Prosiding Terindeks

m. s. mohamed sunar, m. abu bakar, a. jalar, f. che ani, m . r. ramli.  (2022).  effect of stencil wall aperture on solder paste release via stencil printing.  - international conference on electronic and advanced materials (iceam 2021) - journal of physics: conference series.  1-6. 

nik ahmad nizam nik zainuddin, nur yashidar mohamad yasin, nur syazreen ardnan, chee keat gan, mohd fakrul naim muhammad zin, azman jalar.  (2022).  voltage bias enhancement for leakage test on discrete products to detect low contact.  - 39th international electronics manufacturing technology conference (iemt).  1-5. 

p. vijayakumaran, m. h. m. ramli, m. selvam, k. hamid, a. atiqah, a. jalar, m. a. bakar.  (2022).  reduce wafer remnants through pre-assembly process optimization.  - international conference on electronic and advanced materials (iceam 2021).  1-5. 

m. f. suhaimi, m. abu bakar, a. jalar, f. che ani, m. r. ramli.  (2022).  thermal cycling effect on the crack formation of solder joint in ball grid array package.  - international conference on electronic and advanced materials (iceam 2021) journal of physics: conference series.  1-5. 

fateh ameera mohd yusoff, maria abu bakar, azman jalar.  (2022).  effect of 60% thickness reduction of sn-cu solder alloy on localized micromechanical properties via nanoindentation approach.  - international conference on electronic and advanced materials (iceam 2021).  1-5. 

a. atiqah, r.a.a.a. rahim, a. jalar, k. s. siow.  (2022).  influence of copper substrate roughness on the growth of intermetallic compounds layer in sac305 solder joints.  - international conference on electronic and advanced materials (iceam 2021).  1-6. 

khirullah abdul hamid, aiman hakim badarisman, azman jalar, maria abu bakar.  (2022).  investigation of integrated factors in the occurrence of copper wire bonding corrosion of semiconductor packages.  - international conference on electronic and advanced materials 2021 (iceam 2021).  1-5. 

aiman hakim badarisman, khirullah abdul hamid, hamizan ideris, maria abu bakar, azman jalar.  (2022).  effects of molding temperature on delamination of small outline transistor (sot).  - international conference on electronic and advanced materials (iceam 2021).  1-7. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, fakhrozi che ani, zol effendi zolkefli.  (2022).  effects of underfill materials on behavior of intermetallic compound thickness of ball grid array solder joints using anova.  - 2022 ieee 39th international electronics manufacturing technology conference (iemt).  1-5. 

khirullah abdul hamid, aiman hakim badarisman, azman jalar, maria abu bakar.  (2022).  effects of electrolyte towards copper wire metallurgical interconnection in semiconductor.  - international conference on electronic and advanced materials (iceam 2021).  1-6. 

syed mohamad mardzukey syed mohamed zain, fakhrozi che ani, mohamad riduwan ramli, azman jalar, maria abu bakar.  (2021).  effect of moisture content on crack formation during reflow soldering of ball grid array (bga) component.  - the international conference on innovative technology, engineering and sciences 2020 (icites 2020).  309-314. 

noor fadhilah rahmat, wan yusmawati wan yusoff, azman jalar, azuraida amat, irman abdul rahman, najib saedi ibrahim.  (2021).  effect of gamma radiation on micromechanical behaviour of sac305 solder.  - 7th international conference on solid state science and technology (icssst 2019).  535-540. 

joon shyan tan, wai wai lee, a. atiqah, khirullah abdul hamid, azman jalar, maria abu bakar.  (2021).  the effect of electrolytic deflash current on delamination of epoxy mold compound during tin plating process.  - 2021 ieee regional symposium on micro and noelectronics (rsm).  73-75. 

azman jalar, syed mohamad mardzukey syed mohamed zain, fakhrozi che ani, mohamad riduwan ramli, maria abu bakar.  (2021).  effect of potting encapsulation on crack formation and propagation in electronic package.  - the international conference on innovative technology, engineering and sciences 2020 (icites 2020).  351-357. 

