Muhammad Nubli Zulkifli, Izhan Abdullah, Nurul Hanis Azhan, Azman Jalar.  (2024).  Micromechanical and microstructure evolution of leaded (SnPb) and lead-free (SAC305 and SnCu) mixed solder joints during isothermal aging.  - Journal of Adhesion Science and Technology.  3842 - 3859. 

Adlil Aizat Ismail, Maria Abu Bakar, Azman Jalar, Zol Effendi Zolkefli, Erwan Basiron, Muhammad Nizam Ilias.  (2024).  Laser Rework Process for Efficient Lead-Free Solder Joints Ball Grid Array (BGA) Component Rework.  - IEEE Transactions on Components, Packaging and Manufacturing Technology.  735 - 742. 

Ahmad Zarif Azahar, Maria Abu Bakar, Azman Jalar, Fakhrozi Che Ani.  (2024).  Effect of Die Deflection during Au Wire Bonding Process on Bonding Quality in Overhang Semiconductor Package.  - Journal of Materials Engineering and Performance.  5836 - 5845. 

Maria Abu Bakar, Mohamad Solehin Mohamed Sunar, Azman Jalar, A Atiqah, Fakhrozi Che Ani, Ibrahym Ahmad, Zol Effendi Zolkefli.  (2023).  Effect of Sn Plating Thickness on Wettability, Solderability, and Electrical Connections of Electronic Lead Connectors for Surface Mount Technology Applications.  - Sains Malaysiana.  3247-3258. 

Ensaf Mohammed. Al-Khalqi, Muhammad Azmi Abdul Hamid, Naif H. Al-Hardan, Lim Kar Keng, Azman Jalar.  (2022).  Magnesium-doped ZnO nanorod electrolyte insulator semiconductor (EIS) sensor for detecting calcium ions.  - Journal of Materials Science: Materials in Electronics.  1618-1630. 

Abdul A Omar, Azman Jalar, Maria A Bakar, Khirullah A Hamid.  (2022).  Sulfur ingression on encapsulated leadframe of discrete semiconductor package.  - IEEE Transactions on Components, Packaging and Manufacturing Technology.  544-550. 

Mohamad Solehin Mohamed Sunar, Maria Abu Bakar, Azman Jalar, Mohamad Riduwan Ramli, Fakhrozi Che Ani.  (2022).  Effect of alloy particle size and stencil aperture shape on solder printing quality.  - Microelectronics International.  81-90. 

Fateh Amera Mohd Yusoff, Maria Abu Bakar, Azman Jalar.  (2022).  Temperature-Induced Thickness Reduction of Micromechanical Properties of Sn-0.7Cu Solder Alloy.  - Materiali in Tehnologije, Materials and Technology.  373-379. 

Adlil Aizat Ismail, Maria Abu Bakar, Abang Annuar Ehsan, Azman Jalar, Erwan Basiron, Fakhrozi Che Ani.  (2022).  Cardinal and Ordinal Directions Approach in Investigating Arrayed Solder Joints Crack Propagation of Ball Grid Array Semiconductor Packages.  - IEEE Transactions on Components Packaging and Manufacturing Technology.  1492-1501. 

Fateh Amera Mohd Yusoff, Maria Abu Bakar, Azman Jalar.  (2022).  Kesan Rawatan Termomekanik dengan Mampatan Tunggal terhadap Mikrostruktur dan Sifat Mikromekanik Aloi Pateri Sn-0.7Cu.  - Sains Malaysiana.  3775-3784. 

Norliza Ismail, Azman Jalar, Atiqah Afdzaluddin, Maria Abu Bakar.  (2021).  Electrical resistivity of Sn 3.0 Ag 0.5Cu solder joint with the incorporation of carbon nanotubes.  - Nanomaterials and Nanotechnology.  1-9. 

Nurul Adlin Mahadzir, Angela Amphawan, Tendai Masunda, P. Susthitha Menon, Azman Jalar, Maria Abu Bakar, Ahmad Ghadafi Ismail.  (2021).  Tapered waveguide design for mode conversion in mode division multiplexing (MDM).  - Optoelectronics and Advanced Materials Rapid Communications.  325-331. 

Syed Mohamad Mardzukey Syed Mohamed Zain, Azman Jalar, Maria Abu Bakar, Fakhrozi Che Ani, Mohamad Riduwan Ramli.  (2021).  Horizontal crack induced vertical crack formation in epoxy mold compound for electronic packaging.  - Journal of Microelectronics, Electronic Components and Materials.  261-266. 

Norliza Ismail, Azman Jalar, Wan Yusmawati Wan Yusoff, Nur Shafiqa Safee, Ariffin Ismail.  (2020).  Effect of Shock Wave on Constant Load Behaviour of Pb-Free/CNT Solder Joint.  - Sains Malaysiana.  3037-3044. 

