dr. maria binti abu bakar

pensyarah universiti

institut kejuruteraan mikro & nanoelektronik (imen)

No. Telefon Rasmi :  0389126984

No. rasmi:
UKM : 03 8921 5555



   Biografi/ Biography :


  • n. a. azra, a. atiqah, h. fadhlina, m. a. bakar, a. jalar, r. a. ilyas, j. naveen, f. a. sabaruddin, k. k. lim, m. asrofi.  (2023).  oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices: water absorption, thickness swelling and density properties.  - applied science and engineering progress.  1-9. 

     

    maria binti abu bakar;azman bin jalar @ jalil.  (2022).  pencirian mikrostruktur dan sifat mekanik sambungan pateri pic halus dalam pakej elektronik.  -

     

    azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2022).  microstructural characterization of copper wire bonding in semiconductor packaging.  -

     

    azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2022).  wedge bond corrosion of copper wire bonding.  -

     

    a atiqah, a. jalar, m.a. bakar, n. ismail.  (2022).  recent progress in lead-free solder technology.  - 332. 

     

    n.ismail, a.atiqah, a.jalar, m.a.bakar, r.a.a.rahim, a.g.ismail, a.a.hamzah, l.k.keng.  (2022).  a systematic literature review: the effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints.  - journal of manufacturing processes.  68-85. 

     

    adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, john burke, zol effendi zolkefli, erwan basiron.  (2022).  effect of heat shield locations on rework-induced thermal management in ball grid array solder joint.  - scientific reports.  1-12. 

     

    azman jalar, maria abu bakar, roslina ismail.  (2020).  temperature dependence of elastic-plastic properties of fine-pitch sac 0307 solder joint using nanoindentation approach.  - metallurgical and materials transactions a-physical metallurgy and material.  1221-1228. 

     

    norliza ismail, azman jalar, maria abu bakar, roslina ismail, najib saedi ibrahim.  (2020).  effect of flux functional group for solder paste formulation towards soldering quality of sac305/cnt/cu.  - soldering & surface mount technology.  157-164. 

     

    norliza ismail, azman jalar, maria abu bakar, nur shafiqa safee, wan yusmawati wan yusoff, ariffin ismail.  (2020).  microstructural evolution and micromechanical properties of sac305/cnt/cu solder joint under blast wave condition.  - soldering & surface mount technology.  47-56. 

     

    mohamad solehin mohamed sunar, maria abu bakar, azman jalar, mohamad riduwan ramli, fakhrozi che ani.  (2022).  effect of alloy particle size and stencil aperture shape on solder printing quality.  - microelectronics international.  81-90. 

     

    abdul a omar, azman jalar, maria a bakar, khirullah a hamid.  (2022).  sulfur ingression on encapsulated leadframe of discrete semiconductor package.  - ieee transactions on components, packaging and manufacturing technology.  544-550. 

     

    fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2022).  temperature-induced thickness reduction of micromechanical properties of sn-0.7cu solder alloy.  - materiali in tehnologije, materials and technology.  373-379. 

     

    nurul adlin mahadzir, angela amphawan, tendai masunda, p. susthitha menon, azman jalar, maria abu bakar, ahmad ghadafi ismail.  (2021).  tapered waveguide design for mode conversion in mode division multiplexing (mdm).  - optoelectronics and advanced materials rapid communications.  325-331. 

     

    norliza ismail, azman jalar, atiqah afdzaluddin, maria abu bakar.  (2021).  electrical resistivity of sn 3.0 ag 0.5cu solder joint with the incorporation of carbon nanotubes.  - nanomaterials and nanotechnology.  1-9. 

     

    n. a. azra, a. atiqah, h. fadhlina, m. a. bakar, a. jalar, r. a. ilyas, j. naveen, f. a. sabaruddin, k. k. lim, m. asrofi.  (2023).  oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices: water absorption, thickness swelling and density properties.  - applied science and engineering progress.  1-9. 

     

    fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2022).  temperature-induced thickness reduction of micromechanical properties of sn-0.7cu solder alloy.  - materiali in tehnologije, materials and technology.  373-379. 

     

    abdul a omar, azman jalar, maria a bakar, khirullah a hamid.  (2022).  sulfur ingression on encapsulated leadframe of discrete semiconductor package.  - ieee transactions on components, packaging and manufacturing technology.  544-550. 

