prof. madya dr. siow kim shyong

pensyarah universiti

institut kejuruteraan mikro & nanoelektronik (imen)

 kimsiow@ukm.edu.my

No. Telefon Rasmi :  60389118542

No. rasmi:
UKM : 03 8921 5555



   Biografi/ Biography :

  • Kim S Siow ialah Profesor Madya/ Felo Penyelidik di IMEN (2013-sekarang). Bidang penyelidikan beliau adalah berkaitan dengan modifikasi permukaan plasma, pensinteran logam nanopartikel (perak dan tembaga), dan inovasi paten TRIZ. Beliau juga pernah bekerja sebagai jurutera bahan di Infineon Technologies , ON Semiconductor dan Universiti Kebangsaan Singapura (NUS), di samping mengurus teknologi di pusat pemindahan teknologi A*STAR Singapura.
    A/Prof Dr Kim S Siow (LLM) is an Associate Professor/ Senior Research Fellow at IMEN . His multi-disciplinary research interests are related to plasma surface modification, sintered metal (silver and copper) bonding, and TRIZ-patent innovation. In addition, he has worked as materials engineer in Infineon Technologies , ON Semiconductor and National University of Singapore, besides working in technology transfer officer at A*STAR Singapore.

  • chua siang tat, siow kim shyong.  (2022).  perak tersinter sebagai bahan pelekat dalam pempakejan mikroelektronik.  - 167. 

     

    naeem ahmed, muhammad shahid, kim s siow, m f mohd razip wee, farah farhanah haron, anuttam patra, shazrul fazry.  (2022).  germination and growth improvement of papaya utilizing oxygen (o2) plasma treatment.  - j physic d appl phys.  1-11. 

     

    xu long, tianxiong su, zubin chen, yutai su, kim s. siow.  (2022).  tunable coefficient of thermal expansion of composite materials for thin-film coatings.  - coatings.  1-17. 

     

    naeem ahmed, asad masood, kim s. siow, m. f. mohd razip wee, farah farhanah haron, anuttam patra, nafarizal nayan & chin fhong soon.  (2022).  effects of oxygen (o2) plasma treatment in promoting the germination and growth of chili.  - plasma chem plasma processing.  91-108. 

     

    naeem a, siow ks, wee mfmr, ho wk, patra a..  (2022).  the hydrophilization and subsequent hydrophobic recovery mechanism of cold plasma (cp) treated bambarra groundnuts..  - materials science forum.  161-169. 

     

    naeem ahmed, asad masood, kim s. siow, m. f. mohd razip wee, farah farhanah haron, anuttam patra, nafarizal nayan & chin fhong soon.  (2022).  effects of oxygen (o2) plasma treatment in promoting the germination and growth of chili.  - plasma chem plasma processing.  91-108. 

     

    naeem ahmed, muhammad shahid, kim s siow, m f mohd razip wee, farah farhanah haron, anuttam patra, shazrul fazry.  (2022).  germination and growth improvement of papaya utilizing oxygen (o2) plasma treatment.  - j physic d appl phys.  1-11. 

     

    xu long, tianxiong su, zubin chen, yutai su, kim s. siow.  (2022).  tunable coefficient of thermal expansion of composite materials for thin-film coatings.  - coatings.  1-17. 

     

    chen tiam foo, siow kim shyong.  (2021).  comparing the mechanical and thermal-electrical properties of sintered copper (cu) and sintered silver (ag) joints.  - journal of alloys and compounds.  1-19. 

     

    akmal suhaimi, ebrahim mahmoudi, rhonira latif, kim s. siow, m. hazani m. zaid, abdul wahab mohammad, m.f. mohd razip wee.  (2021).  superhydrophilic organosilicon plasma modification on pes membrane for organic dyes filtration.  - journal of water process engineering.  102-352. 

     

    xu long, ying guo, yutai su, kim s. siow, chuantong chen.  (2022).  constitutive creep and fatigue behavior of sintered ag for finite element simulation of mechanical reliability a critical review.  - journal of materials science-materials in electronics.  2293-2309. 

     

    yanliang shan, yunhui mei,, meiyu wang, xin li, yanhong tian, gang chen, siow kim shyong.  (2021).  ratcheting behavior of sintered copper joints for electronic packaging.  - ieee transactions on components, packaging and manufacturing technology.  983-989. 

     

    siow kim shyong, arifah rahman, amnani aminuddin, pei yuen ng.  (2021).  effect of sulfur on nitrogen containing plasma polymers in promoting osteogenic differentiation of wharton jelly mesenchymal stem cells.  - sains malaysiana.  3499-3510. 

     

    rabiah al adawiyah ab rahim, muhammad nubli zulkifli, azman jalar, atiqah mohd afdzaluddin, kim siow shyong.  (2020).  effect of isothermal aging and copper substrate roughness on the sac305 solder joint intermetallic layer growth of high temperature storage (hts).  - sains malaysiana.  3045-3054. 

     

    a. suhaimi, e. mahmoudi, k.s. siow, m.f. mohd razip wee.  (2020).  surface modification of polyamide ultrafiltration membrane by plasma polymerisation of acrylic acid.  - sains malaysiana.  3097-3104. 