Rabiah Al Adawiyah Ab Rahim, Muhammad Nubli Zulkifli, Azman Jalar, Atiqah Mohd Afdzaluddin, Kim Siow Shyong.  (2020).  Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS).  - Sains Malaysiana.  3045-3054. 

Norliza Ismail, Azman Jalar, Maria Abu Bakar, Roslina Ismail, Nur Shafiqa Safee, Ahmad Ghadafi Ismail, Najib Saedi Ibrahim.  (2019).  Kesan penuaan sesuhu terhadap sifat mikro kekerasan pempaterian Sn-Ag-Cu/CNT/Cu menggunakan pelekukan nano.  - Sains Malaysiana.  1267-1272. 

Maria Abu Bakar, Azman Jalar, Wan Yusmawati Wan Yusoff, Nur Shafiqa Safee, Ariffin Ismail, Norliza Ismail, Emee Marina Salleh, Najib Saedi Ibrahim.  (2019).  Kesan gelombang kejutan terhadap sifat mikromekanik sambungan Pateri SAC 0307/ENiG menggunakan pendekatan pelekukan nano.  - Sains Malaysiana.  1273-1279. 

Wan Yusmawati Wan Yusoff, Norliza Ismail, Nur Shafiqa Safee, Ariffin Ismail, Azman Jalar, Maria Abu Bakar.  (2019).  Correlation of microstructural evolution and hardness properties of 99.0Sn-0.3Ag-0.7Cu (SAC0307) lead-free solder under blast wave condition.  - Soldering & Surface Mount Technology.  102-108. 

Mohd Adly Rahmat Saat, Rozaidi Rasid, Maria Abu Bakar, Azman Jalar, Emee Marina Salleh.  (2019).  Mechanical properties of PE-PET-PS-PP blends produced by high shear mixing.  - Polimery.  676-679. 

Muhammad Nubli Zulkifli, Azman Jalar @ Jalil, Fuaida Harun.  (2019).  Effect of conventional and granular capillaries usage on the bondability, reliability, and manufacturability of gold wedge bonds.  - IEEE Transactions on Components Packaging and Manufacturing Technology.  763-769. 

M. A.Fatah M. Mukhtar, A. Abas, M. S. Haslinda, F. Che Ani, Azman Jalar @ Jalil, A. A. Saad, M. Z. Abdullah, R. Ismail.  (2019).  Effect of different S AC based nanoparticles types on the reflow soldering process of miniaturized component using discrete phase model simulation.  - Journal of Applied Fluid Mechanics.  1683-1696. 

Muhammad Nubli Zulkifli, Fuaida Harun, Azman Jalar @ Jalil.  (2019).  Effect of surface roughness and hardness of leadframe on the bondability of gold wedge bonds.  - Microelectronics International.  62-67. 

Izhan Abdullah, Muhammad Nubli Zulkifli, Azman Jalar @ Jalil, Roslina Ismail, Mohd Arrifin Ambak.  (2019).  Relationship of mechanical and micromechanical properties with microstructural evolution of sn-3.0ag-0.5cu (sac305) solder wire under varied tensile strain rates and temperatures.  - Journal of Electronic Materials.  2826-2839. 

Nor Rahafza Abdul Manap, Roslinda Shamsudin, Mohd Norhafsam Maghpor, Muhammad Azmi Abdul Hamid, Azman Jalar.  (2018).  Adsorption isotherm and kinetic study of gas-solid system of formaldehyde on oil palm mesocarp bio-char: Pyrolysis effect.  - Journal of Environmental Chemical Engineering.  . 

Maria Abu Bakar, Azman Jalar & Roslina Ismail.  (2018).  Kesan pigmen pewarna terhadap pertumbuhan sebatian antara logam sambungan pateri.  - Sains Malaysiana.  . 

Azman Jalar, Maria Abu Bakar, Roslina Ismail, Najib Saedi Ibrahim, Mohd Ariffin Ambak.  (2018).  Kesan pigmen pewarna terhadap pertumbuhan sebatian antara logam sambungan pateri Sn-3.0Ag-0.5Cu.  - Sains Malaysiana.  . 

Maria Abu Bakar, Azman Jalar & Roslina Ismail.  (2018).  Kesan kemasan permukaan berbeza terhadap sifat mikromekanik sambungan pateri sac 0307 menggunakan pendekatan pelekukan nano.  - Sains Malaysiana.  . 

Emee Marina Salleh, Zaifol Samsu, Norinsan Kamil Othman, Azman Jalar.  (2018).  Kesan suhu celupan ke atas mikrostruktur dan kekerasan salutan aluminium pada keluli karbon.  - Sains Malaysiana.  . 

