muhammad feidhul hakim bin fatah yasin, abdul halim abdul gafor, noraidatulakma abdullah, lee pey yee, syara kassim, affa rozana abdul rashid, kim s siow, azrul a hamzah, mohd ambri mohamed, siti nasuha mustaffa, nur akmar jamil, p. susthitha menon.  (2024).  early detection of hyperuricemia using hybrid au-zno biosensor and kretschmann-based spr at visible optical wavelengths.  - 2024 ieee international conference on semiconductor electronics (icse).  25 - 28. 

nur akmar jamil, abdul halim abdul gafor, noraidatulakma abdullah, lee pey yee, syara kassim, kim s siow, azrul a hamzah mohd ambri mohamed, muhammad feidhul hakim bin fatah yasin, p. susthitha menon .  (2024).  kretschmann-based surface plasmon resonance sensor using au/graphene for glucose detection.  - 2024 ieee international conference on semiconductor electronics (icse).  48 - 51. 

a. atiqah, r.a.a.a. rahim, a. jalar, k. s. siow.  (2022).  influence of copper substrate roughness on the growth of intermetallic compounds layer in sac305 solder joints.  - international conference on electronic and advanced materials (iceam 2021).  1-6. 

naeem a, siow ks, wee mfmr, ho wk, patra a..  (2022).  the hydrophilization and subsequent hydrophobic recovery mechanism of cold plasma (cp) treated bambarra groundnuts..  - materials science forum.  161-169. 

xu long, jiaqi zhu, yutai su, kim s. siow, chuantong chen.  (2022).  phase-field modelling for crack evolution of pbx under thermo- mechanical loadings.  - proceedings of the asme 2022 international mechanical engineering congress and exposition (imece2022).  1-7. 

km kumar, ks siiow, b. beake.  (2021).  3-d finite element modeling of nanoindentation on sn-3.5ag lead-free solder.  - 2021 ieee regional symposium on micro and nanoelectronics (rsm).  84-87. 

jiaqi zhu, yutai su, chen chuantong, kim s. siow, ruitao tang, xu long.  (2021).  porosity effect on fracture behavior of sintered silver nanoparticles by phase-field modeling.  - 2021 ieee 23rd electronics packaging technology conference (eptc).  317-321. 

muhammad khairulanwar abdul rahim, muhamad ramdzan buyong, nur mas ayu jamaludin, azrul azlan hamzah, kim shyong siow, burhanuddin yeop majlis.  (2018).  characterization of permittivity and conductivity for eskape pathogens detection.  - 2018 ieee international conference on semiconductor electronics (icse2018).  . 

muhammad izzuddin abd samad, farahdiana wan yunus, muhamad ramdzan buyong, kim shyong siow, azrul azlan hamzah & burhanuddin yeop majlis.  (2018).  voltage characterization on dielectrophoretic force respond to hematologic cell manipulation.  - 2018 ieee international conference on semiconductor electronics (icse2018).  . 

siow ks, chua st & zuruzi as.  (2018).  interfacial tem analysis of sintered silver in air and n2-5%h2 gases environment.  - 38th international electronics manufacturing technology conference.  . 

sp lim, b pan, h zhang, w ng, b. wu, ks siow, s sabne, m. tsuriya.  (2017).  high-temperature pb-free die attach material project phase 1: survey result.  - international conference on electronic packaging, yamagata japan.  51-56. 

mohd amir zulkefli, mohd ambri mohamed, kim s siow, burhanuddin yeop majlis.  (2016).  optimization of beam length and air gap of suspended graphene nems switch for low pull-in voltage application.  - ieee-icse2016 proc. 2016, kuala lumpur, malaysia.  29-32. 

siow ks, mérigeault e.,.  (2016).  patent landscape and market segments of sintered silver as die attach materials in microelectronic packaging.  - 2016 ieee 37th international electronics manufacturing technology (iemt) & 18th electronics materials and packaging (emap) conference,.  77619-77625. 

wee m.f.m.r., siow k.s., zain a.r.m., addouche m., khelif a..  (2016).  solid-fluid interaction in a pillar-based phononic crystal.  - ieee international conference on semiconductor electronics, proceedings, icse.  47-49. 

st chua, ks siow, a. jalar.  (2015).  effect of sintering atmosphere on the shear properties of pressureless sintered silver joint.  - 36th ieee international electronics manufacturing technology conference.  1-6. 

chua st, siow ks, jalar a.  (2014).  effect of sintering atmosphere on the shear properties of pressureless sintered silver joint.  - 36th international electronics manufacturing technology conference,.  . 

ks siow.  (2014).  setting up an intellectual properties intermediary services: dmaic way.  - international conference on industrial engineering and engineering management, sunway resort, kuala lumpur, 9-12th dec 2014.  . 

foo s.p., siow k.s., a. jalar.  (2014).  synthesizing snagcu nanoparticles by electrodeposition of reverse microemulsion electrolyte.  - 2014 ieee international conference on semiconductor electronics (icse 2014).  513-516.