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a. atiqah, r.a.a.a. rahim, a. jalar, k. s. siow.  (2022).  influence of copper substrate roughness on the growth of intermetallic compounds layer in sac305 solder joints.  - international conference on electronic and advanced materials (iceam 2021).  1-6. 

joon shyan tan, wai wai lee, a. atiqah, khirullah abdul hamid, azman jalar, maria abu bakar.  (2021).  the effect of electrolytic deflash current on delamination of epoxy mold compound during tin plating process.  - 2021 ieee regional symposium on micro and noelectronics (rsm).  73-75. 

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a. atiqah, n. ismail, k.k. lim, a. jalar, m.a. bakar, m.a. maleque, r.a. ilyas, a.b.m. supian.  (2022).  recycling of plastics, metals, and their composites.  - .  15. 

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