     

    mohamad solehin mohamed sunar, maria abu bakar, azman jalar, mohamad riduwan ramli, fakhrozi che ani.  (2022).  effect of alloy particle size and stencil aperture shape on solder printing quality.  - microelectronics international.  81-90. 

     

    n.ismail, a.atiqah, a.jalar, m.a.bakar, r.a.a.rahim, a.g.ismail, a.a.hamzah, l.k.keng.  (2022).  a systematic literature review: the effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints.  - journal of manufacturing processes.  68-85. 

     

    p. vijayakumaran, m. h. m. ramli, m. selvam, k. hamid, a. atiqah, a. jalar, m. a. bakar.  (2022).  reduce wafer remnants through pre-assembly process optimization.  - international conference on electronic and advanced materials (iceam 2021).  1-5. 

     

    m. s. mohamed sunar, m. abu bakar, a. jalar, f. che ani, m . r. ramli.  (2022).  effect of stencil wall aperture on solder paste release via stencil printing.  - international conference on electronic and advanced materials (iceam 2021) - journal of physics: conference series.  1-6. 

     

    khirullah abdul hamid, aiman hakim badarisman, azman jalar, maria abu bakar.  (2022).  effects of electrolyte towards copper wire metallurgical interconnection in semiconductor.  - international conference on electronic and advanced materials (iceam 2021).  1-6. 

     

    khirullah abdul hamid, aiman hakim badarisman, azman jalar, maria abu bakar.  (2022).  investigation of integrated factors in the occurrence of copper wire bonding corrosion of semiconductor packages.  - international conference on electronic and advanced materials 2021 (iceam 2021).  1-5. 

     

    aiman hakim badarisman, khirullah abdul hamid, hamizan ideris, maria abu bakar, azman jalar.  (2022).  effects of molding temperature on delamination of small outline transistor (sot).  - international conference on electronic and advanced materials (iceam 2021).  1-7. 

     

    m.a. bakar, a. jalar, a. atiqah, n. ismail.  (2022).  recent progress in lead-free solder technology.  - 332. 

     

    a atiqah, a. jalar, m.a. bakar, n. ismail.  (2022).  recent progress in lead-free solder technology.  - 332. 

     

    n. ismail, a. jalar, m.a. bakar, a. atiqah.  (2022).  recent progress in lead-free solder technology.  - 21. 

     

    norliza ismail, azman jalar, maria abu bakar.  (2021).  pematerian bahan pateri bebas plumbum berpengisi karbon nanotiub.  - 121. 

     

    roslina ismail, maria abu bakar, azman jalar.  (2018).  teknologi semikonduktor dan nanoelektronik: perkembangan dan kegunaan.  - 13. 

     

    a atiqah, a. jalar, m.a. bakar, n. ismail.  (2022).  recent progress in lead-free solder technology.  - 332. 

     

    n. ismail, a. jalar, m.a. bakar, a. atiqah.  (2022).  recent progress in lead-free solder technology.  - 21. 

     

    m.a. bakar, a. jalar, a. atiqah, n. ismail.  (2022).  recent progress in lead-free solder technology.  - 332. 

     

    roslina ismail, maria abu bakar, azman jalar.  (2018).  teknologi semikonduktor dan nanoelektronik: perkembangan dan kegunaan.  - 13. 

     

    maria abu bakar, azman jalar.  (2018).  teknologi semikonduktor dan nanoelektronik : perkembangan dan kegunaan.  - 32. 

     

    norliza ismail, azman jalar, maria abu bakar.  (2021).  pematerian bahan pateri bebas plumbum berpengisi karbon nanotiub.  - 121. 

     

    azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2022).  wedge bond corrosion of copper wire bonding.  -

     

    azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2022).  microstructural characterization of copper wire bonding in semiconductor packaging.  -

     

    maria binti abu bakar;azman bin jalar @ jalil.  (2022).  pencirian mikrostruktur dan sifat mekanik sambungan pateri pic halus dalam pakej elektronik.  -

     

    azman bin jalar @ jalil;mohd zulhakimi bin ab razak @ mamat;maria binti abu bakar.  (2021).  mikrostruktur dan sifat superplastik aloi pateri bebas plumbum.  -

     

    azman bin jalar @ jalil;mohd zulhakimi bin ab razak @ mamat;maria binti abu bakar.  (2021).  penentuan sifat kesuperplastikan bagi bahan aloi pateri hijau.  -