Norliza Ismail, Azman Jalar, Atiqah Afdzaluddin, Maria Abu Bakar.  (2021).  Electrical resistivity of Sn 3.0 Ag 0.5Cu solder joint with the incorporation of carbon nanotubes.  - Nanomaterials and Nanotechnology.  1-9. 

Atiqah Mohd Afdzaluddin, Maria Abu Bakar.  (2020).  Effect of coating element on joining stability of Sn-0.3Ag-0.7Cu solder joint due to aging test.  - Sains Malaysiana.  3029-3036. 

Rabiah Al Adawiyah Ab Rahim, Muhammad Nubli Zulkifli, Azman Jalar, Atiqah Mohd Afdzaluddin, Kim Siow Shyong.  (2020).  Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS).  - Sains Malaysiana.  3045-3054.