pensyarah universiti
institut kejuruteraan mikro & nanoelektronik (imen)
No. Telefon Rasmi : 0389217002
No. rasmi:
UKM : 03 8921 5555
Atiqah Afdzaluddin currently works at the Institute of Microengineering and Nanoelectronic (IMEN), Universiti Kebangsaan Malaysia (UKM) Bangi, Malaysia. Atiqah does research in MEMS Packaging, Advance Materials Research, Natural Fibre Composites and Hybrid Composites.
n. a. azra, a. atiqah, h. fadhlina, m. a. bakar, a. jalar, r. a. ilyas, j. naveen, f. a. sabaruddin, k. k. lim, m. asrofi. (2023). oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices: water absorption, thickness swelling and density properties. - applied science and engineering progress. 1-9.
othman. n.s, zalita z., a. atiqah, lee wh. (2023). sodium bismut titanat : ulasan ringkas. - multidisciplinary international conference 2023. 128-141.
t.t. dele-afolabi, m.n.m. ansari, m.a. azmah hanim, a.a. oyekanmi, o.j. ojo-kupoluyi, a. atiqah. (2023). recent advances in sn-based lead free solder interconnects for microelectronics packaging: materials and technologies. - journal of materials research and technology. 4231-4263.
n.a. azra, a. atiqah, a. jalar, g. manar, a.b.m. supian, r.a. ilyas. (2023). sustainable substrate tin oxide/nanofibril cellulose/thermoplastic starch: dimensional stability and tensile properties. - journal of materials research and technology. 99-108.
haziqah fadhlina, a. atiqah, zalita zainuddin. (2022). a review on lithium doped lead-free piezoelectric materials. - materials today communications. 1-16.
n.a. azra, a. atiqah, a. jalar, g. manar, a.b.m. supian, r.a. ilyas. (2023). sustainable substrate tin oxide/nanofibril cellulose/thermoplastic starch: dimensional stability and tensile properties. - journal of materials research and technology. 99-108.
t.t. dele-afolabi, m.n.m. ansari, m.a. azmah hanim, a.a. oyekanmi, o.j. ojo-kupoluyi, a. atiqah. (2023). recent advances in sn-based lead free solder interconnects for microelectronics packaging: materials and technologies. - journal of materials research and technology. 4231-4263.
abdulrahman alhayek, agusril syamsir, abu bakar mohd supian, fathoni usman, muhammad rizal muhammad asyraf, mohd afdzaluddin atiqah. (2022). flexural creep behaviour of pultruded gfrp composites cross-arm: a comparative study on the effects of stacking sequence. - polymers. 1-15.
n.ismail, a.atiqah, a.jalar, m.a.bakar, r.a.a.rahim, a.g.ismail, a.a.hamzah, l.k.keng. (2022). a systematic literature review: the effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints. - journal of manufacturing processes. 68-85.
yusniza yunus, nurul adlin mahadzir, mohamed nainar mohamed ansari, tg hasnan tg abd aziz, atiqah mohd afdzaluddin, hafeez anwar, mingqing wang, ahmad ghadafi ismail. (2022). review of the common deposition methods of thin-film pentacene, its derivatives, and their performance. - polymers. 1-38.
haziqah fadhlina, a. atiqah, zalita zainuddin. (2022). a review on lithium doped lead-free piezoelectric materials. - materials today communications. 1-16.
norliza ismail, azman jalar, atiqah afdzaluddin, maria abu bakar. (2021). electrical resistivity of sn 3.0 ag 0.5cu solder joint with the incorporation of carbon nanotubes. - nanomaterials and nanotechnology. 1-9.
rabiah al adawiyah ab rahim, muhammad nubli zulkifli, azman jalar, atiqah mohd afdzaluddin, kim siow shyong. (2020). effect of isothermal aging and copper substrate roughness on the sac305 solder joint intermetallic layer growth of high temperature storage (hts). - sains malaysiana. 3045-3054.
atiqah mohd afdzaluddin, maria abu bakar. (2020). effect of coating element on joining stability of sn-0.3ag-0.7cu solder joint due to aging test. - sains malaysiana. 3029-3036.
