fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2022).  temperature-induced thickness reduction of micromechanical properties of sn-0.7cu solder alloy.  - materiali in tehnologije, materials and technology.  373-379. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, erwan basiron, fakhrozi che ani.  (2022).  cardinal and ordinal directions approach in investigating arrayed solder joints crack propagation of ball grid array semiconductor packages.  - ieee transactions on components packaging and manufacturing technology.  1492-1501. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, john burke, zol effendi zolkefli, erwan basiron.  (2022).  effect of heat shield locations on rework-induced thermal management in ball grid array solder joint.  - scientific reports.  1-12. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, zol effendi zolkefli.  (2022).  thermal-induced damage on solder joints of high-density adjacent ball grid array components during the rework process.  - jurnal teknologi.  1-8. 

ahmad syazili md din, maria abu bakar, fakhrozi che ani, mohamad riduwan, muhamed abdul fatah muhamed mukhtar.  (2022).  kesan kadar suapan dan salutan bit pemotong dan terhadap kekemasan proses pemotongan pcb.  - jurnal teknologi.  119-126. 

mohamad solehin mohamed sunar, maria abu bakar, azman jalar, mohamad riduwan ramli, fakhrozi che ani.  (2022).  effect of alloy particle size and stencil aperture shape on solder printing quality.  - microelectronics international.  81-90. 

maria abu bakar, atiqah mohd afdzaluddin, azman jalar.  (2022).  review on corrosion in electronic packaging trends of collaborative between academia-industry.  - sustainability.  1-33. 

saraswathy supramaniam, maria abu bakar, azman jalar.  (2022).  early corrosion detection of cu-ag wedge bonding in semiconductor package.  - journal of failure analysis and prevention.  2317-2325. 

abdul a omar, azman jalar, maria a bakar, khirullah a hamid.  (2022).  sulfur ingression on encapsulated leadframe of discrete semiconductor package.  - ieee transactions on components, packaging and manufacturing technology.  544-550. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2022).  kesan rawatan termomekanik dengan mampatan tunggal terhadap mikrostruktur dan sifat mikromekanik aloi pateri sn-0.7cu.  - sains malaysiana.  3775-3784. 

syed mohamad mardzukey syed mohamed zain, azman jalar, maria abu bakar, fakhrozi che ani, mohamad riduwan ramli.  (2021).  horizontal crack induced vertical crack formation in epoxy mold compound for electronic packaging.  - journal of microelectronics, electronic components and materials.  261-266. 

nurul adlin mahadzir, angela amphawan, tendai masunda, p. susthitha menon, azman jalar, maria abu bakar, ahmad ghadafi ismail.  (2021).  tapered waveguide design for mode conversion in mode division multiplexing (mdm).  - optoelectronics and advanced materials rapid communications.  325-331. 

norliza ismail, azman jalar, atiqah afdzaluddin, maria abu bakar.  (2021).  electrical resistivity of sn 3.0 ag 0.5cu solder joint with the incorporation of carbon nanotubes.  - nanomaterials and nanotechnology.  1-9. 

azman jalar, maria abu bakar, roslina ismail.  (2020).  temperature dependence of elastic-plastic properties of fine-pitch sac 0307 solder joint using nanoindentation approach.  - metallurgical and materials transactions a-physical metallurgy and material.  1221-1228. 

atiqah mohd afdzaluddin, maria abu bakar.  (2020).  effect of coating element on joining stability of sn-0.3ag-0.7cu solder joint due to aging test.  - sains malaysiana.  3029-3036. 

norliza ismail, azman jalar, maria abu bakar, nur shafiqa safee, wan yusmawati wan yusoff, ariffin ismail.  (2020).  microstructural evolution and micromechanical properties of sac305/cnt/cu solder joint under blast wave condition.  - soldering & surface mount technology.  47-56. 

norliza ismail, azman jalar, maria abu bakar, roslina ismail, najib saedi ibrahim.  (2020).  effect of flux functional group for solder paste formulation towards soldering quality of sac305/cnt/cu.  - soldering & surface mount technology.  157-164. 

norliza ismail, maria abu bakar, saiful bahari bakarudin.  (2020).  effect of temperature on strain-induced hardness of lead-free solder wire using nanoindentation approach.  - sains malaysiana.  3073-3080. 

hazian mamat, azman jalar, maria abu bakar.  (2019).  characterization on ph-isfet poly bisphenol hydrophobic encapsulation material.  - asm science journal.  65-70. 

maria abu bakar, azman jalar, wan yusmawati wan yusoff, nur shafiqa safee, ariffin ismail, norliza ismail, emee marina salleh, najib saedi ibrahim.  (2019).  kesan gelombang kejutan terhadap sifat mikromekanik sambungan pateri sac 0307/enig menggunakan pendekatan pelekukan nano.  - sains malaysiana.  1273-1279. 

wan yusmawati wan yusoff, norliza ismail, nur shafiqa safee, ariffin ismail, azman jalar, maria abu bakar.  (2019).  correlation of microstructural evolution and hardness properties of 99.0sn-0.3ag-0.7cu (sac0307) lead-free solder under blast wave condition.  - soldering & surface mount technology.  102-108. 

mohd adly rahmat saat, rozaidi rasid, maria abu bakar, azman jalar, emee marina salleh.  (2019).  mechanical properties of pe-pet-ps-pp blends produced by high shear mixing.  - polimery.  676-679. 

norliza ismail, azman jalar, maria abu bakar, roslina ismail, nur shafiqa safee, ahmad ghadafi ismail, najib saedi ibrahim.  (2019).  kesan penuaan sesuhu terhadap sifat mikro kekerasan pempaterian sn-ag-cu/cnt/cu menggunakan pelekukan nano.  - sains malaysiana.  1267-1272. 

izhan abdullah, azman jalar, roslina ismail, maria abu bakar, muhammad nubli zulkifli,emee marina salleh.  (2019).  effect of tensile direction on microstructure evolution of sac305 solder wire.  - asm science journal.  53-59. 

maria abu bakar, azman jalar, mohd zulkifly abdullah, najib saedi ibrahim & mohd ariffin ambak.  (2018).  pengawalan pertumbuhan sebatian antara logam sambungan pateri-papan litar bercetak menggunakan salutan nikel.  - sains malaysiana.  . 

maria abu bakar, azman jalar, mohd zulkifly abdullah, najib saedi ibrahim, mohd ariffin ambak.  (2018).  controlling of intermetallic compound solder interconnection-printed circuit board using nickel coating.  - sains malaysiana.  .