khirullah abdul hamid, maria abu bakar, azman jalar, aiman hakim badarisman.  (2021).  incorporation of big data in methodology of identifying corrosion factors in the semiconductor package.  - 2021 international conference on electrical, communication, and computer engineering (icecce).  1-4. 

nadia nor ahmad taufiq, khirullah abdul hamid, aiman hakim badarisman, hamizan ideris, azman jalar, maria abu bakar.  (2021).  elucidation of metal etching defects through the experimental design process characterization at encapsulation and electro-deflashing processes.  - 2021 ieee regional symposium on micro and nanoelectronics (rsm).  69-72. 

nur shafiqa safee, wan yusmawati wan yusoff, ariffin ismail, norliza ismail, maria abu bakar, azman jalar.  (2020).  effect of blast wave on intermetallics formation, hardness and reduced modulus properties of solder joints.  - 30th regional conference of solid state science and technology (solid state phenomena).  31-36. 

maria abu bakar, azman jalar, norliza ismail1, ahmad ghadafi ismail, najib saedi ibrahim.  (2020).  solderability of coloured lead free solder composite.  - 30th regional conference of solid state science and technology (solid state phenomena).  15-19. 

azman jalar, maria abu bakar, mohd. zulhakimi ab. razak, norliza ismail.  (2020).  morphological effect on the intermetallic compound layer growth kinetics of metallurgical joining.  - 30th regional conference of solid state science and technology (solid state phenomena).  26-30. 

norliza ismail, maria abu bakar, azman jalar, muhammad amer hariths jasmin.  (2019).  mechanical properties of sn based lead free solder under different temperature.  - iop conference series: materials science and engineering.  1-5. 

h. mamat, a. tuhaime, azman jalar @ jalil.  (2019).  the study on effect of colour electrolyte reference electrode.  - 2018 ieee conference on open systems (icos).  60-64. 

hazian mamat, a tuhaime, azman jalar.  (2018).  the study on effect of colour electrolyte reference electrode.  - ieee conference on open systems, icos 2018. 

c. sarveswaran, emee marina salleh, a. jalar, z. samsudin, m. yusuf tura ali, f. che ani and n. k. othman.  (2017).  investigation of corrosion on sac 305, sac 0307 and sac 0307-0.03 p-0.005 ni solder paste alloys in simulated body fluid (sbf).  - american institute of physics (aip) conference proceedings. 

ismail r., harun f., jalar a., abdullah s..  (2016).  mechanical interlocking on leadframe surface for bondability of au wedge bond.  - materials science forum.  79-82. 

muhammad nubli zulkifli, azman jalar, shahrum abdullah & nurinsan kamil othman.  (2016).  bondability and strength evaluation of gold ball bond using nanoindentation approach.  - key engineering materials.  132-141. 

wan yusmawati wan yusmawati, azman jalar, norinsan kamil othman & irman abdul rahman.  (2016).  nanoindentation study on heat treated gold wire bonding.  - materials science forum.  31-35. 

norinsan kamil othman, koh yunn teng, azman jalar, fakhrozi che ani and zamri samsudin.  (2016).  electrochemical migration behaviours of low silver content solder alloy sac 0307 on printed circuit boards (pcbs) in nacl solution.  - materials science forum.  3-12. 

l.y. ang, n.k. othman, a. jalar, i. ismail.  (2016).  the effect of magnetic field on corrosion inhibitor of copper in 0.5 m hcl solution.  - procedia chemistry.  222-227. 

bakar m.a., jalar a., ismail r., daud a.r..  (2016).  nanoindentation of sn3.0ag0.5cu/enig solder joint after high temperature storage.  - materials science forum.  40-43. 

said, f.a., menon, p.s. , nawi, m.n., md zain, a.r., jalar, a., majlis, b.y..  (2016).  copper-graphene spr-based biosensor for urea detection.  - 12th ieee international conference on semiconductor electronics, icse 2016.  264-267. 

