pensyarah universiti
institut kejuruteraan mikro & nanoelektronik (imen)
kimsiow@ukm.edu.my
No. Telefon Rasmi : 60389118542
No. rasmi:
UKM : 03 8921 5555
Kim S Siow ialah Profesor Madya/ Felo Penyelidik di IMEN (2013-sekarang). Bidang penyelidikan beliau adalah berkaitan dengan modifikasi permukaan plasma, pensinteran logam nanopartikel (perak dan tembaga), dan inovasi paten TRIZ. Beliau juga pernah bekerja sebagai jurutera bahan di Infineon Technologies , ON Semiconductor dan Universiti Kebangsaan Singapura (NUS), di samping mengurus teknologi di pusat pemindahan teknologi A*STAR Singapura.
A/Prof Dr Kim S Siow (LLM) is an Associate Professor/ Senior Research Fellow at IMEN . His multi-disciplinary research interests are related to plasma surface modification, sintered metal (silver and copper) bonding, and TRIZ-patent innovation. In addition, he has worked as materials engineer in Infineon Technologies , ON Semiconductor and National University of Singapore, besides working in technology transfer officer at A*STAR Singapore.
maria binti abu bakar;azman bin jalar @ jalil;siow kim shyong;ahmad ghadafi bin ismail. (2023). development of high ductility metallurgical interconnection in sn-based lead-free solder joint via superplastic-like approach. - . .
siow kim shyong;mohd farhanulhakim bin mohd razip wee. (2023). reconciling the mechanisms of seed germination and sterilisation by atmospheric plasma treatment from bio-plasma physics perspective. - . .
asad masood, naeem ahmed, m. f. mohd razip wee, anuttam patra, ebrahim mahmoudi, kim s. siow. (2023). atmospheric pressure plasma polymerisation of d-limonene and its antimicrobial activity. - polymers (mdpi). 1-15.
xu long, ying guo, yutai su, kim s. siow, chuantong chen. (2023). a new unified creep-plasticity constitutive model coupled with damage for viscoplastic materials subjected to fatigue loading. - fatigue & fracture of engineering materials & structures. 1413-1425.
ibrahim n. amirrah, izzat zulkiflee, m. f. mohd razip wee, asad masood, kim s. siow, antonella motta and mh busra fauzi. (2023). plasma-polymerised antibacterial coating of ovine tendon collagen type i (otc) crosslinked with genipin (gnp) and dehydrothermal-crosslinked (dht) as a cutaneous substitute for wound healing. - materials. 1-26.
asad masood, naeem ahmed, m. f. mohd razip wee, anuttam patra, ebrahim mahmoudi, kim s. siow. (2023). atmospheric pressure plasma polymerisation of d-limonene and its antimicrobial activity. - polymers (mdpi). 1-15.
doyeop namgoong; kim s. siow; jong hyun lee. (2023). improvement of bondability by addition of carboxylic acid to the sinter bonding paste containing bimodal sized cu particles and rapid bonding in air. - metals and materials international. 457-466.
xu long, ying guo, yutai su, kim s. siow, chuantong chen. (2023). unveiling the damage evolution of sac305 during fatigue by entropy generation. - international journal of mechanical sciencess. 1-12.
naeem ahmed; kim s. siow; m. f. mohd razipwee; anuttam patra. (2023). a study to examine the ageing behaviour of cold plasma-treated agricultural seeds. - scientific report. 1-12.
asad masood, naeem ahmed, fatima shahid, m. f. mohd razip wee, anuttam patra, kim s. siow. (2023). atmospheric pressure plasma polymerization of carvone: a promising approach for antimicrobial coatings. - coatings. 1-22.
asad masood, naeem ahmed, mohd farhanulhakim mohd razip wee, muhammad aniq shazni mohammad haniff, ebrahim mahmoudi, anuttam patra, kim s siow. (2023). pulsed plasma polymerisation of carvone: characterisations and antibacterial properties. - surface innovations. 339-351.
xu long, ying guo, yutai su, kim s. siow, chuantong chen. (2022). constitutive creep and fatigue behavior of sintered ag for finite element simulation of mechanical reliability a critical review. - journal of materials science-materials in electronics. 2293-2309.
yanliang shan, yunhui mei,, meiyu wang, xin li, yanhong tian, gang chen, siow kim shyong. (2021). ratcheting behavior of sintered copper joints for electronic packaging. - ieee transactions on components, packaging and manufacturing technology. 983-989.
siow kim shyong, arifah rahman, amnani aminuddin, pei yuen ng. (2021). effect of sulfur on nitrogen containing plasma polymers in promoting osteogenic differentiation of wharton jelly mesenchymal stem cells. - sains malaysiana. 3499-3510.
a. suhaimi, e. mahmoudi, k.s. siow, m.f. mohd razip wee. (2020). surface modification of polyamide ultrafiltration membrane by plasma polymerisation of acrylic acid. - sains malaysiana. 3097-3104.
xu long, ying guo, yutai su, kim s. siow, chuantong chen. (2023). a new unified creep-plasticity constitutive model coupled with damage for viscoplastic materials subjected to fatigue loading. - fatigue & fracture of engineering materials & structures. 1413-1425.
