linghao wang, azman jalar, longhong dan.  (2023).  effect of nd on microstructure and mechanical properties of mg-7gd-0.5zr alloy.  - journal of alloys and compounds.  1-14. 

n.ismail, a.atiqah, a.jalar, m.a.bakar, r.a.a.rahim, a.g.ismail, a.a.hamzah, l.k.keng.  (2022).  a systematic literature review: the effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints.  - journal of manufacturing processes.  68-85. 

ensaf mohammed alkhalqi, muhammad azmi abdul hamid, naif h. alhardan, lim kar keng, azman jalar.  (2022).  magnesium doped zno nanorod electrolyte-insulator-semiconductor (eis) sensor for detecting organic solvents..  - ieee sensors journal.  11783-11790. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, john burke, zol effendi zolkefli, erwan basiron.  (2022).  effect of heat shield locations on rework-induced thermal management in ball grid array solder joint.  - scientific reports.  1-12. 

maria abu bakar, atiqah mohd afdzaluddin, azman jalar.  (2022).  review on corrosion in electronic packaging trends of collaborative between academia-industry.  - sustainability.  1-33. 

ensaf mohammed. al-khalqi, muhammad azmi abdul hamid, naif h. al-hardan, lim kar keng, azman jalar.  (2022).  magnesium-doped zno nanorod electrolyte insulator semiconductor (eis) sensor for detecting calcium ions.  - journal of materials science: materials in electronics.  1618-1630. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2022).  temperature-induced thickness reduction of micromechanical properties of sn-0.7cu solder alloy.  - materiali in tehnologije, materials and technology.  373-379. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, erwan basiron, fakhrozi che ani.  (2022).  cardinal and ordinal directions approach in investigating arrayed solder joints crack propagation of ball grid array semiconductor packages.  - ieee transactions on components packaging and manufacturing technology.  1492-1501. 

abdul a omar, azman jalar, maria a bakar, khirullah a hamid.  (2022).  sulfur ingression on encapsulated leadframe of discrete semiconductor package.  - ieee transactions on components, packaging and manufacturing technology.  544-550. 

mohamad solehin mohamed sunar, maria abu bakar, azman jalar, mohamad riduwan ramli, fakhrozi che ani.  (2022).  effect of alloy particle size and stencil aperture shape on solder printing quality.  - microelectronics international.  81-90. 

linghao wang, azman jalar, longhong dan.  (2023).  effect of nd on microstructure and mechanical properties of mg-7gd-0.5zr alloy.  - journal of alloys and compounds.  1-14. 

n. a. azra, a. atiqah, h. fadhlina, m. a. bakar, a. jalar, r. a. ilyas, j. naveen, f. a. sabaruddin, k. k. lim, m. asrofi.  (2023).  oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices: water absorption, thickness swelling and density properties.  - applied science and engineering progress.  1-9. 

ensaf mohammed. al-khalqi, muhammad azmi abdul hamid, naif h. al-hardan, lim kar keng, azman jalar.  (2022).  magnesium-doped zno nanorod electrolyte insulator semiconductor (eis) sensor for detecting calcium ions.  - journal of materials science: materials in electronics.  1618-1630. 

ensaf mohammed alkhalqi, muhammad azmi abdul hamid, naif h. alhardan, lim kar keng, azman jalar.  (2022).  magnesium doped zno nanorod electrolyte-insulator-semiconductor (eis) sensor for detecting organic solvents..  - ieee sensors journal.  11783-11790. 

mohamad solehin mohamed sunar, maria abu bakar, azman jalar, mohamad riduwan ramli, fakhrozi che ani.  (2022).  effect of alloy particle size and stencil aperture shape on solder printing quality.  - microelectronics international.  81-90. 

m. f. suhaimi, m. abu bakar, a. jalar, f. che ani, m. r. ramli.  (2022).  thermal cycling effect on the crack formation of solder joint in ball grid array package.  - international conference on electronic and advanced materials (iceam 2021) journal of physics: conference series.  1-5. 