     

    naeem ahmed, asad masood, kim s. siow, m. f. mohd razip wee, farah farhanah haron, anuttam patra, nafarizal nayan & chin fhong soon.  (2022).  effects of oxygen (o2) plasma treatment in promoting the germination and growth of chili.  - plasma chem plasma processing.  91-108. 

     

    naeem ahmed, muhammad shahid, kim s siow, m f mohd razip wee, farah farhanah haron, anuttam patra, shazrul fazry.  (2022).  germination and growth improvement of papaya utilizing oxygen (o2) plasma treatment.  - j physic d appl phys.  1-11. 

     

    xu long, ying guo, yutai su, kim s. siow, chuantong chen.  (2022).  constitutive creep and fatigue behavior of sintered ag for finite element simulation of mechanical reliability a critical review.  - journal of materials science-materials in electronics.  2293-2309. 

     

    xu long, tianxiong su, zubin chen, yutai su, kim s. siow.  (2022).  tunable coefficient of thermal expansion of composite materials for thin-film coatings.  - coatings.  1-17. 

     

    esa sr, omar g, sheikh md fadzullah sh, siow ks, abdul rahim b.  (2021).  the evolutions of microstructure in pressureless sintered silver die attach material.  - international journal of nanoelectronics and materials.  179-194. 

     

    naeem a, siow ks, wee mfmr, ho wk, patra a..  (2022).  the hydrophilization and subsequent hydrophobic recovery mechanism of cold plasma (cp) treated bambarra groundnuts..  - materials science forum.  161-169. 

     

    a. atiqah, r.a.a.a. rahim, a. jalar, k. s. siow.  (2022).  influence of copper substrate roughness on the growth of intermetallic compounds layer in sac305 solder joints.  - international conference on electronic and advanced materials (iceam 2021).  1-6. 

     

    jiaqi zhu, yutai su, chen chuantong, kim s. siow, ruitao tang, xu long.  (2021).  porosity effect on fracture behavior of sintered silver nanoparticles by phase-field modeling.  - 2021 ieee 23rd electronics packaging technology conference (eptc).  317-321. 

     

    km kumar, ks siiow, b. beake.  (2021).  3-d finite element modeling of nanoindentation on sn-3.5ag lead-free solder.  - 2021 ieee regional symposium on micro and nanoelectronics (rsm).  84-87. 

     

    muhammad khairulanwar abdul rahim, muhamad ramdzan buyong, nur mas ayu jamaludin, azrul azlan hamzah, kim shyong siow, burhanuddin yeop majlis.  (2018).  characterization of permittivity and conductivity for eskape pathogens detection.  - 2018 ieee international conference on semiconductor electronics (icse2018). 

     

    chua siang tat, siow kim shyong.  (2022).  perak tersinter sebagai bahan pelekat dalam pempakejan mikroelektronik.  - 167. 

     

    nur aizat kamarulzaman, khai ern lee, kim shyong siow.  (2020).  concepts and approaches for sustainability management.  - 21. 

     

    siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - 279. 

     

    siow kim shyong, vemal raja manikam, chua siang tat.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - 40. 

     

    siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - 15. 

     

    nur aizat kamarulzaman, khai ern lee, kim shyong siow.  (2020).  concepts and approaches for sustainability management.  - 21. 

     

    siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - 15. 

     

    yunhui mei, wang z, siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - 26. 

     

    siow kim shyong, vemal raja manikam, chua siang tat.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - 40. 

     

    arifah rahman, m. farhanulhakim mohd razip wee, siow kim shyong.  (2018).  teknologi semikonduktor dan nanoelektronik: perkembangan dan kegunaan.  - 15. 

     

    chua siang tat, siow kim shyong.  (2022).  perak tersinter sebagai bahan pelekat dalam pempakejan mikroelektronik.  - 167. 

     

    siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - 279. 

     

    chen tiam foo, chan yuen wah, siow kim shyong.  (2018).  keserasian biologi daripada modifikasi plasma.  - 102. 

     

    siow kim shyong.  (2021).  mampukah rawatan plasma menyelesaikan masalah krisis keselamatan makanan?.  - majalah sains.  1-5. 

     

    mohd farhanulhakim bin mohd razip wee;burhanuddin bin yeop majlis;siow kim shyong;ooi poh choon.  (2021).  metallic-polymer nanocomposite by plasma-based deposition process for two-terminal diode based application.  -

     

    naeem ahmed, kim s. siow, m. f. mohd razip wee.  (2021).  germination and growth enhancement of bambara groundnut utilizing low-pressure plasma treatment.  - imen student colloquim.  1-5. 

     

    mohd farhanulhakim bin mohd razip wee;muhamad ramdzan bin buyong;siow kim shyong;lee khai ern;mohd ambri bin mohamed.  (2021).  anti fouling plasma-modified membrane producing potable clean water.  -

     

    chia chin hua;nurul izzaty binti hassan;siow kim shyong;mohd ambri bin mohamed;chin siew xian.  (2020).  production of metallic conducting nanowires for industrial applications.  -