ismail n., ismail r., nik ubaidillah n.k.a., jalar a., zain n.m..  (2016).  surface roughness and wettability of sac/cnt lead free solder.  - materials science forum.  73-75. 

ismail r., harun f., jalar a., abdullah s..  (2016).  ultrasonic vibration in leadframe for the bondability for au wedge bond.  - materials science forum.  83-86. 

ismail n., ismail r., abd aziz n.i., jalar a..  (2016).  wettability of cnt-doped solder under isothermal aging.  - materials science forum.  76-78. 

bakar m.a., jalar a., ismail r., daud a.r..  (2016).  directional growth behaviour of intermetallic compound of sn3.0ag0.5cu/imsn subjected to thermal cycling.  - materials science forum.  36-39. 

tarumaraja, k.a., menon, p.s. , said, f.a. , jamil, n.a., ehsan, a.a., shaari, s., majlis, b.y., jalar, a..  (2016).  fdtd numerical analysis of spr sensing using graphene-based photonic crystal.  - 2th ieee international conference on semiconductor electronics, icse 2016.  79-81. 

st chua, ks siow, a. jalar.  (2015).  effect of sintering atmosphere on the shear properties of pressureless sintered silver joint.  - 36th ieee international electronics manufacturing technology conference.  1-6. 

chua st, siow ks, jalar a.  (2014).  effect of sintering atmosphere on the shear properties of pressureless sintered silver joint.  - 36th international electronics manufacturing technology conference,. 

foo s.p., siow k.s., a. jalar.  (2014).  synthesizing snagcu nanoparticles by electrodeposition of reverse microemulsion electrolyte.  - 2014 ieee international conference on semiconductor electronics (icse 2014).  513-516. 

azman jalar , wan yusmawati wan yusoff, norinsan kamil othman, irman abdul rahman.  (2014).  effects of thermal cycling on the mechanical properties of gold wire bonding.  - international conference on semiconductor electronics, icse 2014. 

farhad larki, arash dehzangi, sawal hamid md ali, azman jalar, md. shabiul islam, burhanuddin y. majlis, mohd nizar hamidon..  (2014).  dependency of electrical characteristics on nano gap variation in pinch off lateral gate transistors.  - 2014 ieee international conference on semiconductor electronics (icse 2014).  170-173. 

l. y. ang, n. k. othman, a. jalar, and i. ismail.  (2014).  the effect of magnetic field on copper in various corrosive medium.  - aip conference proceedings - the 2014 ukm fst postgraduate colloquium.  26-29. 

mz muzakkar, s ahmad, ma yarmo, a jalar, m bijarimi.  (2013).  shear strength of single lap joint aluminium-thermoplastic natural rubber (al-tpnr) laminated composite.  - journal of physics: conference series.  1-6. 

arash dehzangi,farhad larki, burhanuddin y. majlis, m.n. hamidon,p. susthitha menon, azman jalar, md. shabiul isla.  (2013).  numerical investigation of channel width variation in junctionless transistors performance.  - 2013 ieee regional symposium on micro and nano electronics, rsm 2013; langkawi; malaysia.  101-104. 

nurul atikah shariff, norinsan kamil othman and azman jalar.  (2013).  oxidation behaviour of ferritic stainless steel grade crofer 22 apu at 700 °c in flowing ar-75%co2-12%h2o.  - aip conference proceedings -ukm fst postgraduate colloquium. 

hamisah ismail, roslinda shamsudin, muhammad azmi abdul hamid dan azman jalar.  (2013).  synthesis and characterisation of nano wollastonite from rice husk ash and limestone..  - materials science forum, transtech publication switzerland. 

rabiahtul zulkafli, norinsan kamil othman, and azman jalar.  (2013).  influence of temperature on corrosion inhibition for carbon steel by rice straw extract in hcl solution: synergistic effect of cationic surfactant.  - aip conference proceedings -ukm fst postgraduate colloquium. 

