society of Malaysia , 26-05-2022 sehingga 01-01-1970 , Kebangsaan |
| XPS Methodologies For the Chemical Characterization of Biomaterials and Polymers , 29-05-2022 sehingga 12-06-2022 , Antarabangsa |
| 24th Electronic Packaging Technology Conference Technical Commitee , 08-06-2022 sehingga 09-12-2022 , Antarabangsa |
| Quad Flat No-Lead Package With Different Thermal Profiles And Solder Pad Finishing For Void Minimization , 15-06-2022 sehingga 30-06-2022 , Kebangsaan |
| Anugerah Paten Terbaik IMEN , 05-07-2022 sehingga 01-01-1970 , Kampung / Taman |
| IEEE EPTC 2022 Technical Committee , 31-05-2022 sehingga 09-12-2022 , Antarabangsa |
| plasma assisted priming : impreoved germination and seedling performance of papaya , 09-08-2022 sehingga 06-09-2022 , Antarabangsa |
| Frontiers in Bioengineering and Biotechnology (Associate Editor- Biomaterials) , 22-08-2022 sehingga 21-08-2024 , Antarabangsa |
| Unraveling the complex oxidation effect in sintered Cu nanoparticle interconnects during high temperature aging , 04-09-2022 sehingga 18-09-2022 , Antarabangsa |
| Associate Editor , 17-09-2022 sehingga 16-09-2023 , Antarabangsa |
| Low temperature Cu-Cu bonding by sintering Cu micro/nano-particles paste , 28-07-2022 sehingga 01-01-1970 , Antarabangsa |
| Connecting the macroscopic and mesoscopic properties of sintered silver nanoparticles by crystal plasticity finite element method , 25-12-2022 sehingga 15-01-2023 , Antarabangsa |
| Industrialization and Commercialization in Tissue Engineering and Regenerative Medicine , 30-06-2023 sehingga 31-10-2023 , Antarabangsa |
| Electrically Conductive Adhesive and sealant , 16-01-2023 sehingga 30-12-2023 , Antarabangsa |
| Electrically Conductive Adhesive and sealant , 16-01-2023 sehingga 30-12-2023 , Antarabangsa |
| Interface enhancing strategy for low temperature bonding of Ag-based nanoalloy , 04-02-2023 sehingga 18-02-2023 , Antarabangsa |
| Interface enhancing strategy for low temperature bonding of Ag-based nanoalloy , 04-02-2023 sehingga 18-02-2023 , Antarabangsa |
| Effects of solvents, activators and additives on sintering properties of Cu paste for die attach , 09-02-2023 sehingga 02-03-2023 , Antarabangsa |
| Experimental investigation of thermal conductivity during aging of nanoporous sintered silver , 28-03-2023 sehingga 18-04-2023 , Antarabangsa |
| IEEE Electronic Packaging Societ Malaysia Section , 11-04-2023 sehingga 01-02-2024 , Kebangsaan |
| Reliability-enhanced microscale Ag sintered joint doped with AlN nanoparticles , 11-04-2023 sehingga 25-04-2023 , Antarabangsa |
| IEEE Electronic Packaging Societ Malaysia Best Engineering Student Award , 28-04-2023 sehingga 31-12-2023 , Kebangsaan |
| Penganjur 2023 Advanced Packaging Symposium Malaysia , 11-04-2023 sehingga 17-10-2023 , Kebangsaan |
| 39th IEEE Electronics Packaging Technology Conference , 11-06-2023 sehingga 08-12-2023 , Antarabangsa |