Maria Abu Bakar, Azman Jalar, Roslina Ismail.  (2018).  Penilaian semula pengukuran kuantitatif stereometri terhadap pertumbuhan sebatian antara logam bagi sambungan pateri.  - Sains Malaysiana.  . 

Norliza Ismail, Azman Jalar, Maria Abu Bakar, Roslina Ismail.  (2018).  Kesan penambahan tiubnano karbon terhadap pertumbuhan lapisan sebatian antara logam sistem pateri Sn-Ag-Cu/Cu akibat penuaan terma.  - Sains Malaysiana.  . 

Emee Marina Salleh, Norinsan Kamil Othman & Azman Jalar.  (2018).  Electrochemical migration behaviour of SAC305 solder in various concentrations of sodium hydroxide solution.  - Sains Malaysiana.  . 

Maria Abu Bakar, Azman Jalar, Mohd Zulkifly Abdullah, Najib Saedi Ibrahim & Mohd Ariffin Ambak.  (2018).  Pengawalan pertumbuhan sebatian antara logam sambungan pateri-papan litar bercetak menggunakan salutan nikel.  - Sains Malaysiana.  . 

Zuraihana Bachok, Abdullah Aziz Saad,Fakhrozi Che Ani,Azman Jalar, Mohamad Aizat Abas.  (2018).  Structural assessment of lead free solder joint of miniaturized electronics assembly.  - International Journal of Integrated Engineering.  . 

Maria Abu Bakar, Azman Jalar, Mohd Zulkifly Abdullah, Najib Saedi Ibrahim, Mohd Ariffin Ambak.  (2018).  Controlling of intermetallic compound solder interconnection-printed circuit board using nickel coating.  - Sains Malaysiana.  . 

NNM Fedzir, WYW Yusoff, A Jalar.  (2017).  Effect of substrate pre-soldering temperature on wettability of SAC387 lead-free solder.  - Journal of Fundamental and Applied Sciences.  154-166. 

Nor Rahafza Abdul Manap, Roslinda Shamsudin, Mohd Norhafsam Maghpor, Muhammad Azmi Abdul Hamid & Azman Jalar.  (2017).  Sifat kinetik dan isoterma penjerapan formaldehid ke atas komposit serbuk serat kelapa sawit-TiO2.  - Sains Malaysiana.  953-965. 

Arash Dehzangi, Farhad Larki and Sawal Hamid Md Ali, Sabar Derita Hutagalung, Md Shabiul Islam, Mohd Nizar Hamidon, Susthitha Menon and Azman Jalar, Jumiah Hassan, Burhanuddin Yeop Majlis..  (2016).  Study of the side gate junctionless transistor in accumulation region..  - Microelectronics International.  61-67. 

Bakar M.A., Jalar A., Daud A.R., Ismail R., Lah N.A.C., Ibrahim N.S..  (2016).  Nanoindentation approach on investigating micromechanical properties of joining from green solder materials.  - Sains Malaysiana.  1275-1279. 

Che Ani F., Jalar A., Ismail R., Othman N.K., Khor C.Y., Samsudin Z., Abdullah M.Z., Azmi A..  (2016).  Backward Compatibility Solder Joint Formation at High Peak Reflow Temperature for Aerospace Applications.  - Arabian Journal for Science and Engineering.  1813-1823. 

M S ABDUL AZIZ, M Z ABDULLAH, C Y KHOR, A JALAR, M A BAKAR, W Y W YUSOFF, F CHE ANI, NOBE YAN, M ZHOU & C CHEOK.  (2015).  Effects of PCB thickness on adjustable fountain wave soldering.  - Sadhana.  2197-2220. 

Solhan Yahya , Norinsan Kamil Othman , Abdul Razak Daud , Azman Jalar , Roslina Ismail.  (2015).  The influence of temperature on the inhibition of carbon steel corrosion in acidic lignin.  - Anti-Corrosion Methods and Materials.  301-306. 

F Che Ani, A Jalar, R Ismail, NK Othman, MZ Abdullah, MS Abdul Aziz, CY Khor, M Abu Bakar.  (2015).  Reflow Optimization Process: Thermal Stress Using Numerical Analysis and Intermetallic Spallation in Backwards Compatibility Solder Joints.  - Arabian Journal for Science and Engineering.  1669-1679. 

Fuaida Harun, Roslina Ismail, Azman Jalar, Shahrum Abdullah.  (2015).  Effect of wire diameter and hook location on second bond failure modes.  - Microelectronics International.  32-36. 

Yahya S., Othman N.K., Daud A.R., Jalar A..  (2014).  Effect of scan rate on corrosion inhibition of carbon steel in the presence of rice straw extract - Potentiodynamic studies.  - Sains Malaysiana.  1083 - 1087. 