m. y. zulkafli, n. k. othman, a. m. lazim and a. jalar.  (2013).  inhibitive effects of palm kernel oil on carbon steel corrosion by alkaline solution.  - aip conference proceedings -ukm fst postgraduate colloquium. 

n. mohamad, n. k. othman, and a. jalar.  (2013).  investigation of sio2 :na2o ratio as a corrosion inhibitor for metal alloys.  - aip conference proceedings -ukm fst postgraduate colloquium. 

s. yahya, n. k. othman, a. r. daud, and a. jalar.  (2013).  the inhibition of carbon steel corrosion by lignin in hcl and h2 so4.  - aip conference proceedings-ukm fst postgraduate colloquium. 

denni asra awizar, norinsan kamil othman, abdul razak daud, azman jalar and rabiahtul zulkafli.  (2013).  the performance of nanosilicate from rice husk ash as green corrosion inhibitor for carbon steel in 0.5m hcl.  - materials science forum / trans tech publications, switzerland. 

wan yusmawati wan yusoff, azman jalar, norinsan kamil othman dan irman abdul rahman.  (2013).  gamma-irradiation effect on material properties behaviour of semiconductor package.  - 2012 national physics conference, perfik 2012; bukit tinggi, pahang; malaysia-(aip conference proceedings).  300-305. 

nurul atikah shariff, norinsan kamil othman, azman jalar, muhammad azmi abdul hamid dan irman abdul rahman.  (2013).  high temperature corrosion of welded ferritic stainless steel in flowing co2 gas.  - 2012 national physics conference, perfik 2012; bukit tinggi, pahang; malaysia aip conference proceedings - 2012 national physics conference.  351-355. 

kar keng lim, muhammad azmi abdul hamid, roslinda shamsudin, azman jalar dan n.h. al hardan.  (2013).  synthesis and characterization of grape-like sno2 structures grown by a thermal evaporation method.  - materials science forum, trans tech publications, switzerland. 

muhammd nubli zulkifli, azman jalar, shahrum abdullah, roslinda shamsudin and rozli zulkifli.  (2012).  hardness variation of ball bond wire bonding.  - advanced materials research. 

ahmad mulia hafizayatullah amiruddina, roslinda shamsudin, azman jalar and muhammad azmi abdul hamidd.  (2012).  single layer brushite coating onto stainless steel substrate using dipcoating technique..  - advanced materials research. 

siti nuurul fatimah hasim, muhammad azmi abdul hamid, roslinda shamsudin, shahidan radiman & azman jalar.  (2012).  surface morphology of metal oxide sno2 under different concentrations of oxygen by thermal evaporation method.  - 26th regional conference on solid state science and technology, rcssst 2011;seremban, negeri sembilan (advanced materials research). 

s. nurul atikah, n.k. othman and a. jalar.  (2012).  high temperature corrosion of fe-30cr in flowing co2 gas.  - 26th regional conference on solid state science and technolog,seremban(yadvanced materials research). 

azman jalar, wan yusmawati wan yusoff, norinsan kamil othman, shahrum abdullah and irman abdul rahman.  (2012).  gamma irradiation effect on load-deflection curve of semiconductor package.  - advanced materials research. 

a. jalar, z.kornain, r.rasid, s.abdullah, n.k. othman.  (2011).  the effect of underfill fillet geometry to die edge stress for flip chip packaging.  - international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen; 6 november 2010 through 8 november 2010 (advanced materials research). 

maria abu bakar, muhammad azmi abdul hamid, azman jalar and roslinda shamsudin.  (2011).  synthesis of porous mgo into sheet-like structure via solution routes.  - 2011 international conference on frontier of nanoscience and technology, icfnst 2011; kunming. 

wan yusmawati wan yusoff, azman jalar, norinsan kamil othman, irman abdul rahman.  (2011).  effect of gamma-irradiation towards stress-strain curve of single die qfn package.  - 2011 international conference on frontier of nanoscience and technology, icfnst 2011; kunming. 