asad masood, naeem ahmed, m. f. mohd razip wee, anuttam patra, ebrahim mahmoudi, kim s. siow. (2023). atmospheric pressure plasma polymerisation of d-limonene and its antimicrobial activity. - polymers (mdpi). 1-15.
doyeop namgoong; kim s. siow; jong hyun lee. (2023). improvement of bondability by addition of carboxylic acid to the sinter bonding paste containing bimodal sized cu particles and rapid bonding in air. - metals and materials international. 457-466.
xu long, ying guo, yutai su, kim s. siow, chuantong chen. (2023). unveiling the damage evolution of sac305 during fatigue by entropy generation. - international journal of mechanical sciencess. 1-12.
naeem ahmed; kim s. siow; m. f. mohd razipwee; anuttam patra. (2023). a study to examine the ageing behaviour of cold plasma-treated agricultural seeds. - scientific report. 1-12.
naeem a, siow ks, wee mfmr, ho wk, patra a.. (2022). the hydrophilization and subsequent hydrophobic recovery mechanism of cold plasma (cp) treated bambarra groundnuts.. - materials science forum. 161-169.
xu long, jiaqi zhu, yutai su, kim s. siow, chuantong chen. (2022). phase-field modelling for crack evolution of pbx under thermo- mechanical loadings. - proceedings of the asme 2022 international mechanical engineering congress and exposition (imece2022). 1-7.
a. atiqah, r.a.a.a. rahim, a. jalar, k. s. siow. (2022). influence of copper substrate roughness on the growth of intermetallic compounds layer in sac305 solder joints. - international conference on electronic and advanced materials (iceam 2021). 1-6.
jiaqi zhu, yutai su, chen chuantong, kim s. siow, ruitao tang, xu long. (2021). porosity effect on fracture behavior of sintered silver nanoparticles by phase-field modeling. - 2021 ieee 23rd electronics packaging technology conference (eptc). 317-321.
km kumar, ks siiow, b. beake. (2021). 3-d finite element modeling of nanoindentation on sn-3.5ag lead-free solder. - 2021 ieee regional symposium on micro and nanoelectronics (rsm). 84-87.
chua siang tat, siow kim shyong. (2022). perak tersinter sebagai bahan pelekat dalam pempakejan mikroelektronik. - . 167.
nur aizat kamarulzaman, khai ern lee, kim shyong siow. (2020). concepts and approaches for sustainability management. - . 21.
siow kim shyong. (2019). die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability. - . 279.
siow kim shyong, vemal raja manikam, chua siang tat. (2019). die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability. - . 40.
siow kim shyong. (2019). die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability. - . 15.
nur aizat kamarulzaman, khai ern lee, kim shyong siow. (2020). concepts and approaches for sustainability management. - . 21.
siow kim shyong. (2019). die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability. - . 15.
yunhui mei, wang z, siow kim shyong. (2019). die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability. - . 26.
siow kim shyong, vemal raja manikam, chua siang tat. (2019). die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability. - . 40.
arifah rahman, m. farhanulhakim mohd razip wee, siow kim shyong. (2018). teknologi semikonduktor dan nanoelektronik: perkembangan dan kegunaan. - . 15.
chua siang tat, siow kim shyong. (2022). perak tersinter sebagai bahan pelekat dalam pempakejan mikroelektronik. - . 167.
siow kim shyong. (2019). die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability. - . 279.
chen tiam foo, chan yuen wah, siow kim shyong. (2018). keserasian biologi daripada modifikasi plasma. - . 102.
maria binti abu bakar;azman bin jalar @ jalil;siow kim shyong;ahmad ghadafi bin ismail. (2023). development of high ductility metallurgical interconnection in sn-based lead-free solder joint via superplastic-like approach. - . .
siow kim shyong;mohd farhanulhakim bin mohd razip wee. (2023). reconciling the mechanisms of seed germination and sterilisation by atmospheric plasma treatment from bio-plasma physics perspective. - . .
siow kim shyong. (2022). patent landscape of sintered cu and ag as die-attach materials in microelectronics packaging. - 2022 ieee 39th international electronics manufacturing technology conference (iemt). 1-6.
mohd farhanulhakim bin mohd razip wee;muhamad ramdzan bin buyong;siow kim shyong;lee khai ern;mohd ambri bin mohamed. (2021). anti fouling plasma-modified membrane producing potable clean water. - . .
siow kim shyong. (2021). mampukah rawatan plasma menyelesaikan masalah krisis keselamatan makanan?. - majalah sains. 1-5.
Geran / Grant | Kolaborator / Collaborator | Status |
---|---|---|
ROLES AND MECHANISMS OF PLASMA IONS AND RELATED SPECIES IN BREAKING DOWN PESTICIDES ON FOOD CROPS | dr ngan chai keong | 50.4% (2022-10-01 sehingga 2024-09-30) |
ROLES AND MECHANISMS OF PLASMA IONS AND RELATED SPECIES IN BREAKING DOWN PESTICIDES ON FOOD CROPS | koperasi pertanian dan pemasaran malaysia bhd | 50.4% (2022-10-01 sehingga 2024-09-30) |