| 11 penerbitan tentang solder, plasma, die-attach, reliability, hybrid bonding and testing methodology ( please refer to atachment) , 28-06-2023 sehingga 14-07-2023 , Antarabangsa |
| Achieving high-quality nano-silver joints for high-reliability power electronics via pressureless sintering , 05-07-2023 sehingga 15-07-2023 , Antarabangsa |
| Achieving high-quality nano-silver joints for high-reliability power electronics via pressureless sintering , 05-07-2023 sehingga 15-07-2023 , Antarabangsa |
| Prefabrication and Characterization of Copper-silver Foam Composites for Low-temperature Interconnection of Power Modules , 20-07-2023 sehingga 03-08-2023 , Antarabangsa |
| Veritcal farming technology to increase the agriculture production , 31-07-2023 sehingga 10-08-2023 , Antarabangsa |
| Review on Interfacial Bonding Enhancement of Inorganic Thin Film on Polymer Substrate by Ion and Plasma Source , 16-09-2023 sehingga 14-10-2023 , Antarabangsa |
| Low temperature Cu-to-Cu bonding with high thermal boundary conductance achieved by coating metal nanolayers , 03-10-2023 sehingga 17-10-2023 , Antarabangsa |
| Plasma treatment modifies element distribution in seed coating and affects further germination and plant growth through interaction withsoil microbiome , 14-10-2023 sehingga 28-10-2023 , Antarabangsa |
| Enhanced High-temperature Service Reliability of Sinter-Bonded Joints with Micro-Nano Hybrid Ag Paste , 21-10-2023 sehingga 04-02-2023 , Antarabangsa |
| Review of Die-Attach Materials for SiC Devices Packaging , 31-10-2023 sehingga 21-11-2023 , Antarabangsa |
| Unraveling the hydrogen sulfide aging mechanism on electrical-thermal-mechanical property degradation of sintered nanocopper interconnects used inpower electronics packaging , 25-11-2023 sehingga 09-12-2023 , Antarabangsa |
| "Hydrophobic glass and paper coatings based on plasma polymerized vegetable oils using anovel atmospheric pressure plasma concep , 11-12-2023 sehingga 26-12-2023 , Antarabangsa |
| Improvement of Silver Sintered Die Bonding of SiC/DBC Power Modules through Backside Metallization with High Density (111) Orientation Ag Nanotwinned Films , 10-01-2024 sehingga 24-01-2024 , Antarabangsa |
| Finite Element Analysis on the Creep Response of Lead-Free Die Attachments in Power Electronics Mohammad Gharaibeh; , 10-02-2024 sehingga 24-02-2024 , Antarabangsa |
| Microstructure Evolution and Micromechanical Behavior of Solvent-Modified Cu-Ag Composite Sintered Joints for Power Electronics Packaging at High Temperatures , 22-02-2024 sehingga 07-03-2024 , Antarabangsa |
| 36th IEEE IEMT conference 2024 , 01-02-2024 sehingga 19-10-2024 , Antarabangsa |
| Thermo-mechanical reliability evaluation on silver and copper nanoparticles sintered TO247 power devices , 24-03-2024 sehingga 31-03-2024 , Antarabangsa |
