maria abu bakar, atiqah mohd afdzaluddin, azman jalar.  (2022).  review on corrosion in electronic packaging trends of collaborative between academia-industry.  - sustainability.  1-33. 

n.ismail, a.atiqah, a.jalar, m.a.bakar, r.a.a.rahim, a.g.ismail, a.a.hamzah, l.k.keng.  (2022).  a systematic literature review: the effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints.  - journal of manufacturing processes.  68-85. 

yusniza yunus, nurul adlin mahadzir, mohamed nainar mohamed ansari, tg hasnan tg abd aziz, atiqah mohd afdzaluddin, hafeez anwar, mingqing wang, ahmad ghadafi ismail.  (2022).  review of the common deposition methods of thin-film pentacene, its derivatives, and their performance.  - polymers.  1-38. 

abdulrahman alhayek, agusril syamsir, abu bakar mohd supian, fathoni usman, muhammad rizal muhammad asyraf, mohd afdzaluddin atiqah.  (2022).  flexural creep behaviour of pultruded gfrp composites cross-arm: a comparative study on the effects of stacking sequence.  - polymers.  1-15. 

nafissa moussaoui, mansour rokbi, hocine osmani, mohammad jawaid, a. atiqah, mohammad asim, lamia benhamadouche.  (2021).  extraction and characterization of fiber treatment inula viscosa fibers as potential polymer composite reinforcement.  - journal of polymers and the environment.  3779-3793. 

norliza ismail, azman jalar, atiqah afdzaluddin, maria abu bakar.  (2021).  electrical resistivity of sn 3.0 ag 0.5cu solder joint with the incorporation of carbon nanotubes.  - nanomaterials and nanotechnology.  1-9. 

rabiah al adawiyah ab rahim, muhammad nubli zulkifli, azman jalar, atiqah mohd afdzaluddin, kim siow shyong.  (2020).  effect of isothermal aging and copper substrate roughness on the sac305 solder joint intermetallic layer growth of high temperature storage (hts).  - sains malaysiana.  3045-3054. 

atiqah mohd afdzaluddin, maria abu bakar.  (2020).  effect of coating element on joining stability of sn-0.3ag-0.7cu solder joint due to aging test.  - sains malaysiana.  3029-3036. 

n. a. azra, a. atiqah, h. fadhlina, m. a. bakar, a. jalar, r. a. ilyas, j. naveen, f. a. sabaruddin, k. k. lim, m. asrofi.  (2023).  oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices: water absorption, thickness swelling and density properties.  - applied science and engineering progress.  1-9. 

maria abu bakar, atiqah mohd afdzaluddin, azman jalar.  (2022).  review on corrosion in electronic packaging trends of collaborative between academia-industry.  - sustainability.  1-33. 

abdulrahman alhayek, agusril syamsir, abu bakar mohd supian, fathoni usman, muhammad rizal muhammad asyraf, mohd afdzaluddin atiqah.  (2022).  flexural creep behaviour of pultruded gfrp composites cross-arm: a comparative study on the effects of stacking sequence.  - polymers.  1-15. 

n.ismail, a.atiqah, a.jalar, m.a.bakar, r.a.a.rahim, a.g.ismail, a.a.hamzah, l.k.keng.  (2022).  a systematic literature review: the effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints.  - journal of manufacturing processes.  68-85. 

norliza ismail, muhammad nubli zulkifli, a. atiqah.  (2022).  localized micromechanical properties of fine-pitch sac305 doped carbon nanotube solder joints.  - jurnal teknologi.  15-23. 

p. vijayakumaran, m. h. m. ramli, m. selvam, k. hamid, a. atiqah, a. jalar, m. a. bakar.  (2022).  reduce wafer remnants through pre-assembly process optimization.  - international conference on electronic and advanced materials (iceam 2021).  1-5. 

a. atiqah, r.a.a.a. rahim, a. jalar, k. s. siow.  (2022).  influence of copper substrate roughness on the growth of intermetallic compounds layer in sac305 solder joints.  - international conference on electronic and advanced materials (iceam 2021).  1-6. 

joon shyan tan, wai wai lee, a. atiqah, khirullah abdul hamid, azman jalar, maria abu bakar.  (2021).  the effect of electrolytic deflash current on delamination of epoxy mold compound during tin plating process.  - 2021 ieee regional symposium on micro and noelectronics (rsm).  73-75. 

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r.a. ilyas, s.m. sapuan, a. atiqah, m.r.m. asyraf, n.m. nurazzi, mohd n. f. norrrahim, mohd a. jenol, m.m. harussani, r. ibrahim, m.s.n. atikah, chandrasekar muthukumar.  (2022).  natural fiber reinforced composites: thermal properties and applications.  - .  30. 

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a. atiqah, n. ismail, k.k. lim, a. jalar, m.a. bakar, m.a. maleque, r.a. ilyas, a.b.m. supian.  (2022).  recycling of plastics, metals, and their composites.  - .  15. 

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ahmad ghadafi ismail, yusniza yunus, nurul adlin mahadzir, m.n.m. ansari, tengku hasnan tengku abdul aziz, a. atiqah, hafeez anwar, mingqing wang.  (2022).  pentacene and its derivatives deposition methods.  - scholarly community encyclopedia.  1-16.