pensyarah universiti
institut kejuruteraan mikro & nanoelektronik (imen)
maria@ukm.edu.my
Biografi/ Biography :
Dr. Maria Abu Bakar merupakan pensyarah kanan/felo penyelidik dalam bidang mikroelektronik dan teknologi semikonduktor. Beliau menerima PhD dalam kejuruteraan mikro dan nanoelektronik dan ijazah sarjana dalam sains bahan. Projek penyelidikan PhD beliau memberi tumpuan kepada bahan antarasambungan untuk pempakejan elektronik terutama dari segi kualiti sambungan pateri pada kemasan permukaan yang berbeza. Bidang penyelidikan beliau adalah berkaitan dengan pempakejan semikonduktor elektronik dan bahan terutamanya pada hubungkait antara struktur-sifat-prestasi. Beliau telah berpengalaman selama 10 tahun berkolaborasi dengan pihak industri semikonduktor elektronik di Malaysia. Selain itu, kerjaya beliau sebagai ahli akademik telah membolehkan beliau untuk aktif membimbing pekerja industri dan menggalakkan mereka untuk melanjutkan pengajian peringkat sarjana dan PhD dalam teknologi mikroelektronik dan semikonduktor. Dr. Maria melihat peluang yang baik untuk membentuk masa depan mikroelektronik semikonduktor di Malaysia dengan membentuk kolaborasi penyelidikan antara pihak akademik dan pihak industri elektronik semikonduktor di Malaysia.
Dr. Maria Abu Bakar is a senior lecturer and research fellow in the field of microelectronics and semiconductor technology. She received her PhD in microengineering and nanoelectronics and master’s degree in materials science. Her PhD research project focused on the interconnection material for electronic packaging, especially on the solder joint quality on different surface finishes. Her research interests include semiconductor electronic packaging and materials, especially the structure-properties-performance relationship. She has 10 years’ experience in collaborating with the semiconductor and electronics industries in Malaysia. In addition, her job as an academician has enabled her to actively mentor industrial workers, encouraging them to pursue a master`s or PhD in microelectronics and semiconductor technology. Dr. Maria notices her great opportunities to shape the future of semiconductor microelectronics in Malaysia by establishing good research collaboration between academia and the semiconductor electronics industries in Malaysia.
muhammad firdaus suhaimi, maria abu bakar, azman jalar, adlil aizat ismail, muhammad nizam ilias, mohamad riduwan ramli, fakhrozi che ani, a. atiqah. (2025). stereometric analysis of underfilled micro ball grid array solder joints under thermal cycling conditions. - jurnal kejuruteraan. 1387 - 1396.
muhammad nizam ilias, maria abu bakar, azman jalar, adlil aizat ismail, erwan basiron. (2025). influence of epoxy molding compounds on crack severity in lead-free solder joints of mirrored nand flash bga packages under thermal cycling conditions. - proceedings of the green materials and electronic packaging interconnect technology symposium. 45 - 51.
maria abu bakar, azman jalar, syed mohamad mardzukey syed mohamed zain, fakhrozi che ani, mohamad riduwan ramli. (2025). epoxy mold compound cracking in bga components: impact of moisture content during assembly. - proceedings of the green materials and electronic packaging interconnect technology symposium. 38 - 44.
adlil aizat ismail, maria abu bakar, azman jalar, mohd ridzwan yaakub, muhammad iqbal abu latiffi, erwan basiron, muhammad nizam ilias. (2025). artificial neural networks analysis for predicting gold diffusion in solder joints under various rework and thermal cycling. - proceedings of the green materials and electronic packaging interconnect technology symposium. 10 - 17.
maria abu bakar, azman jalar, muhammad azmi abdul hamid. (2025). teknologi transistor: prinsip, pempakejan dan praktis. - . .
nor rashikin abd khalid, muhammad khalil abdullah, maria abu bakar, syed mohamad mardzukey syed mohamed zain, mohamad riduwan ramli. (2025). thermal characteristics dependency of epoxy underfill on crosslinker molecular structures and hardener concentration in electronic packaging. - journal of electronic packaging. 1 - 8.
mohamad solehin mohamed sunar, maria abu bakar, atiqah a., azman jalar, muhamed abdul fatah muhamed mukhtar, fakhrozi che ani. (2024). effect of pvd-coated wall aperture roughness on the life span of fine-pitch stencil printing. - soldering & surface mount technology. 51-59.