khirullah abdul hamid, aiman hakim badarisman, azman jalar, maria abu bakar.  (2022).  effects of electrolyte towards copper wire metallurgical interconnection in semiconductor.  - international conference on electronic and advanced materials (iceam 2021).  1-6. 

fateh ameera mohd yusoff, maria abu bakar, azman jalar.  (2022).  effect of 60% thickness reduction of sn-cu solder alloy on localized micromechanical properties via nanoindentation approach.  - international conference on electronic and advanced materials (iceam 2021).  1-5. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, erwan basiron, fakhrozi che ani.  (2022).  intermetallic compound thickness of ball grid array solder joints under thermal cycling test using anova.  - 2022 ieee 39th international electronics manufacturing technology conference (iemt).  1-4. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, fakhrozi che ani, zol effendi zolkefli.  (2022).  effects of underfill materials on behavior of intermetallic compound thickness of ball grid array solder joints using anova.  - 2022 ieee 39th international electronics manufacturing technology conference (iemt).  1-5. 

a atiqah, a. jalar, m.a. bakar, n. ismail.  (2022).  recent progress in lead-free solder technology.  - .  332. 

n. ismail, a. jalar, m.a. bakar, a. atiqah.  (2022).  recent progress in lead-free solder technology.  - .  21. 

m.a. bakar, a. jalar, a. atiqah, n. ismail.  (2022).  recent progress in lead-free solder technology.  - .  332. 

f.c. ani, a.a. saad, a. jalar, c.y. khor, m.a. abas, z. bachok.  (2022).  recent progress in lead-free solder technology.  - .  332. 

norliza ismail, azman jalar, maria abu bakar.  (2021).  pematerian bahan pateri bebas plumbum berpengisi karbon nanotiub.  - .  121. 

n. ismail, a. jalar, m.a. bakar, a. atiqah.  (2022).  recent progress in lead-free solder technology.  - .  21. 

a atiqah, a. jalar, m.a. bakar, n. ismail.  (2022).  recent progress in lead-free solder technology.  - .  332. 

a. atiqah, n. ismail, k.k. lim, a. jalar, m.a. bakar, m.a. maleque, r.a. ilyas, a.b.m. supian.  (2022).  recycling of plastics, metals, and their composites.  - .  15. 

f.c. ani, a.a. saad, a. jalar, c.y. khor, m.a. abas, z. bachok.  (2022).  recent progress in lead-free solder technology.  - .  332. 

m.a. bakar, a. jalar, a. atiqah, n. ismail.  (2022).  recent progress in lead-free solder technology.  - .  332. 

mohd arif anuar mohd salleh, mohd sharizal abdul aziz, azman jalar, mohd izrul izwan ramli.  (2022).  recent progress in lead-free solder technology.  - .  332. 

norliza ismail, azman jalar, maria abu bakar.  (2021).  pematerian bahan pateri bebas plumbum berpengisi karbon nanotiub.  - .  121. 

ahmad ghadafi bin ismail;azman bin jalar @ jalil;abang annuar ehsan;mohd zulhakimi bin ab razak @ mamat.  (2022).  hybrid patterning of organic semiconducting materials using numerical control milling and laser beam.  - .  . 

azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2022).  microstructural characterization of copper wire bonding in semiconductor packaging.  - .  . 

ahmad ghadafi bin ismail;azman bin jalar @ jalil;abang annuar ehsan;mohd farhanulhakim bin mohd razip wee;mohd zulhakimi bin ab razak @ mamat.  (2022).  enhanced micro-scale computer numerical control milling and laser ablation to pattern organic semiconductors .  - .  . 

azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2022).  wedge bond corrosion of copper wire bonding.  - .  . 

maria binti abu bakar;azman bin jalar @ jalil.  (2022).  pencirian mikrostruktur dan sifat mekanik sambungan pateri pic halus dalam pakej elektronik.  - .  .