n. a. azra, a. atiqah, h. fadhlina, m. a. bakar, a. jalar, r. a. ilyas, j. naveen, f. a. sabaruddin, k. k. lim, m. asrofi.  (2023).  oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices: water absorption, thickness swelling and density properties.  - applied science and engineering progress.  1-9. 

 

m.a. bakar, a. jalar, a. atiqah, n. ismail.  (2022).  recent progress in lead-free solder technology.  - 332. 

 

f.c. ani, a.a. saad, a. jalar, c.y. khor, m.a. abas, z. bachok.  (2022).  recent progress in lead-free solder technology.  - 332. 

 

abdul a omar, azman jalar, maria a bakar, khirullah a hamid.  (2022).  sulfur ingression on encapsulated leadframe of discrete semiconductor package.  - ieee transactions on components, packaging and manufacturing technology.  544-550. 

 

mohd arif anuar mohd salleh, mohd sharizal abdul aziz, azman jalar, mohd izrul izwan ramli.  (2022).  recent progress in lead-free solder technology.  - 332. 

 

n.ismail, a.atiqah, a.jalar, m.a.bakar, r.a.a.rahim, a.g.ismail, a.a.hamzah, l.k.keng.  (2022).  a systematic literature review: the effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints.  - journal of manufacturing processes.  68-85. 

 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, john burke, zol effendi zolkefli, erwan basiron.  (2022).  effect of heat shield locations on rework-induced thermal management in ball grid array solder joint.  - scientific reports.  1-12. 

 

ensaf mohammed alkhalqi, muhammad azmi abdul hamid, naif h. alhardan, lim kar keng, azman jalar.  (2022).  magnesium doped zno nanorod electrolyte-insulator-semiconductor (eis) sensor for detecting organic solvents..  - ieee sensors journal.  11783-11790. 

 

hassan basher, muhammad nubli zulkifli, mohd khairil rahmat, muhammad ghazali abdul rahman, azman jalar, michael daenen.  (2021).  bondability of ultrasonic aluminum bonds on the molybdenum (de) selenide and molybdenum of back contact layer of copper indium gallium (de)selenide cigs thin film photovoltaic solar panel.  - solar energy.  516-522. 

 

naif h. al-hardan, muhammad azmi abdul hamid, lim kar keng, ensaf mohammed al-khalqi, azman jalar, wee siong chiu.  (2021).  low-cost fabrication of a ph sensor based on writing directly over parchment-type paper with pencil.  - journal of materials science: materials in electronics.  9431-9439. 

 

ensaf mohammed. al-khalqi, muhammad azmi abdul hamid, naif h. al-hardan, lim kar keng, azman jalar.  (2022).  magnesium-doped zno nanorod electrolyte insulator semiconductor (eis) sensor for detecting calcium ions.  - journal of materials science: materials in electronics.  1618-1630. 

 

abdul a omar, azman jalar, maria a bakar, khirullah a hamid.  (2022).  sulfur ingression on encapsulated leadframe of discrete semiconductor package.  - ieee transactions on components, packaging and manufacturing technology.  544-550. 

 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, erwan basiron, fakhrozi che ani.  (2022).  cardinal and ordinal directions approach in investigating arrayed solder joints crack propagation of ball grid array semiconductor packages.  - ieee transactions on components packaging and manufacturing technology.  1492-1501. 

 

mohamad solehin mohamed sunar, maria abu bakar, azman jalar, mohamad riduwan ramli, fakhrozi che ani.  (2022).  effect of alloy particle size and stencil aperture shape on solder printing quality.  - microelectronics international.  81-90. 

 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2022).  temperature-induced thickness reduction of micromechanical properties of sn-0.7cu solder alloy.  - materiali in tehnologije, materials and technology.  373-379. 

 

n. a. azra, a. atiqah, h. fadhlina, m. a. bakar, a. jalar, r. a. ilyas, j. naveen, f. a. sabaruddin, k. k. lim, m. asrofi.  (2023).  oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices: water absorption, thickness swelling and density properties.  - applied science and engineering progress.  1-9. 

 

ensaf mohammed alkhalqi, muhammad azmi abdul hamid, naif h. alhardan, lim kar keng, azman jalar.  (2022).  magnesium doped zno nanorod electrolyte-insulator-semiconductor (eis) sensor for detecting organic solvents..  - ieee sensors journal.  11783-11790. 

 

mohamad solehin mohamed sunar, maria abu bakar, azman jalar, mohamad riduwan ramli, fakhrozi che ani.  (2022).  effect of alloy particle size and stencil aperture shape on solder printing quality.  - microelectronics international.  81-90. 