Solhan Yahya, Norinsan Kamil Othman, Abd Razak Daud, Azman Jalar.  (2014).  Effect of scan rate on corrosion inhibition of carbon steel in the presence of rice straw extract-potentiodynamic studies.  - Sains Malaysiana.  1083-1087. 

Azman Jalar, Nur Azida Che Lah, Norinsan Kamil Othman, Roslinda Shamsudin, Abdul Razak Daud, and Syed Roslee Sayd Bakar.  (2014).  Characterization of Oxide Growth on Surface of Al-Mg-Si Welded Joint.  - Advances in Materials Science and Engineering.  1-10. 

M. S. Abdul Aziz, M. Z. Abdullah, C. Y. Khor, A. Jalar, M. A. Bakar, W. Y. W. Yusoff, F. Che Ani, N. Yan, M. Zhou, C. Cheok.  (2014).  Implications of Adjustable Fountain Wave in Pin Through Hole Soldering Process.  - Arabian Journal for Science and Engineering.  9101-911. 

N. Mohamad, A. Jalar & N.K. Othman.  (2014).  Surface Morphology Study on Aluminum Alloy after Treated with Silicate-Based Corrosion Inhibitor from Paddy Residue.  - Sains Malaysiana.  935-940. 

Siew Peng Foo, Wan Yusmawati Wan Yusoff & Azman Jalar.  (2014).  Dimensional and Structural Stability of Gamma Irradiated Stacked Die Quad Flat No Leads (QFN).  - Sains Malaysiana.  827-832. 

Nurul Atikah Sharif, Azaman Jalar, Muhamad Izhar Sahri, Norinsan Kamil Othman.  (2014).  Effect of High Temperature Corrosion on Austenitic Stainless Steel Grade 304 in CO2 Gas at 700ºC.  - Sains Malaysiana.  1069-1075. 

S. YAHYA, N.K. OTHMAN*, A.R. DAUD & A. JALAR.  (2013).  Surface morphology studies of low carbon steel treated in aqueous lignin.  - Sains Malaysiana.  42(12):1793-1798. 

Lim, V; Amin, N; Foong, CS; Ahmad, I; Zaharim, A; Rasid, R; Jalar, A.  (2011).  Effects of different catalytic activation techniques on the thermal performance of flip chip heat spreader[Kesan teknik pengaktifan bermangkin berbeza terhadap prestasi terma penyebar haba cip balikan.  - Sains Malaysiana.  40(2):181-190. 

Victor Lim, Nowshad Amin, C.S. Foong, Ibrahim Ahmad, Azami Zaharim, Rozaidi Rasid & Azman Jalar.  (2011).  Kesan Teknik Pengaktifan Bermangkin Berbeza Terhadap Prestasi Terma Penyebar Haba Cip Balikan.  - Sains Malaysiana.  40(2):181-190. 

Z. Kornain, A. Jalar, R. Rashid , S. Abdullah, B. Lee.  (2010).  Comparative study of phenolic-based and amine-based underfill materials in flip chip plastic ball grid array package.  - Journal of Electronic Packaging, Transactions of the ASME.  132(4):1012-1017. 

Abdullah, S; Ariffin, AK; Nizwan, CKE; Abdullah, MF; Jalar, A; Yunoh, MFM.  (2010).  Failure Analysis Of A Semiconductor Packaging Leadframe Using The Signal Processing Approach.  - International Journal Of Modern Physics B.  24(1-2):175-172. 

Saud, N., Jalar, A..  (2010).  Sn-rich phase coarsening during isothermal annealing for as-soldered Sn-Ag-Cu solder.  - Journal of Materials Science: Materials in Electronics.  21(10):1083-1089. 

S. Abdullah, M. F. Abdullah, A. K. Ariffin, A. Jalar.  (2009).  Effect of leadframe oxidation on the reliability of a quad flat no-lead package.  - Journal of Electronic Packaging (Transaction of the ASME).  131(3):0310021-0310027 . 

Saud N., Jalar A..  (2009).  Sn-rich phase coarsening during isothermal annealing for as-soldered Sn-Ag-Cu solder.  - Journal of Materials Science: Materials in Electronics.  21(10):1083-1089. 

Fatimah Hasim S.N., Abdul Hamid M.A., Shamsudin R., Jalar A..  (2009).  Synthesis and characterization of ZnO thin films by thermal evaporation.  - Journal of Physics and Chemistry of Solids.  70(12):1501-1504. 

Karen M.C. Wong, A.R. Daud, and Azman Jalar .  (2009).  Microhardness and Tensile Properties of a 6XXX Alloy Through Minor Additions of Zr.  - Journal of Materials Engineering and Performance.  18(1):62-65. 

Norliza Ismail, Muhammad Azmi Abdul Hamid & Azman Jalar.  (2009).  Microstructural characterization of Au-In thin film deposited by electron beam evaporation.  - Sains Malaysiana.  38(1):91-94.