dr. siow kim shyong

pensyarah universiti

institut kejuruteraan mikro & nanoelektronik (imen)

 kimsiow@ukm.edu.my

No. sambungan :  60389118542

No. rasmi:
UKM : 03 8921 5555



   Biografi/ Biography :

  • Kim S Siow PhD LLM MASc BASc (Hons) CEng PMP is a Research Fellow at IMEN and an Associate Fellow at PIK UKM. His multi-disciplinary research interests are related to plasma surface modification, sintered silver bonding and patent circumvention.

  • siow kim shyong, arifah rahman, amnani aminuddin, pei yuen ng.  (2021).  effect of sulfur on nitrogen containing plasma polymers in promoting osteogenic differentiation of wharton jelly mesenchymal stem cells.  - sains malaysiana.  3499-3510. 

     

    naeem ahmed , asad masood , kim s. siow , m. f. mohd razipwee , r.z. auliya, w. k. ho.  (2021).  effect of h2o-based low-pressure plasma (lpp) treatment on the germination of bambara groundnut seeds.  - agronomy.  1-16. 

     

    chen tiam foo, siow kim shyong.  (2021).  comparing the mechanical and thermal-electrical properties of sintered copper (cu) and sintered silver (ag) joints.  - journal of alloys and compounds.  1-19. 

     

    muhamad ramdzan bin buyong;burhanuddin bin yeop majlis;norazreen binti abd aziz;azrul azlan bin hamzah;siow kim shyong.  (2020).  tapered dielectrophoresis electrode for anticlogging in biological fluids filtration.  -

     

    lee khai ern;mazlin mokhtar;mohd. raihan bin taha;mohd talib bin latif;marlia binti mohd hanafiah;goh choo ta;siow kim shyong;lubna alam.  (2020).  public risk perception and ethical governance of nanotechnology for sustainability in malaysia.  -

     

    chen tiam foo, siow kim shyong.  (2021).  comparing the mechanical and thermal-electrical properties of sintered copper (cu) and sintered silver (ag) joints.  - journal of alloys and compounds.  1-19. 

     

    naeem ahmed , asad masood , kim s. siow , m. f. mohd razipwee , r.z. auliya, w. k. ho.  (2021).  effect of h2o-based low-pressure plasma (lpp) treatment on the germination of bambara groundnut seeds.  - agronomy.  1-16. 

     

    nur aizat kamarulzaman, khai ern lee, kim shyong siow, mazlin mokhtar.  (2020).  public benefit and risk perceptions of nanotechnology development: psychological and sociological aspects.  - technology in society.  1-9. 

     

    kim s. siow, arifah syahirah abdul rahman, pei yuen ng, burhanuddin y. majlis.  (2020).  sulfur and nitrogen containing plasma polymers reduces bacterial attachment and growth.  - materials science and engineering c.  11022-11026. 

     

    mohd syafiq faiz, mahmoud addouche, ahmad rifqi md zain,kim s. siow, amar chaalane, abdelkrim khelif.  (2020).  experimental demonstration of a multichannel elastic wave filter in a phononic crystal slab.  - applied sciences.  1-11. 

     

    siow kim shyong, arifah rahman, amnani aminuddin, pei yuen ng.  (2021).  effect of sulfur on nitrogen containing plasma polymers in promoting osteogenic differentiation of wharton jelly mesenchymal stem cells.  - sains malaysiana.  3499-3510. 

     

    rabiah al adawiyah ab rahim, muhammad nubli zulkifli, azman jalar, atiqah mohd afdzaluddin, kim siow shyong.  (2020).  effect of isothermal aging and copper substrate roughness on the sac305 solder joint intermetallic layer growth of high temperature storage (hts).  - sains malaysiana.  3045-3054. 

     

    a. suhaimi, e. mahmoudi, k.s. siow, m.f. mohd razip wee.  (2020).  surface modification of polyamide ultrafiltration membrane by plasma polymerisation of acrylic acid.  - sains malaysiana.  3097-3104. 

     

    meyghani b, awang m, emamian s, plank b, christoph h, siow ks,.  (2019).  stress analysis of nano porous material using computed tomography images.  - materialwissenschaft und werkstofftechnik. 

     

    b. meyghani, m. awang, p. bokam, b. plank, c. heinzl, k. s. siow.  (2019).  finite element modeling of nano porous sintered silver material using computed tomography images.  - material science and engineering technology.  533-538. 

     

    muhammad izzuddin abd samad, farahdiana wan yunus, muhamad ramdzan buyong, kim shyong siow, azrul azlan hamzah & burhanuddin yeop majlis.  (2018).  voltage characterization on dielectrophoretic force respond to hematologic cell manipulation.  - 2018 ieee international conference on semiconductor electronics (icse2018). 