 

ensaf mohammed. al-khalqi, muhammad azmi abdul hamid, naif h. al-hardan, lim kar keng, azman jalar.  (2022).  magnesium-doped zno nanorod electrolyte insulator semiconductor (eis) sensor for detecting calcium ions.  - journal of materials science: materials in electronics.  1618-1630. 

 

abdul a omar, azman jalar, maria a bakar, khirullah a hamid.  (2022).  sulfur ingression on encapsulated leadframe of discrete semiconductor package.  - ieee transactions on components, packaging and manufacturing technology.  544-550. 

 

m. f. suhaimi, m. abu bakar, a. jalar, f. che ani, m. r. ramli.  (2022).  thermal cycling effect on the crack formation of solder joint in ball grid array package.  - international conference on electronic and advanced materials (iceam 2021) journal of physics: conference series.  1-5. 

 

fateh ameera mohd yusoff, maria abu bakar, azman jalar.  (2022).  effect of 60% thickness reduction of sn-cu solder alloy on localized micromechanical properties via nanoindentation approach.  - international conference on electronic and advanced materials (iceam 2021).  1-5. 

 

m. s. mohamed sunar, m. abu bakar, a. jalar, f. che ani, m . r. ramli.  (2022).  effect of stencil wall aperture on solder paste release via stencil printing.  - international conference on electronic and advanced materials (iceam 2021) - journal of physics: conference series.  1-6. 

 

khirullah abdul hamid, aiman hakim badarisman, azman jalar, maria abu bakar.  (2022).  effects of electrolyte towards copper wire metallurgical interconnection in semiconductor.  - international conference on electronic and advanced materials (iceam 2021).  1-6. 

 

a. atiqah, r.a.a.a. rahim, a. jalar, k. s. siow.  (2022).  influence of copper substrate roughness on the growth of intermetallic compounds layer in sac305 solder joints.  - international conference on electronic and advanced materials (iceam 2021).  1-6. 

 

a atiqah, a. jalar, m.a. bakar, n. ismail.  (2022).  recent progress in lead-free solder technology.  - 332. 

 

n. ismail, a. jalar, m.a. bakar, a. atiqah.  (2022).  recent progress in lead-free solder technology.  - 21. 

 

m.a. bakar, a. jalar, a. atiqah, n. ismail.  (2022).  recent progress in lead-free solder technology.  - 332. 

 

f.c. ani, a.a. saad, a. jalar, c.y. khor, m.a. abas, z. bachok.  (2022).  recent progress in lead-free solder technology.  - 332. 

 

norliza ismail, azman jalar, maria abu bakar.  (2021).  pematerian bahan pateri bebas plumbum berpengisi karbon nanotiub.  - 121. 

 

n. ismail, a. jalar, m.a. bakar, a. atiqah.  (2022).  recent progress in lead-free solder technology.  - 21. 

 

a atiqah, a. jalar, m.a. bakar, n. ismail.  (2022).  recent progress in lead-free solder technology.  - 332. 

 

a. atiqah, n. ismail, k.k. lim, a. jalar, m.a. bakar, m.a. maleque, r.a. ilyas, a.b.m. supian.  (2022).  recycling of plastics, metals, and their composites.  - 15. 

 

f.c. ani, a.a. saad, a. jalar, c.y. khor, m.a. abas, z. bachok.  (2022).  recent progress in lead-free solder technology.  - 332. 

 

m.a. bakar, a. jalar, a. atiqah, n. ismail.  (2022).  recent progress in lead-free solder technology.  - 332. 

 

mohd arif anuar mohd salleh, mohd sharizal abdul aziz, azman jalar, mohd izrul izwan ramli.  (2022).  recent progress in lead-free solder technology.  - 332. 

 

norliza ismail, azman jalar, maria abu bakar.  (2021).  pematerian bahan pateri bebas plumbum berpengisi karbon nanotiub.  - 121. 

 

ahmad ghadafi bin ismail;azman bin jalar @ jalil;abang annuar ehsan;mohd zulhakimi bin ab razak @ mamat.  (2022).  hybrid patterning of organic semiconducting materials using numerical control milling and laser beam.  -

 

azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2022).  microstructural characterization of copper wire bonding in semiconductor packaging.  -

 

ahmad ghadafi bin ismail;azman bin jalar @ jalil;abang annuar ehsan;mohd farhanulhakim bin mohd razip wee;mohd zulhakimi bin ab razak @ mamat.  (2022).  enhanced micro-scale computer numerical control milling and laser ablation to pattern organic semiconductors .  -

 

azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2022).  wedge bond corrosion of copper wire bonding.  -

 

maria binti abu bakar;azman bin jalar @ jalil.  (2022).  pencirian mikrostruktur dan sifat mekanik sambungan pateri pic halus dalam pakej elektronik.  -