zainudin kornain, azman jalar, rozaidi rasid and shahrum abdullah.  (2011).  the study of underfill epoxy hardness in reducing curing process time for flip chip packaging.  - 8th international conference on fracture and strength of solids 2010, feofs2010; kuala lumpur (key engineering materials). 

fayyadh nakhaie ahmad refngah, shahrum abdullah, azman jalar, l.b. chua.  (2011).  microstructural behaviour study and fea-based fatigue simulation on parabolic leaf spring.  - 8th international conference on fracture and strength of solids 2010, feofs2010; kuala lumpur(key engineering materials). 

aendraa azhar abdul aziz, muhammad faizol ahmad ibrahim, azman jalar, junaidi syarif, shahrum abdullah, nasrizal mohd rashdi, zainudin kornain.  (2011).  effect of different fillers on microstructure and tensile properties of welded aa6061-t6.  - key engineering materials. 

f. harun, azman jalar, shahrum abdullah, mohd faridz mod yunoh.  (2011).  effect of hook location for ultra fine pitch wirebonding pull testing method.  - source: fracture and strength of solids vii, pts 1 and 2 book series: key engineering materials. 

m.f. m. yunoh, s. abdullah, a. jalar, l. abdullah and m.f. abdullah.  (2011).  durability assessment of quad flat no-lead package using signal analysis.  - source: fracture and strength of solids vii, pts 1 and 2 book series: key engineering materials. 

m. z. abdul wahab, h. mamat, a. jalar.  (2011).  temperature coefficient of resistance (tcr) measurement method to evaluate metal process of cmos technology.  - 2010 international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen (advanced materials research). 

i. abdullah, a. jalar, s. abdullah, m. f. rosle and m.f. mod yunoh.  (2011).  stress distribution effect on a stacked-die qfn package manufacturing processes.  - 8th international conference on fracture and strength of solids 2010, feofs2010 (key engineering materials); kuala lumpur. 

h. budiman, m. z. omar, a. jalar and j. syarif.  (2011).  investigation on cooling slope and conventional stir cast a356/al2o3 metal matrix composites.  - 2010 international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen (advanced materials research). 

hazian mamat, nur firdaus a rahim, mohd zahrin a wahab, prof dr. azman jalar.  (2011).  research on effect of high energy implant to resist thickness.  - advanced materials research - icfmm2011 chongqing, china. 

n. e. salehudin, a. jalar and a. r. daud.  (2011).  quantitative stereology for roughness morphology of aluminum alloy.  - advanced materials research - international conference on advances in materials and processing technologies, ampt 2009. 

m. f. ahmad ibrahim, s.r.s.bakar, a. jalar, n. k. othman,
j. sharif, a. r. daud and n. m. rashdi.  (2011).  effect of porosity on tensile behaviour of welded aa6061-t6 aluminium alloy.  - 2011 international conference on mechanical materials and manufacturing engineering, icmmme 2011 (applied mechanics and materials); nanchang. 

c. l. nur azida, a. jalar, n. k. othman, n. m. rashdi, md. z. ibel.  (2011).  effect of different filler metals towards welding of aa6061 al alloy by x-ray ct-scan.  - source: advances in superalloys, pts 1 and 2 book series: advanced materials research. 

che lah nur azida, azman jalar, norinsan kamil othman, abdul razak daud.  (2011).  oxidation effect of welded aa6061 al alloy using er5356 filler metal.  - 2011 international conference on mechanical materials and manufacturing engineering, icmmme 2011 (applied mechanics and materials); nanchang. 

n. k. othman, s. r. s. bakar, a. jalar, j. syarif and m. y. ahmad.  (2011).  the effect of filler metals on mechanical properties of 6 mm aa 6061-t6 welded joints.  - 2010 international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen (advanced materials research). 

