asad masood, naeem ahmed, m. f. mohd razip wee, anuttam patra, ebrahim mahmoudi, kim s. siow.  (2023).  atmospheric pressure plasma polymerisation of d-limonene and its antimicrobial activity.  - polymers (mdpi).  1-15. 

doyeop namgoong; kim s. siow; jong hyun lee.  (2023).  improvement of bondability by addition of carboxylic acid to the sinter bonding paste containing bimodal sized cu particles and rapid bonding in air.  - metals and materials international.  457-466. 

naeem ahmed; kim s. siow; m. f. mohd razipwee; anuttam patra.  (2023).  a study to examine the ageing behaviour of cold plasma-treated agricultural seeds.  - scientific report.  1-12. 

xu long, ying guo, yutai su, kim s. siow, chuantong chen.  (2023).  unveiling the damage evolution of sac305 during fatigue by entropy generation.  - international journal of mechanical sciencess.  1-12. 

naeem ahmed, muhammad shahid, kim s siow, m f mohd razip wee, farah farhanah haron, anuttam patra, shazrul fazry.  (2022).  germination and growth improvement of papaya utilizing oxygen (o2) plasma treatment.  - j physic d appl phys.  1-11. 

xu long, ying guo, yutai su, kim s. siow, chuantong chen.  (2022).  constitutive creep and fatigue behavior of sintered ag for finite element simulation of mechanical reliability a critical review.  - journal of materials science-materials in electronics.  2293-2309. 

yanliang shan, yunhui mei,, meiyu wang, xin li, yanhong tian, gang chen, siow kim shyong.  (2021).  ratcheting behavior of sintered copper joints for electronic packaging.  - ieee transactions on components, packaging and manufacturing technology.  983-989. 

siow kim shyong, arifah rahman, amnani aminuddin, pei yuen ng.  (2021).  effect of sulfur on nitrogen containing plasma polymers in promoting osteogenic differentiation of wharton jelly mesenchymal stem cells.  - sains malaysiana.  3499-3510. 

rabiah al adawiyah ab rahim, muhammad nubli zulkifli, azman jalar, atiqah mohd afdzaluddin, kim siow shyong.  (2020).  effect of isothermal aging and copper substrate roughness on the sac305 solder joint intermetallic layer growth of high temperature storage (hts).  - sains malaysiana.  3045-3054. 

a. suhaimi, e. mahmoudi, k.s. siow, m.f. mohd razip wee.  (2020).  surface modification of polyamide ultrafiltration membrane by plasma polymerisation of acrylic acid.  - sains malaysiana.  3097-3104. 

asad masood, naeem ahmed, m. f. mohd razip wee, anuttam patra, ebrahim mahmoudi, kim s. siow.  (2023).  atmospheric pressure plasma polymerisation of d-limonene and its antimicrobial activity.  - polymers (mdpi).  1-15. 

xu long, ying guo, yutai su, kim s. siow, chuantong chen.  (2023).  unveiling the damage evolution of sac305 during fatigue by entropy generation.  - international journal of mechanical sciencess.  1-12. 

naeem ahmed; kim s. siow; m. f. mohd razipwee; anuttam patra.  (2023).  a study to examine the ageing behaviour of cold plasma-treated agricultural seeds.  - scientific report.  1-12. 

doyeop namgoong; kim s. siow; jong hyun lee.  (2023).  improvement of bondability by addition of carboxylic acid to the sinter bonding paste containing bimodal sized cu particles and rapid bonding in air.  - metals and materials international.  457-466. 

naeem ahmed, muhammad shahid, kim s siow, m f mohd razip wee, farah farhanah haron, anuttam patra, shazrul fazry.  (2022).  germination and growth improvement of papaya utilizing oxygen (o2) plasma treatment.  - j physic d appl phys.  1-11. 

naeem a, siow ks, wee mfmr, ho wk, patra a..  (2022).  the hydrophilization and subsequent hydrophobic recovery mechanism of cold plasma (cp) treated bambarra groundnuts..  - materials science forum.  161-169. 

a. atiqah, r.a.a.a. rahim, a. jalar, k. s. siow.  (2022).  influence of copper substrate roughness on the growth of intermetallic compounds layer in sac305 solder joints.  - international conference on electronic and advanced materials (iceam 2021).  1-6. 

jiaqi zhu, yutai su, chen chuantong, kim s. siow, ruitao tang, xu long.  (2021).  porosity effect on fracture behavior of sintered silver nanoparticles by phase-field modeling.  - 2021 ieee 23rd electronics packaging technology conference (eptc).  317-321. 

km kumar, ks siiow, b. beake.  (2021).  3-d finite element modeling of nanoindentation on sn-3.5ag lead-free solder.  - 2021 ieee regional symposium on micro and nanoelectronics (rsm).  84-87. 

muhammad khairulanwar abdul rahim, muhamad ramdzan buyong, nur mas ayu jamaludin, azrul azlan hamzah, kim shyong siow, burhanuddin yeop majlis.  (2018).  characterization of permittivity and conductivity for eskape pathogens detection.  - 2018 ieee international conference on semiconductor electronics (icse2018).  . 

chua siang tat, siow kim shyong.  (2022).  perak tersinter sebagai bahan pelekat dalam pempakejan mikroelektronik.  - .  167. 

nur aizat kamarulzaman, khai ern lee, kim shyong siow.  (2020).  concepts and approaches for sustainability management.  - .  21. 

siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - .  279. 

siow kim shyong, vemal raja manikam, chua siang tat.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - .  40. 

siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - .  15. 

nur aizat kamarulzaman, khai ern lee, kim shyong siow.  (2020).  concepts and approaches for sustainability management.  - .  21. 

siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - .  15. 

yunhui mei, wang z, siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - .  26. 

siow kim shyong, vemal raja manikam, chua siang tat.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - .  40. 

arifah rahman, m. farhanulhakim mohd razip wee, siow kim shyong.  (2018).  teknologi semikonduktor dan nanoelektronik: perkembangan dan kegunaan.  - .  15. 

chua siang tat, siow kim shyong.  (2022).  perak tersinter sebagai bahan pelekat dalam pempakejan mikroelektronik.  - .  167. 

siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - .  279. 

chen tiam foo, chan yuen wah, siow kim shyong.  (2018).  keserasian biologi daripada modifikasi plasma.  - .  102. 

siow kim shyong.  (2022).  patent landscape of sintered cu and ag as die-attach materials in microelectronics packaging.  - 2022 ieee 39th international electronics manufacturing technology conference (iemt).  1-6. 

mohd farhanulhakim bin mohd razip wee;burhanuddin bin yeop majlis;siow kim shyong;ooi poh choon.  (2021).  metallic-polymer nanocomposite by plasma-based deposition process for two-terminal diode based application.  - .  . 

naeem ahmed, kim s. siow, m. f. mohd razip wee.  (2021).  germination and growth enhancement of bambara groundnut utilizing low-pressure plasma treatment.  - imen student colloquim.  1-5. 

mohd farhanulhakim bin mohd razip wee;muhamad ramdzan bin buyong;siow kim shyong;lee khai ern;mohd ambri bin mohamed.  (2021).  anti fouling plasma-modified membrane producing potable clean water.  - .  . 

siow kim shyong.  (2021).  mampukah rawatan plasma menyelesaikan masalah krisis keselamatan makanan?.  - majalah sains.  1-5.