| Moderator Forum XChange untuk IEEE - IEMT 2024 , 18-10-2024 sehingga 18-10-2024 , Kebangsaan |
| Kesahan Kandungan Instrumen dalam Kajian Akademik Di Fakulti Pendidikan Teknikal dan Vokasional UTHM , 03-03-2024 sehingga 30-04-2024 , Kebangsaan |
| Plasma glows and shifting water flows: measuring the changes to water transport phenomena in seeds after plasma treatment , 28-04-2024 sehingga 12-05-2024 , Antarabangsa |
| Size Effect between Micron-Silver Joint and Nano-Silver Joint in Die-attached Interconnection , 07-05-2024 sehingga 21-05-2024 , Antarabangsa |
| Book Review: Interconnect Reliability in Advanced Memory Device Packaging , 15-05-2024 sehingga 29-05-2024 , Antarabangsa |
| 26th IEEE EPTC conference , 15-05-2024 sehingga 06-12-2024 , Antarabangsa |
| Characterization of Multiple Commercial Sintered-silver Pastes as Die-attach for PowerElectronics Packaging: Materials, Processing, and Properties , 20-05-2024 sehingga 03-06-2024 , Antarabangsa |
| Highly active bayberry like porous silver microparticles to fabricate Young modulus adjustable sinteredsilver for power electronics interconnecting , 11-07-2024 sehingga 25-07-2024 , Antarabangsa |
| Enhancing DevCrack Die Elimination through Epoxy Pattern Optimization New Die; a Power Module Cu Fins of Mold Void and Wire Sweep Performance Opti Attach Adhesive Meets Challenging Performance Reliability and Cost Objectives of Automotive MCU Packaging , 01-07-2024 sehingga 15-07-2024 , Antarabangsa |
| Optimized bimodal silver particle sintering for high thermal conductivity die-attach layers , 20-08-2024 sehingga 04-09-2024 , Antarabangsa |
| Critical bonding performance dependence of pre-activated silver hillocks in high power semiconductor silver sinterpackaging , 10-10-2024 sehingga 24-10-2024 , Antarabangsa |
| Anugerah Gangsa , 18-10-2024 sehingga 01-01-1970 , Antarabangsa |
| Long-Time Stable Copper Paste with Self-Reducibility as A Die-Attach Material for Power Electronics , 05-12-2024 sehingga 19-12-2024 , Antarabangsa |
| Non-Equilibrium Cold Plasmas and Their Impacts on Physico-chemical Properties of Food Items: A Review , 08-12-2024 sehingga 29-12-2024 , Antarabangsa |
| Prototype of Fixtures for Pressure Sintering Using a Commercial Hot Press and Die Shear Test Using a Small-Scale Tensile Extrusion Testing Machine , 15-12-2024 sehingga 29-12-2024 , Antarabangsa |
| AHLI JAWATANKUASA JAMINAN KUALITI IMEN , 18-07-2021 sehingga 19-07-2022 , Fakulti / Institut / Pusat Perkhidmatan |
| AHLI PENGURUSAN IMEN , 13-10-2022 sehingga 12-10-2023 , Fakulti / Institut / Pusat Perkhidmatan |
| BENGKEL STRATEGIK IMEN SIRI 1 , 03-11-2022 sehingga 03-11-2022 , Fakulti / Institut / Pusat Perkhidmatan |
| DUTA INOVASI (APRIL 2023 - MAC 2025) , 01-04-2023 sehingga 31-03-2025 , Universiti |
