kim s. siow; wen shi; behnam akhavan.  (2024).  editorial: industrialization and commercialization in tissue engineering and regenerative medicine: 2022/2023.  - frontiers in bioengineering and biotechnology.  1-2. 

naeem ahmed, asad masood, rubab mumtaz, m. f. mohd razip wee, kok meng chan, anuttam patra; kim s. siow.  (2024).  quad-atmospheric pressure plasma jet (q-appj) treatment of chilli seeds to stimulate germination.  - plasma chemistry and plasma processing.  509-522. 

xu long, ying guo, yutai su, kim s. siow, chuantong chen.  (2023).  a new unified creep-plasticity constitutive model coupled with damage for viscoplastic materials subjected to fatigue loading.  - fatigue & fracture of engineering materials & structures.  1413-1425. 

doyeop namgoong; kim s. siow; jong hyun lee.  (2023).  improvement of bondability by addition of carboxylic acid to the sinter bonding paste containing bimodal sized cu particles and rapid bonding in air.  - metals and materials international.  457-466. 

xu long, ying guo, yutai su, kim s. siow, chuantong chen.  (2023).  unveiling the damage evolution of sac305 during fatigue by entropy generation.  - international journal of mechanical sciencess.  1-12. 

asad masood, naeem ahmed, mohd farhanulhakim mohd razip wee, muhammad aniq shazni mohammad haniff, ebrahim mahmoudi, anuttam patra, kim s siow.  (2023).  pulsed plasma polymerisation of carvone: characterisations and antibacterial properties.  - surface innovations.  339-351. 

xu long, ying guo, yutai su, kim s. siow, chuantong chen.  (2022).  constitutive creep and fatigue behavior of sintered ag for finite element simulation of mechanical reliability a critical review.  - journal of materials science-materials in electronics.  2293-2309. 

yanliang shan, yunhui mei,, meiyu wang, xin li, yanhong tian, gang chen, siow kim shyong.  (2021).  ratcheting behavior of sintered copper joints for electronic packaging.  - ieee transactions on components, packaging and manufacturing technology.  983-989. 

siow kim shyong, arifah rahman, amnani aminuddin, pei yuen ng.  (2021).  effect of sulfur on nitrogen containing plasma polymers in promoting osteogenic differentiation of wharton jelly mesenchymal stem cells.  - sains malaysiana.  3499-3510. 

a. suhaimi, e. mahmoudi, k.s. siow, m.f. mohd razip wee.  (2020).  surface modification of polyamide ultrafiltration membrane by plasma polymerisation of acrylic acid.  - sains malaysiana.  3097-3104. 

kim s. siow; wen shi; behnam akhavan.  (2024).  editorial: industrialization and commercialization in tissue engineering and regenerative medicine: 2022/2023.  - frontiers in bioengineering and biotechnology.  1-2. 

naeem ahmed, asad masood, rubab mumtaz, m. f. mohd razip wee, kok meng chan, anuttam patra; kim s. siow.  (2024).  quad-atmospheric pressure plasma jet (q-appj) treatment of chilli seeds to stimulate germination.  - plasma chemistry and plasma processing.  509-522. 

asad masood, naeem ahmed, m. f. mohd razip wee, anuttam patra, ebrahim mahmoudi, kim s. siow.  (2023).  atmospheric pressure plasma polymerisation of d-limonene and its antimicrobial activity.  - polymers (mdpi).  1-15. 

xu long, ying guo, yutai su, kim s. siow, chuantong chen.  (2023).  a new unified creep-plasticity constitutive model coupled with damage for viscoplastic materials subjected to fatigue loading.  - fatigue & fracture of engineering materials & structures.  1413-1425. 

doyeop namgoong; kim s. siow; jong hyun lee.  (2023).  improvement of bondability by addition of carboxylic acid to the sinter bonding paste containing bimodal sized cu particles and rapid bonding in air.  - metals and materials international.  457-466. 

naeem a, siow ks, wee mfmr, ho wk, patra a..  (2022).  the hydrophilization and subsequent hydrophobic recovery mechanism of cold plasma (cp) treated bambarra groundnuts..  - materials science forum.  161-169. 

xu long, jiaqi zhu, yutai su, kim s. siow, chuantong chen.  (2022).  phase-field modelling for crack evolution of pbx under thermo- mechanical loadings.  - proceedings of the asme 2022 international mechanical engineering congress and exposition (imece2022).  1-7. 

a. atiqah, r.a.a.a. rahim, a. jalar, k. s. siow.  (2022).  influence of copper substrate roughness on the growth of intermetallic compounds layer in sac305 solder joints.  - international conference on electronic and advanced materials (iceam 2021).  1-6. 

jiaqi zhu, yutai su, chen chuantong, kim s. siow, ruitao tang, xu long.  (2021).  porosity effect on fracture behavior of sintered silver nanoparticles by phase-field modeling.  - 2021 ieee 23rd electronics packaging technology conference (eptc).  317-321. 

km kumar, ks siiow, b. beake.  (2021).  3-d finite element modeling of nanoindentation on sn-3.5ag lead-free solder.  - 2021 ieee regional symposium on micro and nanoelectronics (rsm).  84-87. 

chua siang tat, siow kim shyong.  (2022).  perak tersinter sebagai bahan pelekat dalam pempakejan mikroelektronik.  - .  167. 

nur aizat kamarulzaman, khai ern lee, kim shyong siow.  (2020).  concepts and approaches for sustainability management.  - .  21. 

siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - .  279. 

siow kim shyong, vemal raja manikam, chua siang tat.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - .  40. 

siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - .  15. 

nur aizat kamarulzaman, khai ern lee, kim shyong siow.  (2020).  concepts and approaches for sustainability management.  - .  21. 

siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - .  15. 

yunhui mei, wang z, siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - .  26. 

siow kim shyong, vemal raja manikam, chua siang tat.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - .  40. 

arifah rahman, m. farhanulhakim mohd razip wee, siow kim shyong.  (2018).  teknologi semikonduktor dan nanoelektronik: perkembangan dan kegunaan.  - .  15. 

chua siang tat, siow kim shyong.  (2022).  perak tersinter sebagai bahan pelekat dalam pempakejan mikroelektronik.  - .  167. 

siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - .  279. 

chen tiam foo, chan yuen wah, siow kim shyong.  (2018).  keserasian biologi daripada modifikasi plasma.  - .  102. 

a mackie, e costello, sk bhogaraju, s carney, s chada, kim siow, g duttt, md hasnine, a kane, jk kennedy, j lauffer, j mageraa, j b marke, r parthasarathy, l schneider, i swensen, u wetzel.  (2024).  ipc requirements for sintering materials for electrical and thermal interconnects.  - .  1-14. 

maria binti abu bakar;azman bin jalar @ jalil;siow kim shyong;ahmad ghadafi bin ismail.  (2023).  development of high ductility metallurgical interconnection in sn-based lead-free solder joint via superplastic-like approach.  - .  . 

siow kim shyong;mohd farhanulhakim bin mohd razip wee.  (2023).  reconciling the mechanisms of seed germination and sterilisation by atmospheric plasma treatment from bio-plasma physics perspective.  - .  . 

siow kim shyong.  (2022).  patent landscape of sintered cu and ag as die-attach materials in microelectronics packaging.  - 2022 ieee 39th international electronics manufacturing technology conference (iemt).  1-6. 

naeem ahmed, kim s. siow, m. f. mohd razip wee.  (2021).  germination and growth enhancement of bambara groundnut utilizing low-pressure plasma treatment.  - imen student colloquim.  1-5.