     

    siow ks, chua st & zuruzi as.  (2018).  interfacial tem analysis of sintered silver in air and n2-5%h2 gases environment.  - 38th international electronics manufacturing technology conference. 

     

    muhammad khairulanwar abdul rahim, muhamad ramdzan buyong, nur mas ayu jamaludin, azrul azlan hamzah, kim shyong siow, burhanuddin yeop majlis.  (2018).  characterization of permittivity and conductivity for eskape pathogens detection.  - 2018 ieee international conference on semiconductor electronics (icse2018). 

     

    sp lim, b pan, h zhang, w ng, b. wu, ks siow, s sabne, m. tsuriya.  (2017).  high-temperature pb-free die attach material project phase 1: survey result.  - international conference on electronic packaging, yamagata japan.  51-56. 

     

    mohd amir zulkefli, mohd ambri mohamed, kim s siow, burhanuddin yeop majlis.  (2016).  optimization of beam length and air gap of suspended graphene nems switch for low pull-in voltage application.  - ieee-icse2016 proc. 2016, kuala lumpur, malaysia.  29-32. 

     

    muhammad izzuddin abd samad, farahdiana wan yunus, muhamad ramdzan buyong, kim shyong siow, azrul azlan hamzah & burhanuddin yeop majlis.  (2018).  voltage characterization on dielectrophoretic force respond to hematologic cell manipulation.  - 2018 ieee international conference on semiconductor electronics (icse2018). 

     

    siow ks, chua st & zuruzi as.  (2018).  interfacial tem analysis of sintered silver in air and n2-5%h2 gases environment.  - 38th international electronics manufacturing technology conference. 

     

    muhammad khairulanwar abdul rahim, muhamad ramdzan buyong, nur mas ayu jamaludin, azrul azlan hamzah, kim shyong siow, burhanuddin yeop majlis.  (2018).  characterization of permittivity and conductivity for eskape pathogens detection.  - 2018 ieee international conference on semiconductor electronics (icse2018). 

     

    sp lim, b pan, h zhang, w ng, b. wu, ks siow, s sabne, m. tsuriya.  (2017).  high-temperature pb-free die attach material project phase 1: survey result.  - international conference on electronic packaging, yamagata japan.  51-56. 

     

    mohd amir zulkefli, mohd ambri mohamed, kim s siow, burhanuddin yeop majlis.  (2016).  optimization of beam length and air gap of suspended graphene nems switch for low pull-in voltage application.  - ieee-icse2016 proc. 2016, kuala lumpur, malaysia.  29-32. 

     

    nur aizat kamarulzaman, khai ern lee, kim shyong siow.  (2020).  concepts and approaches for sustainability management.  - 21. 

     

    siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - 15. 

     

    siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - 279. 

     

    siow kim shyong, vemal raja manikam, chua siang tat.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - 40. 

     

    yunhui mei, wang z, siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - 26. 

     

    nur aizat kamarulzaman, khai ern lee, kim shyong siow.  (2020).  concepts and approaches for sustainability management.  - 21. 

     

    siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - 15. 

     

    yunhui mei, wang z, siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - 26. 

     

    siow kim shyong, vemal raja manikam, chua siang tat.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - 40. 

     

    arifah rahman, m. farhanulhakim mohd razip wee, siow kim shyong.  (2018).  teknologi semikonduktor dan nanoelektronik: perkembangan dan kegunaan.  - 15. 

     

    siow kim shyong.  (2019).  die-attach materials for high temperature applications in microelectronics packaging: materials, processes, equipment and reliability.  - 279. 

     

    chen tiam foo, chan yuen wah, siow kim shyong.  (2018).  keserasian biologi daripada modifikasi plasma.  - 102. 

     

    chia chin hua;nurul izzaty binti hassan;siow kim shyong;mohd ambri bin mohamed;chin siew xian.  (2020).  production of metallic conducting nanowires for industrial applications.  -

     

    muhamad ramdzan bin buyong;burhanuddin bin yeop majlis;norazreen binti abd aziz;azrul azlan bin hamzah;siow kim shyong.  (2020).  tapered dielectrophoresis electrode for anticlogging in biological fluids filtration.  -

     

    siow kim shyong.  (2020).  consider a spherical patent: ip and patenting in technology business.  - materials world.  52. 

     

    lee khai ern;mazlin mokhtar;mohd. raihan bin taha;mohd talib bin latif;marlia binti mohd hanafiah;goh choo ta;siow kim shyong;lubna alam.  (2020).  public risk perception and ethical governance of nanotechnology for sustainability in malaysia.  -

     

    rabiah al adawiyah ab rahim, azman jalar, maria abu bakar, siow kim shyong.  (2019).  effect of substrate surface roughness on the growth of intermetallic compound layer lead free solder joint.  - 1-5.