| FELO BERSEKUTU PUSAT INOVASI KOLABORATIF , 15-10-2018 sehingga 14-10-2020 , Pusat Pengajian / Jabatan / Pusat Penyelidikan / Unit |
| IMEN JUNIOR ELECTRONICS AND NANOTECHNOLOGY CAMP , 14-12-2021 sehingga 31-12-2021 , Fakulti / Institut / Pusat Perkhidmatan |
| JAWATANKUASA PATEN NYCU – GaN (FAST CHARGING) , 16-10-2023 sehingga 15-10-2024 , Fakulti / Institut / Pusat Perkhidmatan |
| JAWATANKUASA PENYEDIAAN SPESIFIKASI BAGI PEROLEHAN ALAT MICROWAVE REACTOR , 10-03-2023 sehingga 10-03-2023 , Fakulti / Institut / Pusat Perkhidmatan |
| JAWATANKUASA SISWAZAH IMEN , 01-01-2017 sehingga 31-12-2019 , Fakulti / Institut / Pusat Perkhidmatan |
| JAWATANKUASA TASKFORCE PENUBUHAN PUSAT KECEMERLANGAN BERKAITAN INDUSTRI SEMIKONDUKTOR ELEKTRONIK , 30-10-2023 sehingga 29-10-2024 , Fakulti / Institut / Pusat Perkhidmatan |
| JAWATANKUASA TEXAS INSTRUMENT MELAKA-MIDA- INSTITUT KEJURUTERAAN MIKRO DAN NANOELEKTRONIK (IMEN) , 02-01-2024 sehingga 31-12-2024 , Fakulti / Institut / Pusat Perkhidmatan |
| JK Paten PIK , 01-12-2016 sehingga 31-12-2016 , Fakulti / Institut / Pusat Perkhidmatan |
| Jawankuasa Siswazah IMEN , 01-01-2023 sehingga 31-12-2025 , Fakulti / Institut / Pusat Perkhidmatan |
| Jawatankuasa Akademik Siswazah IMEN , 01-01-2017 sehingga 31-12-2019 , Fakulti / Institut / Pusat Perkhidmatan |
| Jawatankuasa Jaminan Kualiti IMEN , 01-01-2019 sehingga 31-12-2020 , Fakulti / Institut / Pusat Perkhidmatan |
| Jawatankuasa Jaminan Kualiti IMEN , 01-01-2019 sehingga 31-12-2020 , Fakulti / Institut / Pusat Perkhidmatan |
| Jawatankuasa Penyediaan Dokumentasi COPPA & COPIA , 08-01-2015 sehingga 31-12-2016 , Fakulti / Institut / Pusat Perkhidmatan |
| Jawatankuasa Siswazah IMEN , 01-01-2015 sehingga 31-12-2015 , Fakulti / Institut / Pusat Perkhidmatan |
| Jawatankuasa Siswazah IMEN , 01-01-2021 sehingga 31-12-2022 , Fakulti / Institut / Pusat Perkhidmatan |
| Jawatankuasa sambutan 15 tahun IMEN & Majlis Menandatangani MoU antara UKM dan Miresco Integrated Sdn. Bhd , 19-12-2017 sehingga 19-12-2017 , Universiti |
| Kolokium Siswazah IMEN 2020 , 01-01-2020 sehingga 31-12-2022 , Fakulti / Institut / Pusat Perkhidmatan |
| Kolokium Siswazah IMEN 2022 , 21-07-2022 sehingga 21-07-2022 , Fakulti / Institut / Pusat Perkhidmatan |
| Kolokium Siswazah Kejuruteraan Mikro dan Nanoelektronik (IMEN), 2018 , 10-04-2018 sehingga 16-04-2018 , Fakulti / Institut / Pusat Perkhidmatan |
| Malaysia-Japan Joint Symposium on Nanobiosensors 2016 , 14-12-2016 sehingga 16-12-2016 , Fakulti / Institut / Pusat Perkhidmatan |
| NANOTECHNOLOGY MALAYSIA ANNUAL SYMPOSIUM (NANOSYM 2021) , 05-08-2021 sehingga 31-10-2021 , Fakulti / Institut / Pusat Perkhidmatan |
| NANOTECHNOLOGY MALAYSIA ANNUAL SYMPOSIUM (NANOSYM 2021) , 11-10-2021 sehingga 13-10-2021 , Universiti |
| PELANTIKAN SEBAGAI AHLI JAWATANKUASA PENILAIAN DI BAWAH DANA PENYELIDIKAN KEMENTERIAN PENDIDIKAN TINGGI (DP KPT) TAHUN 2023 , 18-03-2023 sehingga 31-12-2023 , Universiti |
