Penerbitan SCOPUS/ERA

xu long, ying guo, yutai su, kim s. siow, chuantong chen.  (2022).  constitutive creep and fatigue behavior of sintered ag for finite element simulation of mechanical reliability a critical review.  - journal of materials science-materials in electronics.  2293-2309. 

naeem ahmed, asad masood, kim s. siow, m. f. mohd razip wee, farah farhanah haron, anuttam patra, nafarizal nayan & chin fhong soon.  (2022).  effects of oxygen (o2) plasma treatment in promoting the germination and growth of chili.  - plasma chem plasma processing.  91-108. 

esa sr, omar g, sheikh md fadzullah sh, siow ks, abdul rahim b.  (2021).  the evolutions of microstructure in pressureless sintered silver die attach material.  - international journal of nanoelectronics and materials.  179-194. 

chen tiam foo, siow kim shyong.  (2021).  comparing the mechanical and thermal-electrical properties of sintered copper (cu) and sintered silver (ag) joints.  - journal of alloys and compounds.  1-19. 

a. suhaimi , e. mahmoudi, k. s. siow, a. w. mohammad, m. f. mohd razip wee.  (2021).  nitrogen incorporation by plasma polymerization of heptylamine on pes membrane for removal of anionic dye (congo red).  - international journal of environmental science and technology.  1443-1452. 

naeem ahmed , asad masood , kim s. siow , m. f. mohd razipwee , r.z. auliya, w. k. ho.  (2021).  effect of h2o-based low-pressure plasma (lpp) treatment on the germination of bambara groundnut seeds.  - agronomy.  1-16. 

siow kim shyong, arifah rahman, amnani aminuddin, pei yuen ng.  (2021).  effect of sulfur on nitrogen containing plasma polymers in promoting osteogenic differentiation of wharton jelly mesenchymal stem cells.  - sains malaysiana.  3499-3510. 

yanliang shan, yunhui mei,, meiyu wang, xin li, yanhong tian, gang chen, siow kim shyong.  (2021).  ratcheting behavior of sintered copper joints for electronic packaging.  - ieee transactions on components, packaging and manufacturing technology.  983-989. 

akmal suhaimi, ebrahim mahmoudi, rhonira latif, kim s. siow, m. hazani m. zaid, abdul wahab mohammad, m.f. mohd razip wee.  (2021).  superhydrophilic organosilicon plasma modification on pes membrane for organic dyes filtration.  - journal of water process engineering.  102-352. 

s. r. esa, g. omar, s. h. sheikh md fadzullah, k. s siow, b. abdul rahim, b. cosut.  (2020).  diffusion mechanism of silver particles in polymer binder for die attach interconnect technology.  - international journal of nanoelectronics and materials.  461-472. 

kim s. siow, arifah syahirah abdul rahman, pei yuen ng, burhanuddin y. majlis.  (2020).  sulfur and nitrogen containing plasma polymers reduces bacterial attachment and growth.  - materials science and engineering c.  11022-11026. 

rabiah al adawiyah ab rahim, muhammad nubli zulkifli, azman jalar, atiqah mohd afdzaluddin, kim siow shyong.  (2020).  effect of isothermal aging and copper substrate roughness on the sac305 solder joint intermetallic layer growth of high temperature storage (hts).  - sains malaysiana.  3045-3054. 

nur aizat kamarulzaman, khai ern lee, kim shyong siow, mazlin mokhtar.  (2020).  public benefit and risk perceptions of nanotechnology development: psychological and sociological aspects.  - technology in society.  1-9. 

mohd syafiq faiz, mahmoud addouche, ahmad rifqi md zain,kim s. siow, amar chaalane, abdelkrim khelif.  (2020).  experimental demonstration of a multichannel elastic wave filter in a phononic crystal slab.  - applied sciences.  1-11. 

a. suhaimi, e. mahmoudi, k.s. siow, m.f. mohd razip wee.  (2020).  surface modification of polyamide ultrafiltration membrane by plasma polymerisation of acrylic acid.  - sains malaysiana.  3097-3104. 

mohd syafiq faiz, kim s. siow, mf mohd razip wee, muhammad musoddiq jaafar, burhanuddin yeop majlis, ahmad rifqi md. zain.  (2020).  theoretical demonstration of elastic wave guiding in a pillar-based phononic crystal slab.  - international journal of nanoelectronics and materials.  83-90. 

siow k.s., chua s.t..  (2020).  thermal ageing studies of sintered micron-silver (ag) joint as a lead-free bonding material.  - metals and materials international.  1404-1414. 

siow ks, chua st.  (2019).  thermal cycling of sintered silver (ag) joint as die-attach material.  - jom.  3066-3075. 

meyghani b, awang m, emamian s, plank b, christoph h, siow ks,.  (2019).  stress analysis of nano porous material using computed tomography images.  - materialwissenschaft und werkstofftechnik. 

kim s.siow, leanne britcher, sunil kumar, hans j.griesser.  (2019).  qcm-d and xps study of protein adsorption on plasma polymers with sulfonate and phosphonate surface groups.  - colloids and surfaces b: biointerfaces. 

siow, k.s., chua, s.t., beake, b.d., zuruzi, a.s..  (2019).  influence of sintering environment on silver sintered on copper substrate.  - journal of materials science: electronic materials. 

nur aizat kamarulzaman, khai ern lee, kim shyong siow, mazlin mokhtar.  (2019).  psychological and sociological perspectives for good governance of sustainable nanotechnology development in malaysia.  - journal of nanoparticle research.  1-21. 