aziz, a.a.a., ibrahim, m.f.a., jalar, a., junaidi, s., abdullah, s., rashdi, n., kornain, z..  (2011).  effects of different fillers on microstructure and tensile properties of welded aa6061-t6.  - 8th international conference on fracture and strength of solids 2010, feofs2010 (key engineering materials); kuala lumpur. 

n. k. othman, n. othman and a. jalar.  (2011).  corrosion behavior of fe-cr alloys in ar-10%o2 atmosphere.  - 8th international conference on fracture and strength of solids 2010, feofs2010; kuala lumpur(key engineering materials). 

n. a. che lah, m. f. ahmad ibrahim, a. jalar, j. sharif, n. k. othman and n. m. rashdi.  (2011).  the effect of filler er4043 and er5356 on porosity distribution of welded aa6061 aluminium alloy.  - 2010 international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen (advanced materials research). 

kornain, z., jalar, a., rasid, r., foong, c.s., wong, t.l..  (2011).  estimation of curing profile`s parameters for flip chip packaging using dsc and tga.  - 2011 international conference on materials, mechatronics and automation, icmma 2011 (key engineering materials); melbourne, vic. 

n. saud and a. jalar.  (2011).  sn-rich phase coarsening in sn-ag-cu solder joint during moderate current stressing.  - advanced materials research (international conference on advances in materials and processing technologies, ampt 2009). 

jalar a., zulkifli m.n., othman n.k., abdullah s..  (2011).  the re-evaluation of mechanical properties of wire bonding.  - 2011 international symposium on advanced packaging materials, apm 2011;xiamen. 

s. abdullah, m.f.m. yunoh, a. jalar and m.f. abdullah.  (2011).  hardness test on an epoxy mold compounds of a quad flat no lead package using the depth sensing nanoindentation.  - 2010 international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen (advanced materials research). 

s. abdullah, m. n. zulkifli, and a. jalar.  (2011).  nanoindentation approach for evaluation of process parameters effect on the strength of bonded au ball bonds.  - 2010 international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen (advanced materials research). 

a. jalar, m. n. zulkifli and s. abdullah.  (2011).  nanoindentation test for the strength distribution analysis of bonded au ball bonds.  - 2010 international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen (advanced materials research). 

n. k. othman, m. n. zulkifli, a. jalar, and s. abdullah.  (2011).  nanoindentation test for the stiffness distribution analysis of bonded au ball bonds.  - 2010 international conference on advances in materials and manufacturing processes, icammp 2010; shenzhen (advanced materials research). 

mohd zahrin a. wahab, azman jalar, shahrum abdullah, hazian mamat.  (2010).  characterization of 0.5µm bicmos gate oxide using time dependent dielectric breakdown test.  - advanced materials research. 

m. a. bakara, m. a. a. hamid & a. jalar.  (2010).  growth behaviour of zno on si (100) and platinum coated glass substrate from aqueous solution.  - advanced materials research. 

shahrum abdullah, mohd faridz mod yunoh and azman jalar.  (2010).  three-point bending test behaviour of a qfn semiconductor package.  - advanced materials research. 

n. k othman, a. jalar, n. othman and d. j. young.  (2010).  effects of lanthanum on fe-25cr alloys under cyclic oxidation.  - advanced materials research. 

bakar m.a., hamid m.a.a., jalar a..  (2010).  growth behaviour of zno on si (100) and platinum coated glass substrate from aqueous solution.  - advanced materials research. 

zainudin kornain, azman jalar, rozaidi rasid and shahrum abdullah.  (2010).  an optimization of two-steps curing profile to eliminate voids formation in underfill epoxy for hi-cte flip chip packaging.  - advanced materials research. 

eu poh leng, ming ding, wayne lindsay, sheila chopin, ibrahim ahmad, azman jalar.  (2007).  pb-free bga solder joint reability improvement with sn3.5ag solder alloy on ni/au finish.  - the effect of nickel thickness on mechanical strenght of pb-free bga spheres on selectively plated ni/au finish.