| PELANTIKAN SEBAGAI AHLI JAWATANKUASA PENILAIAN DI BAWAH DANA PENYELIDIKAN KEMENTERIAN PENDIDIKAN TINGGI (DP KPT) TAHUN 2024 , 16-12-2023 sehingga 31-12-2024 , Universiti |
| PENGERUSI SESI NANOSYM 2021 , 11-10-2021 sehingga 13-10-2021 , Universiti |
| PENILAI BEBAS KOLOKIUM SISWAZAH IMEN 2021 , 31-05-2021 sehingga 14-07-2021 , Fakulti / Institut / Pusat Perkhidmatan |
| PENILAI BEBAS KOLOKIUM SISWAZAH IMEN 2022 , 21-07-2022 sehingga 21-07-2022 , Fakulti / Institut / Pusat Perkhidmatan |
| PENILAI BEBAS KURSUS RRRR6014 SEM 1 2023/2024 , 02-08-2023 sehingga 02-08-2023 , Fakulti / Institut / Pusat Perkhidmatan |
| PENILAI HASIL KEMAJUAN PELAJAR - Balogun Bashir Temitope , 11-07-2023 sehingga 11-07-2023 , Fakulti / Institut / Pusat Perkhidmatan |
| PENILAIAN DANA INOVASI , 15-04-2019 sehingga 15-04-2019 , Pusat Pengajian / Jabatan / Pusat Penyelidikan / Unit |
| PENYELARAS KURSUS RARA6014 , 08-09-2014 sehingga 16-01-2015 , Fakulti / Institut / Pusat Perkhidmatan |
| Panel Penilai Geran Penyelidikan di bawah Dana UP Tahun 2022 , 01-06-2022 sehingga 31-12-2022 , Universiti |
| Panel Penilai Geran Penyelidikan di bawah Dana UP Tahun 2023 , 26-07-2023 sehingga 31-12-2023 , Universiti |
| Pembentangan Cadangan Penyelidikan Kursus RARA6014 , 20-06-2019 sehingga 20-06-2019 , Fakulti / Institut / Pusat Perkhidmatan |
| Pemeriksa Dalam Tesis Siswazah IMEN , 01-01-2019 sehingga 31-12-2019 , Fakulti / Institut / Pusat Perkhidmatan |
| Pengurusan IMEN 2024 , 13-10-2023 sehingga 12-10-2025 , Fakulti / Institut / Pusat Perkhidmatan |
| Penilaian Dalaman Bagi Permohonan Geran Universiti Penyelidikan (GUP), Geran Galakan Penyelidik Muda (GGPM) Dan Dana Impak Perdana (DIP) 2022 , 22-06-2022 sehingga 22-06-2022 , Fakulti / Institut / Pusat Perkhidmatan |
| SEMINAR PEMBENTANGAN CADANGAN PENYELIDIKAN KURSUS KAEDAH PENYELIDIKAN (SAINS DAN TEKNOLOGI) RARA 6014 , 11-01-2017 sehingga 11-01-2017 , Fakulti / Institut / Pusat Perkhidmatan |
| SEMINAR PEMBENTANGAN CADANGAN PENYELIDIKAN KURSUS RRRR6014 , 21-07-2021 sehingga 21-07-2021 , Fakulti / Institut / Pusat Perkhidmatan |
| SEMINAR PEMBENTANGAN CADANGAN PENYELIDIKAN KURSUS RRRR6014 , 10-02-2021 sehingga 10-02-2021 , Fakulti / Institut / Pusat Perkhidmatan |
| SEMINAR ‘INTRODUCTION TO ISO56000 STANDARD, A COMPREHENSIVE GUIDE TO IMPROVE ON INNOVATION MANAGEMENT SYSTEMS’ , 27-09-2024 sehingga 07-10-2024 , Fakulti / Institut / Pusat Perkhidmatan |
| SEMINAR ‘THE KEY CHALLENGES AND STRATEGIES IN UNIVERSITY - INDUSTRY COLLABORATIONS, PARTICULARLY FOCUSING ON INTELLECTUAL PROPERTY AND PATENT MANAGEMENT’ , 09-10-2024 sehingga 29-10-2024 , Fakulti / Institut / Pusat Perkhidmatan |
| Seminar Pembentangan Cadangan Penyelidikan Kursus RARA6014-Kaedah Penyelidikan (Sains & Teknologi), IMEN , 31-05-2018 sehingga 01-06-2018 , Fakulti / Institut / Pusat Perkhidmatan |