adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, john burke, zol effendi zolkefli, erwan basiron.  (2022).  effect of heat shield locations on rework-induced thermal management in ball grid array solder joint.  - scientific reports.  1-12. 

n.ismail, a.atiqah, a.jalar, m.a.bakar, r.a.a.rahim, a.g.ismail, a.a.hamzah, l.k.keng.  (2022).  a systematic literature review: the effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints.  - journal of manufacturing processes.  68-85. 

maria abu bakar, atiqah mohd afdzaluddin, azman jalar.  (2022).  review on corrosion in electronic packaging trends of collaborative between academia-industry.  - sustainability.  1-33. 

azman jalar, maria abu bakar, roslina ismail.  (2020).  temperature dependence of elastic-plastic properties of fine-pitch sac 0307 solder joint using nanoindentation approach.  - metallurgical and materials transactions a-physical metallurgy and material.  1221-1228. 

norliza ismail, azman jalar, maria abu bakar, nur shafiqa safee, wan yusmawati wan yusoff, ariffin ismail.  (2020).  microstructural evolution and micromechanical properties of sac305/cnt/cu solder joint under blast wave condition.  - soldering & surface mount technology.  47-56. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, erwan basiron, fakhrozi che ani.  (2022).  cardinal and ordinal directions approach in investigating arrayed solder joints crack propagation of ball grid array semiconductor packages.  - ieee transactions on components packaging and manufacturing technology.  1492-1501. 

abdul a omar, azman jalar, maria a bakar, khirullah a hamid.  (2022).  sulfur ingression on encapsulated leadframe of discrete semiconductor package.  - ieee transactions on components, packaging and manufacturing technology.  544-550. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2022).  kesan rawatan termomekanik dengan mampatan tunggal terhadap mikrostruktur dan sifat mikromekanik aloi pateri sn-0.7cu.  - sains malaysiana.  3775-3784. 

mohamad solehin mohamed sunar, maria abu bakar, azman jalar, mohamad riduwan ramli, fakhrozi che ani.  (2022).  effect of alloy particle size and stencil aperture shape on solder printing quality.  - microelectronics international.  81-90. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2022).  temperature-induced thickness reduction of micromechanical properties of sn-0.7cu solder alloy.  - materiali in tehnologije, materials and technology.  373-379. 

n. a. azra, a. atiqah, h. fadhlina, m. a. bakar, a. jalar, r. a. ilyas, j. naveen, f. a. sabaruddin, k. k. lim, m. asrofi.  (2023).  oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices: water absorption, thickness swelling and density properties.  - applied science and engineering progress.  1-9. 

saraswathy supramaniam, maria abu bakar, azman jalar.  (2022).  early corrosion detection of cu-ag wedge bonding in semiconductor package.  - journal of failure analysis and prevention.  2317-2325. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2022).  kesan rawatan termomekanik dengan mampatan tunggal terhadap mikrostruktur dan sifat mikromekanik aloi pateri sn-0.7cu.  - sains malaysiana.  3775-3784. 

mohamad solehin mohamed sunar, maria abu bakar, azman jalar, mohamad riduwan ramli, fakhrozi che ani.  (2022).  effect of alloy particle size and stencil aperture shape on solder printing quality.  - microelectronics international.  81-90. 

n.ismail, a.atiqah, a.jalar, m.a.bakar, r.a.a.rahim, a.g.ismail, a.a.hamzah, l.k.keng.  (2022).  a systematic literature review: the effects of surface roughness on the wettability and formation of intermetallic compound layers in lead-free solder joints.  - journal of manufacturing processes.  68-85. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, zol effendi zolkefli, erwan basiron.  (2023).  thermal management on the solder joints of adjacent ball grid array (bga) rework components using laser soldering.  - green materials and electronic packaging interconnect technology symposium (epits 2022).  103-113. 

fateh amera mohd yusoff, maria abu bakar, azman jalar.  (2023).  effect of thermomechanical treatment on microstructural and localized micromechanical properties of sn0.7cu solder alloy.  - green materials and electronic packaging interconnect technology symposium (epits 2022).  133-144. 

adlil aizat ismail, maria abu bakar, abang annuar ehsan, azman jalar, erwan basiron, fakhrozi che ani.  (2022).  intermetallic compound thickness of ball grid array solder joints under thermal cycling test using anova.  - 2022 ieee 39th international electronics manufacturing technology conference (iemt).  1-4. 

khirullah abdul hamid, aiman hakim badarisman, azman jalar, maria abu bakar.  (2022).  investigation of integrated factors in the occurrence of copper wire bonding corrosion of semiconductor packages.  - international conference on electronic and advanced materials 2021 (iceam 2021).  1-5. 

aiman hakim badarisman, khirullah abdul hamid, hamizan ideris, maria abu bakar, azman jalar.  (2022).  effects of molding temperature on delamination of small outline transistor (sot).  - international conference on electronic and advanced materials (iceam 2021).  1-7. 

m.a. bakar, a. jalar, a. atiqah, n. ismail.  (2022).  recent progress in lead-free solder technology.  - .  332. 

a atiqah, a. jalar, m.a. bakar, n. ismail.  (2022).  recent progress in lead-free solder technology.  - .  332. 

n. ismail, a. jalar, m.a. bakar, a. atiqah.  (2022).  recent progress in lead-free solder technology.  - .  21. 

norliza ismail, azman jalar, maria abu bakar.  (2021).  pematerian bahan pateri bebas plumbum berpengisi karbon nanotiub.  - .  121. 

roslina ismail, maria abu bakar, azman jalar.  (2018).  teknologi semikonduktor dan nanoelektronik: perkembangan dan kegunaan.  - .  13. 

a. atiqah, n. ismail, k.k. lim, a. jalar, m.a. bakar, m.a. maleque, r.a. ilyas, a.b.m. supian.  (2022).  recycling of plastics, metals, and their composites.  - .  15. 

a atiqah, a. jalar, m.a. bakar, n. ismail.  (2022).  recent progress in lead-free solder technology.  - .  332. 

n. ismail, a. jalar, m.a. bakar, a. atiqah.  (2022).  recent progress in lead-free solder technology.  - .  21. 

m.a. bakar, a. jalar, a. atiqah, n. ismail.  (2022).  recent progress in lead-free solder technology.  - .  332. 

roslina ismail, maria abu bakar, azman jalar.  (2018).  teknologi semikonduktor dan nanoelektronik: perkembangan dan kegunaan.  - .  13. 

norliza ismail, azman jalar, maria abu bakar.  (2021).  pematerian bahan pateri bebas plumbum berpengisi karbon nanotiub.  - .  121. 

azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2023).  corrosion prevention mechanism for automotive semiconductor devices packaging via de-sulphuring process.  - .  . 

maria binti abu bakar;azman bin jalar @ jalil;siow kim shyong;ahmad ghadafi bin ismail.  (2023).  development of high ductility metallurgical interconnection in sn-based lead-free solder joint via superplastic-like approach.  - .  . 

maria binti abu bakar;azman bin jalar @ jalil.  (2022).  pencirian mikrostruktur dan sifat mekanik sambungan pateri pic halus dalam pakej elektronik.  - .  . 

azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2022).  microstructural characterization of copper wire bonding in semiconductor packaging.  - .  . 

azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar.  (2022).  wedge bond corrosion of copper wire bonding.  - .  .