n.a. azra, a. atiqah, a. jalar, g. manar, a.b.m. supian, r.a. ilyas. (2023). sustainable substrate tin oxide/nanofibril cellulose/thermoplastic starch: dimensional stability and tensile properties. - journal of materials research and technology. 99-108.
t.t. dele-afolabi, m.n.m. ansari, m.a. azmah hanim, a.a. oyekanmi, o.j. ojo-kupoluyi, a. atiqah. (2023). recent advances in sn-based lead free solder interconnects for microelectronics packaging: materials and technologies. - journal of materials research and technology. 4231-4263.
n. a. azra, a. atiqah, h. fadhlina, m. a. bakar, a. jalar, r. a. ilyas, j. naveen, f. a. sabaruddin, k. k. lim, m. asrofi. (2023). oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices: water absorption, thickness swelling and density properties. - applied science and engineering progress. 1-9.
norliza ismail, muhammad nubli zulkifli, a. atiqah. (2022). localized micromechanical properties of fine-pitch sac305 doped carbon nanotube solder joints. - jurnal teknologi. 15-23.
rozaidi rasid, melissa michelle, a. atiqah. (2022). temperature profile measurement using modified cooled stainless tube technique in a single screw extruder coupled with a modified thermocouple mesh -effect of screw speed. - jurnal teknologi. 145-149.
p. vijayakumaran, m. h. m. ramli, m. selvam, k. hamid, a. atiqah, a. jalar, m. a. bakar. (2022). reduce wafer remnants through pre-assembly process optimization. - international conference on electronic and advanced materials (iceam 2021). 1-5.
a. atiqah, r.a.a.a. rahim, a. jalar, k. s. siow. (2022). influence of copper substrate roughness on the growth of intermetallic compounds layer in sac305 solder joints. - international conference on electronic and advanced materials (iceam 2021). 1-6.
joon shyan tan, wai wai lee, a. atiqah, khirullah abdul hamid, azman jalar, maria abu bakar. (2021). the effect of electrolytic deflash current on delamination of epoxy mold compound during tin plating process. - 2021 ieee regional symposium on micro and noelectronics (rsm). 73-75.
m.a. bakar, a. jalar, a. atiqah, n. ismail. (2022). recent progress in lead-free solder technology. - . 332.
n. ismail, a. jalar, m.a. bakar, a. atiqah. (2022). recent progress in lead-free solder technology. - . 21.
a atiqah, a. jalar, m.a. bakar, n. ismail. (2022). recent progress in lead-free solder technology. - . 332.
r.a. ilyas, s.m. sapuan, a. atiqah, m.r.m. asyraf, n.m. nurazzi, mohd n. f. norrrahim, mohd a. jenol, m.m. harussani, r. ibrahim, m.s.n. atikah, chandrasekar muthukumar. (2022). natural fiber reinforced composites: thermal properties and applications. - . 30.
n. ismail, a. jalar, m.a. bakar, a. atiqah. (2022). recent progress in lead-free solder technology. - . 21.
a. atiqah, n. ismail, k.k. lim, a. jalar, m.a. bakar, m.a. maleque, r.a. ilyas, a.b.m. supian. (2022). recycling of plastics, metals, and their composites. - . 15.
a atiqah, a. jalar, m.a. bakar, n. ismail. (2022). recent progress in lead-free solder technology. - . 332.
m.a. bakar, a. jalar, a. atiqah, n. ismail. (2022). recent progress in lead-free solder technology. - . 332.
ahmad ghadafi ismail, yusniza yunus, nurul adlin mahadzir, m.n.m. ansari, tengku hasnan tengku abdul aziz, a. atiqah, hafeez anwar, mingqing wang. (2022). pentacene and its derivatives deposition methods. - scholarly community encyclopedia. 1-16.
Geran / Grant | Kolaborator / Collaborator | Status |
---|---|---|
FABRIKASI DAN PENCIRIAN KONDUKTOR BERASASKAN KARBON TERAKTIF DENGAN SUBSTRAT KANJI UNTUK EDIBEL ELEKTRONIK | aiszzy electronics enterprise | 49.2% (2022-10-01 sehingga 2024-09-30) |