maria abu bakar, azman jalar, anuar alias. (2024). linear growth behaviour of intermetallic compound layer in electronic interconnections. - science and technology of welding and joining. 1-9.
adlil aizat ismail, maria abu bakar, azman jalar, fakhrozi che ani, zol effendi zolkefli, erwan basiron. (2024). undissolved gold in fine-pitch bga solder joint under thermal cycling test. - journal of materials science: materials in electronics. 1-9.
sazan ali kamal mohammed, mohd zulhakimi ab razak, abdul hadi abd rahman, maria abu bakar. (2024). an efficient intersection over union algorithm for 3d object detection. - ieee access. 169768 - 169786.
sabarina abdul hamid, muhammad nubli zulkifli, azman jalar, wan nursheila wan jusoh, maria abu bakar, hassan basher, michael daenen. (2024). ultrasonic al bond on mo back-contact layer of cigs solar panel characterization using infinite focus microscope (ifm) and micro-ohmmeter. - ieee transactions on components, packaging and manufacturing technology. 1123 - 1133.
ahmad zarif azahar, maria abu bakar, azman jalar, fakhrozi che ani. (2024). effect of die deflection during au wire bonding process on bonding quality in overhang semiconductor package. - journal of materials engineering and performance. 5836 - 5845.
adlil aizat ismail, maria abu bakar, azman jalar, zol effendi zolkefli, erwan basiron, muhammad nizam ilias. (2024). laser rework process for efficient lead-free solder joints ball grid array (bga) component rework. - ieee transactions on components, packaging and manufacturing technology. 735 - 742.
maria abu bakar, mohamad solehin mohamed sunar, azman jalar, a atiqah, fakhrozi che ani, ibrahym ahmad, zol effendi zolkefli. (2023). effect of sn plating thickness on wettability, solderability, and electrical connections of electronic lead connectors for surface mount technology applications. - sains malaysiana. 3247-3258.
abdul a omar, azman jalar, maria a bakar, khirullah a hamid. (2022). sulfur ingression on encapsulated leadframe of discrete semiconductor package. - ieee transactions on components, packaging and manufacturing technology. 544-550.
nor rashikin abd khalid, muhammad khalil abdullah, maria abu bakar, syed mohamad mardzukey syed mohamed zain, mohamad riduwan ramli. (2025). thermal characteristics dependency of epoxy underfill on crosslinker molecular structures and hardener concentration in electronic packaging. - journal of electronic packaging. 1 - 8.
sabarina abdul hamid, muhammad nubli zulkifli, azman jalar, wan nursheila wan jusoh, maria abu bakar, hassan basher, michael daenen. (2025). evaluation of nanoindentation load-depth of ultrasonic aluminium bond on molybdenum back contact layer of cigs thin film photovoltaic. - journal of advanced research in micro and nano engineering. 58 - 65.
azman jalar, ee may lim, maria abu bakar, adlil aizat ismail, fakhrozi che ani, choo par tan. (2025). enhancing ball grid array (bga) component on printed circuit board (pcb) solder joint integrity with antimony element. - journal of failure analysis and prevention. 813 - 827.
sazan ali kamal mohammed, mohd zulhakimi ab razak, abdul hadi abd rahman, maria abu bakar. (2024). an efficient intersection over union algorithm for 3d object detection. - ieee access. 169768 - 169786.
ahmad zarif azahar, maria abu bakar, azman jalar, fakhrozi che ani. (2024). effect of die deflection during au wire bonding process on bonding quality in overhang semiconductor package. - journal of materials engineering and performance. 5836 - 5845.
muhammad nizam ilias, maria abu bakar, azman jalar, adlil aizat ismail, erwan basiron. (2025). influence of epoxy molding compounds on crack severity in lead-free solder joints of mirrored nand flash bga packages under thermal cycling conditions. - proceedings of the green materials and electronic packaging interconnect technology symposium. 45 - 51.
maria abu bakar, azman jalar, syed mohamad mardzukey syed mohamed zain, fakhrozi che ani, mohamad riduwan ramli. (2025). epoxy mold compound cracking in bga components: impact of moisture content during assembly. - proceedings of the green materials and electronic packaging interconnect technology symposium. 38 - 44.