muhammad izzuddin abd samad, muhamad ramdzan buyong, shyong siow kim, burhanuddin yeop majlis.  (2019).  dielectrophoresis velocities response on tapered electrode profile: simulation and experimental.  - microelectronics international.  45-53. 

b. meyghani, m. awang, p. bokam, b. plank, c. heinzl, k. s. siow.  (2019).  finite element modeling of nano porous sintered silver material using computed tomography images.  - material science and engineering technology.  533-538. 

yijing xie, yanjie wang, yunhui mei, haining xie, kun zhang, shuangtao feng, kim s siow, xin li, guo-quan lu,.  (2018).  rapid sintering of nano-ag paste at low current to bond large area (> 100 mm2) power chips for electronics packaging.  - journal of materials processing technology.  644-649. 

mohd amir zulkefli, mohd ambri mohamed, kim s. siow, burhanuddin yeop majlis.  (2018).  peranti suis sistem nanoelektromekanik (nems) berunsurkan grafin dan tiub nano karbon (cnt).  - sains malaysiana.  619-633. 

siow kim shyong, chen tiam foo, yong zhen xin.  (2018).  triz trends of engineering system evolution of silver sinter-ing tools used to produce power module in hybrids and electric vehicles.  - international journal of engineering & technology. 

kim s. siow, leanne britcher, sunil kumar, hans j griesser.  (2018).  xps study of sulfur and phosphorus compounds with different oxidation states.  - sains malaysiana. 

nur aizat kamarulzaman, khai ern lee, kim shyong siow.  (2018).  public perception of nanotechnology for good governance: a conceptual framework for psychological and sociological approaches.  - journal of food, agriculture and environment. 

mohd amir zulkefli, mohd ambri mohamed, kim s. siow, burhanuddin yeop majlis, jothiramalingam kulothungan, manoharan muruganathan, hiroshi mizuta.  (2018).  stress analysis of perforated graphene nano-electro-mechanical (nem) contact switches by 3d finite element simulation.  - microsystem technologies.  1179-1187. 

kim s. siow.  (2018).  low pressure plasma modifications for the generation of hydrophobic coatings for biomaterials applications.  - plasma processes and polymers. 

kim s siow, leanne britcher, sunil kumar, hans griesser.  (2017).  plasma polymers containing sulfur and their co-polymers with 1,7-octadiene: chemical and structural analysis.  - plasma processes and polymers.  16000-16004. 

kim siow.  (2017).  pengelupasan grafit untuk mengkomersilkan teknologi grafin.  - sains malaysiana.  1047-1059. 

siow ks.  (2017).  pengelupasan grafit untuk mengkomersilkan teknologi grafin.  - sains malaysiana.  1047-1059. 

mohd amir zulkefli, mohd ambri mohamed, k. s. siow, burhanuddin yeop majlis, jothiramalingam kulothungan, manoharan murugunathan, hiroshi mizuta.  (2017).  three-dimensional finite element method simulation of perforated graphene nano-electro-mechanical (nem) switches.  - micromachines.  1-16. 

tiam foo chen, kim shyong siow, pei yuen ng, burhanuddin yeop majlis.  (2017).  enhancing the biocompatibility of the polyurethane methacrylate and off-stoichiometry thiol-ene polymers by argon and nitrogenplasma treatment.  - materials science and engineering c.  613-621. 

d wang, yh mei, h xie, k zhang, ks siow, x li, gq lu,.  (2017).  roles of palladium particles in enhancing the electrochemical migration resistance of sintered nano-silver paste as a bonding material.  - materials letters.  1-4. 

st chua, ks siow.  (2016).  microstructural studies and bonding strength of pressureless sintered nano-silver joints on silver, direct bond copper (dbc) and copper substrates aged at 300 c.  - journal of alloys and compounds.  486-498. 

chan yw, siow ks, ng py, u gires, burhanuddin ym.  (2016).  plasma polymerized carvone as an antibacterial and biocompatible coating.  - materials science and engineering c.  861-871. 

kim s siow, y t lin.  (2016).  identifying the development state of sintered silver (ag) as a bonding material in the microelectronic packaging via a patent landscape study.  - journal of electronic packaging.  1-13. 

tf chen, k s siow, py ng, mh nai, ct lim and by majlis.  (2016).  ageing properties of polyurethane methacrylate and off-stoichiometry thiol-ene polymers after nitrogen and argon plasma treatment.  - journal of applied polymer science.  1-12. 

razip wee, m.f.m, addouche m., siow, k.s., md zain, a.r., elayouch, a., chollet, f., khelif, a..  (2016).  guiding and confinement of interface acoustic waves in solid-fluid pillar-based phononic crystals.  - aip advances.  121-703. 

kim s siow, sunil kumar and hans griesser.  (2015).  low pressure plasma methods for generating non reactive hydrophilic and hydrogel like bio interface coatings a review.  - plasma processes and polymers.  8. 

abu samah zuruzi, kim s siow.  (2015).  electrical conductivity of porous silver made from silver nanoparticles.  - electronic materials letter.  315-321. 

kim s siow,.  (2014).  deposition and xps and ftir analysis of plasma polymer coatings containing phosphorus.  - plasma processes and polymers.  11(2):133-141. 

kim s siow.  (2014).  are sintered silver joints ready for use as interconnect material in microelectronic packaging?.  - journal of electronic materials.  43(4):947-961.