adlil aizat ismail, maria abu bakar, azman jalar, mohd ridzwan yaakub, muhammad iqbal abu latiffi, erwan basiron, muhammad nizam ilias. (2025). artificial neural networks analysis for predicting gold diffusion in solder joints under various rework and thermal cycling. - proceedings of the green materials and electronic packaging interconnect technology symposium. 10 - 17.
ahmad zarif azahar, maria abu bakar, azman jalar. (2025). a comparative study of mechanical properties in gold with different purity wire bonding . - proceedings of the green materials and electronic packaging interconnect technology symposium. 3 - 9.
sazan a. k. mohammed; abdul h. a. rahman; maria a. bakar; mohd z. a razak. (2024). an efficient intersection over union algorithm with angle orientation for an improved 3d object detection. - 2024 ieee international conference on artificial intelligence in engineering and technology (iicaiet). 312 - 316.
azman jalar, maria abu bakar, atiqah mohd afdzaluddin, abdul aziz omar. (2025). preliminary microgap formation on leadframe mold compound interface of encapsulated electronic components subjected to flood colloidal nanoparticles. - . 273 - 286.
maria abu bakar, wan yusmawati wan yusoff. (2025). pempakejan transistor. - . 132 - 168.
maria abu bakar, azman jalar, muhammad azmi abdul hamid. (2025). teknologi transistor. - . 27 - 61.
m.a. bakar, a. jalar, a. atiqah, n. ismail. (2022). significance of intermetallic compound (imc) layer to the reliability of a solder joint, methods of imc layer thickness measurements. - . 239-263.
a atiqah, a. jalar, m.a. bakar, n. ismail. (2022). advancement of printed circuit board (pcb) surface finishes in controlling the intermetallic compound (imc) growth in solder joints. - . 217-238.
maria abu bakar, wan yusmawati wan yusoff. (2025). pempakejan transistor. - . 132 - 168.
maria abu bakar, azman jalar, muhammad azmi abdul hamid. (2025). teknologi transistor. - . 27 - 61.
maria abu bakar, azman jalar, muhammad azmi abdul hamid. (2025). teknologi transistor: prinsip, pempakejan dan praktis. - . .
maria abu bakar, azman jalar, fakhrozi che ani. (2023). pematerian gelombang pin menerusi lubang. - . 191.
azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar. (2023). corrosion prevention mechanism for automotive semiconductor devices packaging via de-sulphuring process. - . .
azman bin jalar @ jalil;maria binti abu bakar. (2024). development of high reliability and high performance of interconnection technology and materials in electronic packaging. - . .
atiqah binti mohd afdzaluddin;azman bin jalar @ jalil;maria binti abu bakar;lim kar keng. (2024). study on fiber treatment process of oil-palm based nanocellulose reinforced thermoplastic polyurethane for plastic encapsulation of biomedical sensor devices. - . .
maria binti abu bakar;azman bin jalar @ jalil;siow kim shyong;ahmad ghadafi bin ismail. (2023). development of high ductility metallurgical interconnection in sn-based lead-free solder joint via superplastic-like approach. - . .
azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar. (2023). corrosion prevention mechanism for automotive semiconductor devices packaging via de-sulphuring process. - . .
azman bin jalar @ jalil;norinsan kamil bin othman;maria binti abu bakar. (2022). microstructural characterization of copper wire bonding in semiconductor packaging. - . .
| Geran / Grant | Kolaborator / Collaborator | Status |
|---|---|---|
| CHARACTERIZATION OF STRUCTURE-PROPERTIES-PERFORMANCE FOR SEMICONDUCTOR PACKAGING AND ASSEMBLY | sandisk storage malaysia sdn bhd | 59.6% (2023-12-01 sehingga 2026-11-30) |
| KAKISAN INSFRASTRUKTUR KELULI KARBON DISEBABKAN OLEH PERUBAHAN IKLIM DALAM PERSEKITARAN MARIN | dnv malaysia sdn bhd | 43.5% (2024-11-01 sehingga 2026-10-31) |
| IMPROVEMENT OF SOLDER JOINT STRENGTH VIA GROOVING FOR FINE-PITCH INTERCONNECTION IN MULTI-CHIP MODULE PACKAGE | vcam international sdn bhd | 43.5% (2024-11-01 sehingga 2026-10-31) |